Topic
Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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TL;DR: In this paper, the integration of cylindrical microchannels fabricated by direct-write assembly in printed circuit board layouts for a micro heat exchanger application is presented, and the thermal performance of the manufactured prototype is characterized with respect to the fluid flow rate.
Abstract: The electronic industry has a growing need for efficient heat dissipation mechanisms such as micro heat exchanger systems. This active cooling approach requires the integration of microfluidic components near the main heat sources of the electronic devices. Despite the investigation of several micro-cooling configurations, their commercial utilization by the electronic industry is rather limited due to complex fabrication and integration methods. Here, we present the integration of cylindrical microchannels fabricated by direct-write assembly in printed circuit board layouts for a micro heat exchanger application. The thermal performance of the manufactured prototype was characterized with respect to the fluid flow rate. The original fabrication and integration approaches presented here show high potential for efficient, compact, and low-cost micro heat exchangers for the electronic industry.
29 citations
TL;DR: In this paper, a titanium dioxide (TiO2/water) nanofluid (with a volume fraction of 0.1%) is prepared by dispersing nanoparticles in distilled water.
29 citations
20 Mar 2001
TL;DR: In this paper, a biporous heat pipe is proposed to overcome heat transfer crises in the evaporator, which not only increases the heat transfer performance by extended surface and smaller pore sizes, but also increases the capillary force which enables the liquid supply.
Abstract: A biporous heat pipe is proposed to overcome heat transfer crises in the evaporator. The two levels of pore sizes of the biporous heat pipe result in high heat pipe performance. When vaporization phenomena occur in biporous wicks, bubbles formed in the near wall layer easily escape from the porous media and the possibility of vapor blanket layer formation on the heating surface decreases. Evaporation mostly occurs on the smaller surface pores. This not only increases the heat transfer performance by extended surface and smaller pore sizes, but also increases the capillary force which enables the liquid supply. The biporous structure improves the vapor and liquid distribution in the porous media when vaporization phenomena occur in it. Thermal analysis of a solid copper heat spreader and monoporous and biporous heat pipe modules are performed. Compression of the results shows the heat transfer performance of the monoporous and biporous heat pipes are better than the solid copper spreader and the biporous heat pipe has an advantage in the relatively high heat flux range. The biporous heat pipe is very attractive for high power electronic device cooling.
28 citations
TL;DR: In this article, an axial-flux internal rotor type motor for the low-profile vortex pump was developed for the slim notebook applications, which is composed of an internal permanent magnet (PM) disc rotor and double-sided external coreless stators with windings piled up on the printed circuit board.
Abstract: Slim pump for cooling devices play an important role for cooling the electronics apparatus. This paper develops an axial-flux internal rotor type motor for the low-profile vortex pump. The integrated motor-pump structure is composed of an internal permanent magnet (PM) disc rotor and double-sided external coreless stators with windings piled up on the printed circuit board (PCB). The impeller is disposed on the periphery of the magnet and a fluid dynamic bearing (FDB) is set in the centre of the magnet to rotate relative to the centre shaft. A prototype of the axial-flux motor pump and drive circuit has been made and tested. Both simulated and experimental results show that the proposed motor would be an acceptable solution for the slim notebook (NB) applications.
28 citations
03 Feb 1992
TL;DR: In this paper, a liquid cooling system for self-contained heat exchanger units that fit within small movable electronic equipment, such as PCs and workstations, was evaluated.
Abstract: A compact liquid cooling system has been evaluated in a benchmark of self-contained heat exchanger units that fit within small movable electronic equipment, such as PCs and workstations. The compact cooling system connects to a multichip module package via a pair of flexible stainless steel hoses. The system contains a fluid expansion chamber, a liquid-to-air heat exchanger core, a fan, and a pump and can operate entirely sealed. Pressures, package power dissipation, flow rate, and temperatures were recorded. The coolant liquid chosen for use in this system was 3M Fluorinert type FC-72, a chemically inert dielectric liquid. The 5.5 liter prototype system delivers 1.1 liter/min of FC-72. Test results showed the unit can remove up to 274 W of power dissipated with a 52 degrees C temperature difference between inlet liquid and air with a thermal resistance of 0.19 degrees C/W. Design improvements for a second generation system are proposed. >
28 citations