Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.

Report for 2011 URCO Funded Experiment: Development of Optimal Bubble-Seeding Microheaters to Study Nucleate Boiling Heat Transfer in Microgravity

Abstract: Nucleate Boiling is a known means of efficient heat transfer, enabling high levels of heat flux. The potential application of this mode of boiling to electronics cooling motivates its study both in terrestrial systems and in microgravity. This work describes a study of nucleate boiling on thin wires of varying geometries in microgravity, and the function and testing of a microelectronics cooling system utilizing nucleate boiling. Conditions were found for the onset of nucleate boiling and for burnout of the wires. Testing of the current design of the cooling system is ongoing, and the current results and design are

Numerical and Experimental Investigations of JetImpingement on a Periodically Oscillating-Heated FlatPlate

Abstract: In the present paper, the impingement of air jet on a heated flat platesubjected to a periodic oscillation is numerically and experimentally investigated.The motivation of the present research is the desire to enhance the heat transfercharacteristics during the cooling process of a heated flat plate which can be foundin many relevance industrial applications. In order to improve the heat transfercharacteristics, a novel idea is utilized, where a periodical oscillation movementin form of sine wave produced from a Scotch yoke mechanism is applied to theheated flat plate. The obtained numerical results showed a good agreement withthe performed experimental measurements. Moreover, an increase of the Nusseltnumber is obtained from an oscillated plate in comparison with that obtained froma fixed plate. This reveals the enhancement of the heat transfer characteristics of aheated flat plate as a result of the applied periodic oscillation movement.Keywords: Numerical simulation, Experimental measurements, Jet impingement,heat transfer, periodically oscillating flat plate, turbulence modeling.1 IntroductionRecently, the technology of jet impingement cooling of heated surfaces has re-ceived a great attention due its heat transfer effectiveness in many industrial andengineering applications, such as: cooling of photovoltaic cells [Royne and Dey(2004)], electronics cooling [Narumanchi, et al. (2003)], steel making process[Viskanta and Incropera (1990)], cooling of gas turbine blades [Liu and Feng (2011)],and even in food-processing operations [Sarkar, et al. (2006)]. Consequently, ex-tensive researches have been carried out over several decades to explore the thermo-

Air Cooling Technologies For Electronic Equipment [Book Reviews]

Abstract: High temperature electronics (HTE) may be a small part of the world’s largest industry but it is undoubtedly becoming very significant in a number of strategic sectors, such as well logging, aerospace, and automotive. There is a demand for electronic systems that are capable of operating at temperatures well in excess of today’s conventional design limitation of 125 C. This limit is hindering the development of distributed control systems for aircraft and automobiles, smart sensors and remote actuators. Without HTE the cost of monitoring hot environments is greatly increased both in direct costs (e.g., increased complexity and use of cabling) but also in indirect costs such as increased weight (e.g., cooling systems) and decreased reliability. This book is the first text book to bring together all aspects of HTE and address the whole electronic system not just the semiconductor or their application. High Temperature Electronics is split into nine chapters moving from an overview through the selection and use of silicon devices, wide band gap semiconductors, and passive components to all aspects of packaging and thermal management, ending with chapters on the application and the thorny issue of testing at extremely elevated temperatures. The list of contributors is impressive. However, the volume lacks unity. There is a mix of styles which make reading the text from chapter to chapter somewhat disjointed. There is also an annoying change in the presentation of figures from chapter to chapter. Nevertheless this should not deter the reader since there is a wealth of information in this text that would be difficult to find elsewhere. Most collated texts on HTE are either conference proceedings or reviews of specific areas (e.g., semiconductors or markets). High Temperature Electronicspresents the complete HTE technology in one volume that should prove a valuable asset to any graduate embarking on their advanced studies or design engineer confronted with HTE for the first time. Indeed it should prove valuable to those already working in the field as an important reference work, with an excellent index and well referenced chapters. Perhaps the most important sections of High Temperature Electronics are those chapters dealing with the passive devices, packaging and testing. One can argue that the semiconductors are no longer the limiting factor for the exploitation of electronics at high temperatures (95% of HTE will be silicon based) rather that the packaging and passive components are now limiting, not necessarily the operating temperature (since most HTE applications are confined to temperatures of less than 200 C) but the system reliability and operating lifetime at these elevated temperatures. Also, once an operating regime of 200 C or higher is set how does one go about testing to prove lifetimes and product reliability? Not easy! High Temperatures Electronics at least begins to address these issues and points to potential ways forward. High Temperature Electronics i an important

Thermal peformance of miniature loop heat pipe operating under different heating modes

Abstract: In the new generation microprocessors, it is observed that the power density over the active surface can vary from uniform to non uniform modes depending on the clock speed and the processing load on the chipset. The latter mode of operation can result in hot spots on the microprocessors that can result in the increase of the local temperature above the permissible limit and ultimately in the failure of the electronic device. In order to propose a solution for this problem a miniature loop heat pipe (mLHP) with the flat disk shaped evaporator, 30 mm in diameter and 10 mm thick, was developed. The proposed mLHP was tested under uniformly as well as non-uniformly heating mode. In the uniform heating, the entire active area of the evaporator was heated while in the non-uniform mode only 14% of the evaporator active area was heated locally. The thermal performance of the mLHP under these heating modes was compared on the basis of the evaporator wall temperature and thermal resistance between different loop components. The results of the experiment help to classify mLHP as the viable thermal solution for the cooling of microprocessors with local hot spots and non-uniform heating patterns