Topic
Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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TL;DR: An experimental investigation of the transient response of the vapor compression refrigeration (VCR) system to rapid change in evaporator (simulated electronics) heat load is presented in this paper, which shows that the VCR system maintains the junction temperature of the simulated electronics at a much lower temperature compared to conventional air-cooling systems.
48 citations
TL;DR: In this paper, a liquid CPU cooler was designed and tested with the aim to achieve a cooling capacity of 200 W for a surface area of 8.24 cm2, commensurate with the integrated heat spreader dimensions of an Intel® Pentium® 4 Processor.
48 citations
TL;DR: In this article, a tree-like structure heat sink was proposed to improve the thermal performance of a phase change material (PCM)-based heat sink, which was fabricated by selective laser melting (SLM), a metal additive manufacturing (AM) technique.
47 citations
TL;DR: In this article, a novel cold plate for cooling of the electronic components with high heat flux and high heat dissipation requirements is proposed, where the cold-plate structure of the S-type with guide plates is introduced to avoid the heat hot concentration and increase the heat transfer area.
47 citations
07 Feb 1995
TL;DR: In this paper, the authors provide a perspective and review of the evolution of high performance cooling technology that has been developed and used in IBM medium and large scale computers over the past 25 years.
Abstract: This paper provides a perspective and review of the evolution of high performance cooling technology that has been developed and used in IBM medium and large-scale computers over the past 25 years. Package cooling technology and its evolution, leading to the development of the thermal conduction module (TCM) is described. The development of air cooling technology is discussed; along with enhancements using turbulators, air-to liquid heat exchangers, and impinging flow. The development of water cooling and direct liquid immersion technology is also covered.
47 citations