Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.

Dropwise condensation life testing of self assembled monolayers

Abstract: The increasing thermal demand of electronics devices has pushed the limits of current two-phase thermal technologies such as heat pipes and vapor chambers. The most obvious area for thermal improvement is centered around the high heat flux generating chips including improved evaporators, thermal interfaces, etc. However, heat fluxes in the sink/condensing regions have also risen as the size of electronics packages has decreased. One way to reduce the thermal resistance associated with condensation is to promote dropwise condensation. In previous work, the condensation performance improvement using self-assembled monolayer coated surfaces (to promote hydrophobicity) has been shown. However, the question of the life of the self-assembled monolayer coatings needs to be addressed before the technology is adopted, as this has plagued other dropwise condensation coatings in the past. Presented here is a general use of self-assembled monolayer coatings to promote dropwise condensation in electronics device applications, including a summary of recent work regarding dropwise condensation on gradient surfaces. Also presented is experimental data from a life test of selfassembled monolayers on copper and gold plated surfaces. In the life test, the surfaces have been continuously exposed to saturated steam at 60°C. Both surfaces have continued to promote dropwise condensation for over 9 months under conditions representative of heat pipe electronics cooling applications. BACKGROUND

Energy Efficiency of Low Form Factor Cooling Devices

Abstract: With increasing attention to the energy efficiency of consumer and commercial products, thermal engineering and science community is devoting greater effort and attention to the design and implementation of energy-efficient cooling solutions. This study focuses on the cooling potential and Coefficient of Performance, (COP), achievable with three distinct meso-scale cooling technologies, applicable to a wide range of electronics cooling challenges. The thermo-fluid and thermodynamic characteristics of synthetic jets, piezo-driven vibrating blades, and compact muffin fans will be addressed. We are dedicating this paper to Prof. Kakac for his contributions to heat transfer science and technology, developing young scientists, writing highly valuable heat transfer textbooks, and most importantly for his kindness and friendship.Copyright © 2007 by ASME

The Electro-Adsorption Chiller: Performance Rating of a Novel Miniaturized Cooling Cycle for Electronics Cooling

Abstract: The paper describes the successful amalgamation of the thermoelectric and the adsorption cycles into a combined electro-adsorption chiller (EAC). The symbiotic union produces an efficiency or COP (coefficient of performance) more than threefold when compared with their individual cycles. The experiments conducted on the bench-scale prototype show that it can meet high cooling loads, typically 120 W with an evaporator foot print of 25 cm 2 , that is 5 W/cm 2 at the heated surface temperature of 22°C, which is well below that of the room temperature. The COPs of the EAC chiller vary from 0.7 to 0.8, which is comparable to the theoretical maximum of about 1.1 at the same operating conditions. With a copper-foam cladded evaporator, the high cooling rates have been achieved with a low temperature difference. In addition to meeting high cooling rates, the EAC is unique as (i) it has almost no moving parts and hence has silent operation, (ii) it is environmentally friendly as it uses a nonharmful adsorbent (silica gel), and (iii) water is used as the refrigerant.