Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.

Electronics cooling technique for spacecraft modules

Abstract: A spacecraft avionics module in which integrated circuit chip packages or chips are mounted in direct contact with the surface of a radiator panel, to enhance dissipation of heat from the integrated circuit and to allow electronics to be packed more densely while still dissipating sufficient heat to allow the electronics to operate at a desirable temperature. Conduction of heat from the electronics to the radiator panel is further enhanced by the use of a thermally conductive adhesive disposed between the integrated circuit chip packages or chips and the radiator panel, which may include heatpipes for more uniform heat distribution across the panel.

Thermal management of downhole electronics cooling in oil & gas well logging at high temperature

Abstract: Logging tools are wildly used in deeper oil and gas wells in which the geothermal temperature can be as high as 200 ¼C. However, a majority of the downhole electronic components can only withstand ambient temperature not exceeding 120 ¼C. Therefore, an effective thermal management system is necessary for logging tools. In this paper, a thermal management based on the combination of the vacuum flask and phase change material (PCM) is proposed for enhancing the logging tools' temperature survival time. A framework assembly with test chips made of flat resistive heaters attached on the chassis was fabricated to simulate the real logging tool. The experiment set up was placed inside an oven to achieve the thermally harsh downhole environment. Experiments were conducted with total electronics heat dissipation of 30 W and constant ambient temperature of 200 ¼C. The results show that the proposed thermal management method can effectively reduce the temperature of the electronic components below 120 ¼C for six-hour operating time, which meets the requirement.

The effect of Total flowrate on the cooling performance of swirling coaxial impinging jets

Abstract: Thermal management ability of swirling coaxial confined impinging air jets (SCCIAJ) are experimentally studied for different total flowrate. The coaxial structure of the jet is provided by a nozzle which is a cylindrical material having an inner round flow passage and three circumferential helical flow passages. Experiments are conducted for various values of dimensionless nozzle-to-plate distance (H / D = 0.5, 1.0, 1.5 and 2.0) and total flowrate (40, 50 and 60 LPM (liter per minute)). During the experiments, flowrate ratio (Q*) and heating power are set to constant values of 0.75 and 18.2 W, respectively. It is revealed that both the heat transfer rate and radial uniformity are improved by increasing total flowrate, while increasing spacing between the nozzle outlet and the target plate adversely affects the magnitude of Nusselt numbers. In this context, the condition of Qtot = 60 LPM with H / D = 0.5 presents the optimum case for heat transfer. The results obtained are also compared with the ones of the classical circular jet (Q* = 0) depending on the temperature distribution of the impingement surface. It is concluded that swirling coaxial jets with appreciate working conditions can be used as an effective tool for electronics cooling.

Spray cooling at low system pressure

Abstract: Spray cooling has been shown to be the best cooling technique for applications that require efficient high heat flux removal. This research presents a study of spray cooling at low system pressure that allows control of the surface temperature by controlling the boiling point of the fluid. Such cooling provides an attractive, low-temperature thermal control to industries such as electronics, avionics, lasers, and electro-optics. Experiments were conducted with a 1 cm/sup 2/-heated surface cooled by a spray nozzle at reduced system pressures. System pressures range from 0.015 to 1 bar. The heat transfer coefficient was determined by measuring the surface temperatures at increasing heat fluxes. The present study has shown that spray cooling with water at reduced system pressure can significantly decrease the surface temperature as compared to ambient pressure spray cooling. This study shows that at a pressure of 0.015 bar, the surface temperature can be cooled to 54/spl deg/C with 11/spl deg/C liquid at a heat flux of 380 W/cm/sup 2/, while the surface temperature at 380 W/cm/sup 2/ is about 120/spl deg/C with same liquid temperature at ambient pressure. The heat transfer coefficients measured here were on the order of 100,000 W/m/sup 2//spl middot/K. This study is limited by the heating source, which cannot exceed 400 W/cm/sup 2/. The maximum heat flux that can be removed by spray cooling at low pressure has yet to be determined.