Topic
Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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15 Mar 2005
TL;DR: In this paper, a numerical study is performed to characterize the thermal and mechanical performances of silicon/water vapor chambers as heat spreaders for electronics cooling applications and to compare their performance against standard Cu heat spreader.
Abstract: A numerical study is performed to characterize the thermal and mechanical performances of silicon/water vapor chambers as heat spreaders for electronics cooling applications and to compare their performance against Cu heat spreaders. 2D flow and energy equations are solved in the vapor and liquid regions, along with conduction in the wall. An equilibrium model for heat transfer and a Brinkman-Forchheimer extended Darcy model for fluid flow are solved in the wick region. In addition to thermal modeling, FEA is also performed to study the impact of the proposed design on die stresses. The study shows that this system can match or thermally perform better than a more standard Cu spreader while also reducing the compressive stress in the Si by as much as 96%. Analysis shows that there are two main factors contributing towards the reduction of stress in the Si die, namely, the better CTE match between the Si die and the Si heat spreader and higher compliance (less stiffness) of the vapor chamber compared to standard heat spreaders. Thus Si vapor chambers provide a good design alternative to a standard Cu heat spreader without compromising on the reliability and performance of the Si.
16 citations
TL;DR: In this article, the authors explored the impact of using discrete electrodes to create the traveling wave on the flow rates generated through numerical modeling and quantified the change in performance from an ideal sinusoidal voltage boundary condition.
Abstract: Traveling-wave electrohydrodynamic (EHD) micropumps can be incorporated into the package of an integrated circuit chip to provide active cooling. They can also be used for fluid delivery in microdevices. The pump operates in the presence of a thermal gradient through the fluid layer such that a gradient in electrical conductivity is established allowing ions to be induced. These ions are driven by a traveling electric field. Such a traveling electric field can be realized in practice only via discrete electrodes upon which the required voltages are imposed. The impact of using discrete electrodes to create the traveling wave on the flow rates generated is explored through numerical modeling. The change in performance from an ideal sinusoidal voltage boundary condition is quantified. The model is used to explore the widths of electrodes and the intervening isolation regions that lead to optimized pumping. The influence of the choice of working fluid on the performance of the pump is determined using an analytical model.
16 citations
01 Jan 2003
TL;DR: In this paper, the authors provide an overview of the research being conducted to understand fluid flow and heat transfer in micro channels and to identify pumping requirements and suitable mechanisms for pumping in microchannels.
Abstract: Microchannel heat sinks are widely regarded as being amongst the most effective heat removal techniques from space-constrained electronic devices. However, the fluid flow and heat transfer in microchannels is not fully understood. The pumping requirements for flow through microchannels are also very high and none of the micropumps in the literature are truly suitable for this application. A wide-ranging research program on microchannel heat sinks and micropumps is underway in the Electronics Cooling Laboratory at Purdue University. This article provides an overview of the research being conducted to understand fluid flow and heat transfer in microchannels and to identify pumping requirements and suitable mechanisms for pumping in microchannels.Copyright © 2003 by ASME
16 citations
Patent•
02 Oct 2008
TL;DR: In this paper, an accumulator collects gaseous and liquid refrigerant passing from the evaporator to the compressor, and then transfers heat from the electronics to the refrigerant located within the accumulator to cool the electronics.
Abstract: A refrigeration system having a compressor, a condenser, an evaporator, an accumulator, and electronics for controlling the compressor. The accumulator collects gaseous and liquid refrigerant passing from the evaporator to the compressor. The electronics are mounted to the accumulator to transfer heat from the electronics to the refrigerant located within the accumulator to cool the electronics.
15 citations
TL;DR: In this article, the thermal and flow measurement of a multiple-orifice synthetic jet involving circular, square, and rectangular orifice shapes was performed using an infrared camera and consta...
Abstract: Present experimental study reports the thermal and flow measurement of multiple-orifice synthetic jet involving circular, square, and rectangular orifice shapes. Here, an infrared camera and consta...
15 citations