Topic
Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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TL;DR: In this paper, the authors investigated the use of thermoelectric (TE) devices for thermal management of downhole electronics, where a finned copper rod in contact with hot side of TE device was used to reject the heat out to the ambient.
Abstract: This paper investigates the use of thermoelectric (TE) devices for thermal management of downhole electronics. The research carried out will help in the mitigation of costs associated with thermal damage of downhole electronics used in oil drilling industry. An experimental set up was prepared where a TE device was used in conjunction with heat exchanger and a cold plate to remove heat from electronics module. A finned copper rod in contact with hot side of TE device was used to reject the heat out to the ambient. The experimental set up was housed inside a cylindrical vacuum flask, which was in turn placed inside an oven to simulate thermally harsh downhole conditions. Experiments were carried out with electronics heat dissipation of 0–8 W and ambient temperature of 140 °C. Due to the differences in the environmental conditions of the laboratory and the practical downhole scenario, the experiment could not completely capture the conditions of downhole heat rejection. A mathematical model of the experimental apparatus was prepared and validated against the experimental results. The model was used to predict performance of a TE device for thermal management of downhole electronics at an ambient temperature of 200–250 °C. It was observed that the ability of the thermal management system to keep electronics cool varied from 30 °C to a few degrees below the surrounding temperature, for chip wattage varying from 0 W to 8 W, respectively.
35 citations
TL;DR: In this article, interconnected microchannels with reentrant cavities (IMRCs) were developed by using facile and effective microfabrication methods to enhance the pool boiling performance in industrial applications for high heat-flux electronics cooling.
34 citations
TL;DR: In this paper, a novel configuration for chip-scale thermoelectric (TE) generation of electric power from microprocessor waste heat is described, modeled, and parametrically analyzed.
Abstract: A novel ldquoshunt attachrdquo configuration for chip-scale thermoelectric (TE) generation of electric power from microprocessor waste heat is described, modeled, and parametrically analyzed. The generated electricity is used to drive a cooling fan that convectively cools the chip. A prototype using heat-driven cooling through off-the-shelf TE modules and a low-voltage fan was built and successfully applied to the thermal management of a high-power mobile processor in a portable equipment form factor.
34 citations
TL;DR: In this paper, a two-phase heat spreader based on a flat confined thermosyphon was proposed for electronics cooling applications, and the effects of heat input, filling ratio, inclination, and saturation temperature were studied.
34 citations