Topic
Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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01 Jan 2020
TL;DR: In this article, a novel heat sink with graphene-aluminum based plate fins was investigated by numerical simulations, where single or multilayer graphene was grown on the surface of aluminum to create fins of the sink.
Abstract: In this paper, a novel heat sink with graphene-aluminum based plate fins was investigated by numerical simulations. Single or multilayer graphene was grown on the surface of aluminum to create fins of the sink. The novel heat sinks offered better heat conduction, and their large surface areas increased the dissipation of the heat outside the structure. Heat and fluid flow in fin channels of different materials, involving Aluminum, Copper, and Pyrolytic Graphite, were studied to observe the effects of thermal conductivity on convective heat transfer in laminar internal flows. The results of the models were compared with that of the novel heat sink with graphene-aluminum based fins. Different optimization techniques have been explored in literature to arrive at optimal designs of the novel heat sink. A parametric analysis has been conducted to investigate the effect of the fin’s parameters. Numerical simulation of the novel sink shows that a high thermal conductivity can be achieved in comparison with those of heat sinks with aluminum or copper fins. A reduction in maximum temperature by 10.4% and an increase in specific heat by 43.4% were obtained in the optimum case, which makes the novel heat sink with graphene-aluminum based Fins a good candidate as a heat transfer.
TL;DR: In this article, a miniature capillary pumped loop (MCPL) is proposed for electronics cooling, which consists of an evaporator, condenser, vapor and liquid line to dissipate heat by boiling and condensation of working fluids.
Abstract: Considering two characteristics of compact heat dissipation room and high heat flux, a novel miniature capillary pumped loop (MCPL) for electronics cooling was proposed. MCPL consists of evaporator, condenser, vapor and liquid line dissipates heat by boiling and condensation of working fluids with no extra power consumption. Working fluid circulation is ensured by vapor pressure and capillary head. Saturated wick screens vapor and liquid, and ensures one-way flow of working fluid with no extra valve. In order to promote heat dissipation capacity of MCPL, the intensified boiling and condensation structures are embedded into evaporator and condenser respectively, which are useful to increasing boiling and condensation efficiency. Startup and run characteristics are tested by experiments in the condition of different power inputs and working fluids. MCPL is capable of dissipating 80 W of thermal energy and keeping the bottom substrate temperature of evaporator at 80 °C.
Journal Article•
Patent•
12 Jun 2013
TL;DR: In this paper, a cooling system for an industrial truck, particularly a fork lift truck, is described, where an internal combustion engine and a power electronics unit are connected by a compensating reservoir.
Abstract: A cooling system is for an industrial truck, particularly a fork lift truck (2, figure 1), having an internal combustion engine 10 and a power electronics unit 16. The cooling system comprises: an engine cooling circuit 33; an electronics cooling circuit 41; and a compensating reservoir 37 for a coolant. A suction feed connection 38 of the compensating reservoir is connected with an engine suction feed line 39 of the engine cooling circuit and with an electronics cooling circuit feed line 43 of the electronics cooling circuit. The reservoir is further connected with the engine and electronics cooling circuits by one or more engine cooling circuit vent lines 40 and one or more electronics cooling circuit vent lines 44, respectively. A throttling device is arranged in at least one of the engine or electronics suction feed lines or the engine or electronics vent lines to limit the volume of flow of coolant. Ideally, the throttling device comprises an orifice plate 45 having a reduced line cross-section. The combustion engine may drive a generator (12, figure 1) feeding a direct current voltage circuit to drive an electronic propulsion motor (13, figure 1) of a fork lift truck.
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TL;DR: In this article , the most popular electronic cooling technologies, which are classed as direct and indirect cooling, are examined and described in depth, and the best prevalent methods of indirect cooling by employing heat pipes, microchannels, PCM are discussed.
Abstract: Through the ongoing downsizing and fast growth of heat flow of electronic components, cooling concerns are confronting severe tasks. This chapter examines the recent advancements and modernization in the cooling of electronics. The most popular electronic cooling technologies, which are classed as direct and indirect cooling, are examined and described in depth. The best prevalent methods of indirect cooling by employing heat pipes, microchannels, PCM are discussed. The efficiency of cooling strategies for various levels of electronic cooling requirements, as well as approaches to increase heat transfer capabilities, are also discussed in depth. Meanwhile, by considering the intrinsic thermal characteristics, optimization approaches, and pertinent uses, the advantages and disadvantages of various thermal management systems are examined. Furthermore, the present issues of electronic cooling and thermal management technologies are discussed as well as the prospects for future advancements.