Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.

High-performance electronics cooling system

Abstract: A cooling system for an electronic circuit package is provided. The cooling system includes a heat transfer plate positioned in thermal contact with an electronic circuit package surface and forming the bottom surface of an evaporative region of the cooling system. The cooling system also includes a plurality of condensing tubes in fluid communication with, and extending away from, the evaporative region, such that the evaporative region and the condensing tubes together form a single, uninterrupted, sealed enclosure. The cooling system also includes a fluid within the sealed enclosure. The cooling system also includes a plurality of spacers filling gaps between the heat transfer plate and the condensing tubes, such that each spacer is configured as an independent component to allow the passage of fluid through the interior space of each spacer. The cooling system also includes a plurality of wicks, where each wick is positioned partially within a corresponding spacer to which it is fluidically coupled.

Design Optimization of Electrostatically Actuated Minature Compressors for Electronics Cooling

Abstract: This paper presents a feasibility study of using electrostatically actuated diaphragm compressors for use in a miniature scale refrigeration system for electronics cooling. An experimentally validated analytical model for the diaphragm compressor has already been developed. The dimensions for the diaphragm compressor are selected based on an analytical optimization theory developed in this paper. Based on the diaphragm compressor analysis, the pressure rise and volume flow rate required for cooling of modern electronics may not be achieved using a single compressor unit because of the material property limitations. Hence, a 3-D array of the compressor has been proposed for satisfying the pressure rise and the volume flow rate requirements. It is shown that with this array, it is theoretically possible for the compressor to fulfill the cooling requirements and yet fit within the size restrictions set by the electronics cooling industry.

Numerical Investigation on Heat Sink Material for Temperature Control of Electronics

Abstract: This article reports a numerical investigation on advanced heat sink material for thermal management of electronics. We investigated heat transfer enhancement using different heat sink materials. The cooling medium used for analysis is water. Forced water convection in copper alloy and aluminum alloy Al6060, Al6063 material micro-channel heat sinks cooling was studied numerically using Ansys Fluent. The heat sink is an essential element in a PC. The total efficiency, price, and size of the electronic device depend on the heat sink material. The heat transfer rate is a direct function of heat sink material. The simulation used three different velocities, 3, 5, and 7 m/s; the constant heat flux value taken is 8 × 105 W/m2. The parameters considered for heat sink material are thermal conductivity, thermal expansion coefficient, density, and cost. The ceramic materials have a low thermal expansion coefficient and higher thermal conductivity hence used as a substrate. Results show that aluminum alloys are suitable materials for heat sinks because of their cost, weight, and ease of machinability.