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Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.


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Journal ArticleDOI
TL;DR: In this article, a microfluidic cooling system for dc-dc power converters is presented. But the authors focus on energy-efficient cooling of converters, where multiple miniaturized microfluidic cold plates are attached to transistors providing local heat extraction.
Abstract: In this article, we describe a new approach for the compact and energy-efficient cooling of converters where multiple miniaturized microfluidic cold plates are attached to transistors providing local heat extraction. The high pressure drop associated with microchannels was minimized by connecting these cold plates in parallel using a compact three-dimensional-printed flow distribution manifold. We present the modeling, design, fabrication, and experimental evaluation of this microfluidic cooling system and provide a design strategy for achieving energy-efficient cooling with minimized pumping power. An integrated cooling system is experimentally demonstrated on a 2.5-kW switched-capacitor dc–dc converter, cooling down 20 GaN transistors. A thermal resistance of 0.2 K/W was measured at a flow rate of 1.2 mL/s and a pressure drop of 20 mbar, enabling the cooling of a total of 300 W of losses in the converter using several milliwatt of pumping power, which can be realized with small micropumps. Experimental results show a tenfold increase in power density compared with the conventional cooling, potentially up to 30 kW/L. This proposed cooling approach offers a new way of coengineering the cooling and the electronics together to achieve more compact and efficient power converters.

23 citations

Journal ArticleDOI
TL;DR: In this paper, a sensor for measuring small convective heat flows (W / cm 2 ) from micro-structured surfaces is designed and tested using both experimental literature data and a computational fluid dynamic (CFD) model.

23 citations

Journal ArticleDOI
TL;DR: This study aims to investigate the micro-channel heat sink with dimples and finds that the heat transfer enhancement in micro- channel heat sink using dimples is useful when the Reynolds number is greater than 125.
Abstract: Problem statement: The power density of electronic devices has been increasing along with the rapid technology development. Cooling off electronic systems is essential in controlling the component temperature and avoiding any hot spot. The micro-devices are now extensively used in electronic application especially for cooling the computer chip. Approach: Micro-channel heat sinks are adopted in electronics cooling together with different technologies to enhance the heat transfer process. To improve the cooling process in heat sink, dimples are used because they are simple and cheap technologies. Therefore, this study aims to investigate the micro-channel heat sink with dimples. Results: The heat transfer enhancement in micro-channel heat sink using dimples is useful when the Reynolds number is greater than 125. Conclusion: The results of this study can help designing micro-channel heat sinks for electronics cooling by employing the concept of dimples.

23 citations

Journal ArticleDOI
TL;DR: In this article, a thermal architecture concept for analysis of thermal problems and solutions existing in electronics systems is presented and the thermal problems are categorized into a total of seven levels from chip to system.
Abstract: This paper presents a thermal architecture concept for analysis of thermal problems and solutions existing in electronics systems. The thermal problems are categorized into a total of seven levels from chip to system. Advanced thermal technologies for addressing the thermal problems at all seven levels are discussed. Integrating the thermal architecture with the electronic architecture can significantly improve the effectiveness of the thermal management.

23 citations

Journal ArticleDOI
TL;DR: In this article, an open-cell metal foam mini-channel evaporator (OMFME) is proposed to enhance heat transfer in electronics cooling, which has nine channels, which are 507 and 1097μm in width and depth, respectively.

23 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202323
202255
202172
202045
201952
201849