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Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.


Papers
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Journal ArticleDOI
TL;DR: In contrast to pool boiling, flow boiling heat transfer is a more applied mode of heat transfer and has been most widely used in high heat flux cooling systems as mentioned in this paper, and there are two general approaches for improving Flow Boiling heat transfer: active and passive methods.

37 citations

Patent
28 Feb 2011
TL;DR: In this article, an improved aircraft electronics cooling system for an aircraft having a liquid cooling system, the aircraft electronic cooling system providing a thermal coupling between an electronic device to be cooled and the liquid cooling systems of the aircraft.
Abstract: The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system, the aircraft electronics cooling system providing a thermal coupling between an electronic device to be cooled and the liquid cooling system of the aircraft. A coolant delivered by the liquid cooling system may flow through a board of the electronic device, through a heat sink on which the electronic device is arranged and/or through a housing in which the electronic device is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device.

37 citations

Journal ArticleDOI
TL;DR: In this paper, analytical equations are presented considering the cost of operation for a pin-fin array, and the solution of these equations would give the optimum fin diameter and length that result in a fin array with minimum operational cost.

37 citations

Journal ArticleDOI
TL;DR: In this article, the authors investigated the use of microchannels with/without loops for cooling process of a square electronic component with internal heat generation via convection using the constructal theory.

37 citations

Proceedings ArticleDOI
K. Azar1, R.S. McLeod1, R.E. Caron1
03 Feb 1992
TL;DR: In this paper, the authors show the results of narrow channel heat sinks used for cooling of high powered components and discuss the optimization of the heat sink in terms of the controlling parameters and fabrication.
Abstract: The authors show the results of narrow channel heat sinks used for cooling of high powered components. The results of the experimental simulation for various air delivery methods are reported. The results show the difference in the thermal performance of the heat sink with top clearance versus ducted systems. In addition, effects of component layout power variation and air velocity are shown. A discussion highlighting the optimization of the heat sink in terms of the controlling parameters and fabrication is also presented. >

37 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202323
202255
202172
202045
201952
201849