Topic
Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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TL;DR: In this article, the heat transfer performance of liquid-cooled heat sinks with a constructal design of the flow field configurations is assessed in order to propose an alternative cooling layer for integrated circuits.
30 citations
TL;DR: In this article, the melting process in a horizontal heat sink for different configurations of plate fins was evaluated and the trend of melting process, temperature distribution and the temperature variation of the heat sink base plate were studied for different fins numbers, fins heights and fins thicknesses.
30 citations
28 May 2008
TL;DR: In this article, the authors provide a complete set of models/correlations that are required for designing an optimum spray cooling system and a new user-friendly CHF correlation is recommended which shows excellent predictive capability for the entire database.
Abstract: Recent studies provide ample evidence of the effectiveness of two-phase spray cooling at dissipating large heat fluxes from electronic devices. However, those same studies point to the difficulty predicting spray performance, given the large number of parameters that influence spray behavior. This paper provides a complete set of models/correlations that are required for designing an optimum spray cooling system. Several coolants (water, FC-72, FC-77, FC-87 and PF-5052) are used to generate a comprehensive spray-cooling database for different nozzles, flow rates, subcoolings, and orientations. High-speed video motion analysis is used to enhance the understanding of droplet formation and impact on the device's surface, especially near the critical heat flux (CHF) point. A previous CHF correlation for normal sprays is modified for both inclination and subcooling effects. A new user-friendly CHF correlation is recommended which shows excellent predictive capability for the entire database. Also discussed in this paper is a new theoretical scheme for assessing the influence of spray overlap on cooling performance.
29 citations
Patent•
30 May 2006TL;DR: In this article, a micropump including one or more micro-channels for receiving a fluid and a plurality of electrodes arranged on a diaphragm and energized in a manner to provide an enhanced electrohydrodynamic flow of fluid through the one or multiple microchannels is described.
Abstract: A micropump including one or more microchannels for receiving a fluid and a plurality of electrodes arranged on a diaphragm and energized in a manner to provide an enhanced electrohydrodynamic flow of fluid through the one or more microchannels. The micropump may be used for pumping a working fluid for removing heat from a heat-generating electronic component or for delivery of a drug, medicine, or other treatment agent as or in a fluid to a patient.
29 citations
TL;DR: This work explores the feasibility of combining computational fluid dynamics and micro-genetic algorithms to produce optimum shapes for liquid cooled heat sinks represented as bit arrays using an initial bit array geometry developed using a heat flux dependent probability function.
29 citations