Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.

A Honeycomb Microchannel Cooling System for Microelectronics Cooling

Abstract: A honeycomb porous microchannel cooling system for electronics cooling was proposed in this article. The design, fabrication, and test system configuration of the microchannel heat sink were summarized. Preliminary experimental investigation was conducted to understand the characteristics of heat transfer and cooling performance under steady single-phase flow. In the experiments, a brass microchannel heat sink was attached to a test heater with 8 cm2 area. The experimental results show that the cooling system is able to remove 18.2 W/cm2 of heat flux under 2.4 W pumping power, while the junction wall temperature is 48.3°C at the room temperature of 26°C. Extensive experiments in various operation conditions and parameters for the present cooling system were also conducted. The experimental results show that the present cooling system is able to perform heat dissipation well.

bibliography of liquid cooled heat sinks for thermal enhancement of electronic packages

Abstract: A bibliography of 847 publications dealing with air cooled heat sinks for thermal enhancement of electronic packages is presented. The bibliography also includes papers dealing with design and performance analysis of heat sinks, extended surfaces and adhesives for bonding heat sinks. The papers are classified in several categories.

Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability Design

Abstract: In order to improve electronics packaging design, it is important to evaluate the cooling performance and reliability of the electronics packaging structure of a product. To that end, it is necessary to predict the temperature, deformation, and stress distributions of the package under field conditions. In the case of a packaging structure comprising a flip-chip ball grid array package, a heat spreader, thermal grease, a cooling structure, solder joints, and a motherboard, an increase in the contact thermal resistance may occur, depending on the interface contact condition between the cooling structure and the heat-spreader due to the thermal deformation of the package. Contact thermal resistance problems involve the interactive relationship of the thermal and stress distributions. A coupled thermal-stress analysis, with consideration of the time-space variation of contact thermal resistance, was conducted to duplicate the behavior of temperature, deformation, and stress distributions of a flip-chip ball grid array package under field conditions. It was found that: 1) the average contact thermal resistance across the interface between the heat-spreader and the plate fin, which was predicted by the coupled thermal-stress analysis, increased compared to the average contact thermal resistance in the case of uniform contact pressure, and 2) the contact thermal resistance will vary depending on the deformation mode, such as convex upward and downward, due to heat dissipation under field conditions. In addition, a reliability prediction method for thermal fatigue failure of solder bumps based on coupled thermal-stress analysis and statistical and probabilistic methods was proposed in order to select a suitable packaging solution at an early stage of design. It was found that the sensitivity of uncertain variables and the thermal fatigue life distribution of solder joints could change significantly depending on a combination of factors concerning the failure sites of solder bumps and the boundary conditions of the motherboard.

Low Reynolds number turbulence models for accurate thermal simulations of electronic components

Abstract: The electronics industry and the problems associated with the cooling of microelectronic equipment are developing rapidly. Thermal engineers now find it necessary to consider the complex area of equipment cooling at some level. This continually growing industry also faces heightened pressure from consumers to provide electronic product miniaturization, which in itself increases the demand for accurate thermal management predictions to assure product reliability. Computational fluid dynamics (CFD) is considered a powerful and almost essential tool for the design, development and optimization of engineering applications. CFD is now widely used within the electronics packaging design community to thermally characterize the performance of both the electronic component and system environment. This paper discusses CFD results for a large variety of investigated turbulence models. Comparison against experimental data illustrates the predictive accuracy of currently used models and highlights the growing demand for greater mathematical modelling accuracy with regards to thermal characterization. Also a newly formulated low Reynolds number (i.e. transitional) turbulence model is proposed with emphasis on hybrid techniques.