Topic
Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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TL;DR: In this article, a cooling flat surface is cooled by an air jet impinged at an inclination of 15-75° to the target plate, and a series of experiments are performed with different configurations of inclined jets on hot surface.
30 citations
01 Jan 2008
TL;DR: In this paper, the authors describe performance measurements on a prototype miniature rotary compressor with refrigerant R134a using a compressor load stand based on a hot-gas bypass design.
Abstract: This paper describes performance measurements on a prototype miniature rotary compressor with refrigerant R134a using a compressor load stand based on a hot-gas bypass design. The hermetically sealed rolling piston compressor runs on a 24 V DC power supply. Because of its small size and compact form factor, it can potentially be used in a miniature vapor compression refrigeration system for electronics cooling applications. Compressor tests are conducted for varying suction pressures, pressure ratios, and rotational speeds. For each test, the refrigerant mass flow rate, electrical power consumption, and the suction and discharge temperature and pressure are recorded, at a suction superheat of 5 K. Using the experimental data, the compressor volumetric and overall isentropic efficiencies are calculated. Also, by assuming a subcooling of 5 K in the condenser, a hypothetical cooling capacity of the system and the corresponding COP are calculated. The volumetric efficiency ranges from 73% to 90% and the overall isentropic efficiency varies from 44% to 70% for pressure ratios between 2 and 3.5. For this range of pressure ratios, the estimated cooling capacity and the COP vary from 163 W to 489 W and 2.1 to 7.4, respectively.
30 citations
TL;DR: In this article, an improved linear compressor design is proposed for an electronics cooling application, with a predicted cooling capacity of 200 W a cylindrical compressor package size of diameter 50.3 mm and length 102 mm.
Abstract: A comprehensive model of a linear compressor for electronics cooling was previously presented by Bradshaw et al. (2011). The current study expands upon this work by first developing methods for predicting the resonant frequency of a linear compressor and for controlling its piston stroke. Key parameters governing compressor performance – leakage gap, eccentricity, and piston geometry – are explored using a sensitivity analysis. It is demonstrated that for optimum performance, the leakage gap and frictional parameters should be minimized. In addition, the ratio of piston stroke to diameter should not exceed a value of one to minimize friction and leakage losses, but should be large enough to preclude the need for an oversized motor. An improved linear compressor design is proposed for an electronics cooling application, with a predicted cooling capacity of 200 W a cylindrical compressor package size of diameter 50.3 mm and length 102 mm.
30 citations
12 Mar 2002
TL;DR: In this article, experimental data obtained on two innovative loop thermosyphons with capillary structures that are prime candidates for electronics cooling solutions to replace typical air-cooled systems, where commercially available heat pipes cannot be used due to the high power and transport length limitations.
Abstract: Recent innovations to loop thermosyphon (LTS) design are anticipated to have a significant impact on electronics thermal solutions. Future electronics systems including high-density desktop computers, multi-processor rack mounted servers, and telecommunications cabinets are reaching volumetric thermal densities beyond the limits of direct air-cooling. Therefore, alternative cooling solutions need to be developed, for example, using loop thermosyphons. This paper presents experimental data obtained on two innovative loop thermosyphons with capillary structures that are prime candidates for electronics cooling solutions to replace typical air-cooled systems, where commercially available heat pipes cannot be used due to the high power and transport length limitations. The performance characteristics of the two loop thermosyphons with capillary structures are discussed: (a) with a horizontal square U-tube evaporator and (b) with horizontal transport lines and a flat evaporator heated from both sides.
30 citations
TL;DR: In this paper, a thermal ground plane, flat heat pipe (30 cm × 7.6 cm × 4.5 cm) was developed as a passive heat spreading component for electronics cooling.
30 citations