Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.

Peltier cooling of superconducting electronics

Abstract: The increase of the superconducting transition temperature in some of the cuprate superconductors to values higher than 130 K is generating strong interest in the exploration of Peltier cooling for the operation of superconducting electronics. In this case, we need materials with a sufficiently large figure of merit z down to temperatures near 100 K. We have performed measurements of the Seebeck coefficient, the thermal conductivity and the electric resistivity in the temperature range 80-300 K of Bi/sub 2/Te/sub 3/-based materials with admixtures of Sb and Se, and studied the influence of pulverization and sintering. The resulting z-values are reported. The influence of sintering on the microstructure of the samples has been studied by SEM.

Experimental Investigation Thermal Performance of Loop Heat Pipe Operating with Different Working Fluids

Abstract: Nowadays, due to the tremendous development of data centers (DCs), studying the effective cooling methods that can face to the challenges such as the high power or heat flux dissipation and the efficient electricity consumption in DCs has never been unnecessary. Loop heat pipe (LHP), a two-phase heat transfer device, is being considered as one of the potential solutions for the above problems. This paper introduces the experimental study on the thermal performances of LHP functioning under gravity assisted condition with different working fluids that are water and ethanol (C2H5OH). This LHP has the flat-rectangular evaporator with the stainless-steel (SS) sintering wick installed inside. The results demonstrate that under the same condenser cooling condition, water LHP performed better than ethanol LHP. In the case of water LHP, when heating power was increased from 33 to 535 W, the temperature at the top surface of the heating block raised from 38oC to 110oC. With the ethanol LHP, this temperature reached 133oC at the heating power of 395 W. If temperature limitation of microprocessors functioning inside the DCs is recognized at 85oC, the cooling capabilities of LHP are 220 W and 350 W corresponding to the working fluid are ethanol and water respectively. In addition, the discussions about the difference in boiling heating transfer characteristics as well as condenser performances between water LHP and ethanol LHP are also presented in this study.

Reliability study on high thermally conductive graphene film as heat spreader in electronics cooling applications

Abstract: Graphene films (GFs) were fabricated and can be applied for dissipating heat from electronics such as portable electronics, laptops, light emitting diodes (LEDs) and other power electronics. These GFs are capable of transporting heat from electronic components. Due to its high thermal conductivity, these GFs are capable to transfer the heat efficiently from electronic component to the heat spreader or heat sink. The cooling failure of the GFs may lead to irreversible damage to the electronic system, hence it is necessary to investigate the long-term reliability of the film under certain harsh conditions. To evaluate the reliability of the GFs, the thermal cycles and moisture test are performed. The effect of temperature cycling (500 cycle) is tested by using an environmental oven with extreme temperatures. The effect of moisture penetration of the GFs is tested for 1024 hours. The thermal conductivity after these two test conditions does not change too much comparing to material before subjecting to test. The electrical conductivity value under the temperature cycling declined by 30% after 500 cycles and that of moisture test was improved by 20%. The result shows that the thermal conductivity of the GFs is quite stable under temperature cycle (500 cycles) and moisture test (1024 hours).

Gas flow systems for an additive manufacturing machine

Abstract: An additive manufacturing machine (900) includes a plurality of subsystems, such as a condensate evacuation subsystem (940) for removing byproducts of the additive manufacturing products near a powder bed, a closed loop subsystem (960) for cleaning contaminants from sensitive machine components (964), and/or an electronics cooling subsystem (984) for cooling an electronics compartment (980). Each subsystem (940, 960, 984) may include a dedicated gas circulation loop (942, 966, 986) that is operably coupled to a gas circulation device (944, 968, 988) for urging a clean flow of gas (946, 962, 990) to each of the subsystems (940, 960, 984) to perform a particular function.

Stainless steel foam as wick material in heat pipe for electronics cooling application

Abstract: In this preliminary investigation, we analyzed the possibility using a stainless steel foam as a wick material in heat pipe. The heat pipe will be used as a passive cooling sytem in electronic devices. Stainless steel foam that used in the current investigation is a commercial foam that has been treated to be characterized using SEM and 3D optical microscope. Analytical models were also developed to calculate the capillary pressure and effective thermal conductivity of the stainless steel foam. The analytical model revealed that the optimum stainless steel foam to be used as wick material is found at the pore size, porosity and contact angle of 30 μm, 0.1 and 0°, respectively.