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Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.


Papers
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Journal ArticleDOI
TL;DR: In this article, a ground-based experimental investigation of the gas-atomized spray cooling using various micro-structured surfaces and a flat surface is provided and discussed, and a cooling correlation of gas-atomic spray cooling upon micro-structure surfaces is provided with a relative error within ±9%.

47 citations

Journal ArticleDOI
TL;DR: In this paper, the authors evaluated three comparable systems for electronics cooling, including heat pipe (HP, passive system), thermoelectric (TE), and vapour compression refrigeration (VCR) systems (active systems).

46 citations

Journal ArticleDOI
Richard C. Chu1
TL;DR: In this paper, a summary of IBM sponsored research spanning a period of 25 years at 12 universities on a wide range of topics related to electronic cooling technology is presented, including the challenges we are currently facing and an attempt is made to forecast the challenges that will confront the cooling community in the near and distant future.
Abstract: This paper represents my personal recapitualation of my 4 decades of continuous involvement in all phases of electronic cooling, from conceptual design, through engineering development to product implementation. The cooling designs that we applied successfully in the past are reviewed chronologically. The challenges we are currently facing are also discussed and an attempt is made to forecast the challenges that will confront the electronics cooling community in the near and distant future. The paper includes a summary of IBM sponsored research spanning a period of 25 years at 12 universities on a wide range of topics related to electronic cooling technology.Copyright © 2003 by ASME

46 citations

Journal ArticleDOI
TL;DR: In this article, a review of metal oxide nanofluid fabrication, stability and surfactants for loop heat pipe (LHP) for electronic cooling is presented, and a comparison between HP and LHP is discussed.
Abstract: Loop heat pipe (LHP) has gained significant interest, particularly in the field of cooling electronics, and has been considered as an efficient heat transfer device in today’s electronic technologies. LHP is preferred over conventional heat pipes (HP) due to the high efficiency, high heat flux capability, ability to transfer energy over long distances and ability to operate over a range of environments. Brief comparisons between HP and LHP for electronic cooling are discussed. For the past 10 years, numerous studies have reported on the synthesis of nanofluids used in LHP for cooling electronics. Nanofluids have been widely used in electronic applications due to their superior heat transfer and thermal properties. The nanofluid fabrication, stability and surfactants are reviewed. Recent works on metal oxide nanofluids and properties that influence the thermophysical properties of nanofluids, such as thermal conductivity, viscosity and surface tension, are also reported. Another intention behind this review is to explain the challenges of metal oxide nanofluids in electronics cooling.

46 citations

Proceedings ArticleDOI
11 Aug 1996
TL;DR: In this article, the authors address important aircraft subsystem WBG electronics applications, the temperature range in which electronics will be expected to operate if they are to be uncooled, and a description of WBG-HTE components desired for use in future MEA electronic systems.
Abstract: Developments in solid-state electronics have provided the United States Air Force with the most sophisticated and capable avionics systems in the world. Steady advancements in solid-state devices and integrated circuits have enabled modern electronic warfare, navigation, and flight and propulsion control electronics. Wide-bandgap (WBG) electronic devices are capable of operating at high temperature and high efficiencies, thus reducing the amount of heat dissipated by the electronics, thus enabling a reduction in, or elimination of, existing heavy, single-redundant distributed aircraft electronics cooling systems. Consequently, WBG high-temperature electronics (HTE) are expected to play an enabling and vital role in the design of the future concept More Electric Aircraft (MEA). The system-level benefits of employing WBG-HTE in the MEA include a reduction in flight control system weight and improved reliability; a reduction in size and weight, or elimination of, the environmental control system (ECS) required to cool management and distribution (PMAD) and flight electronics; a reduction in engine control system weight and increased reliability using a distributed processing architecture; and the improved reliability and maintainability of stores management system (SMS) avionics. The paper address important aircraft subsystem WBG electronics applications, the temperature range in which electronics will be expected to operate if they are to be un-cooled, and a description of WBG-HTE components desired for use in future MEA electronic systems.

46 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202323
202255
202172
202045
201952
201849