Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.

Well logging electronics cooling system

Abstract: Well bore logging apparatus including electrical components cooling apparatus. An operating chamber and a heat sink chamber are incorporated. A heat transfer chamber encloses both operating chamber and heat sink chamber. A wicking material fills a portion of the transfer chamber to be in thermal connection with both operating chamber and heat sink chamber. The heat sink chamber contains a heat sink material. A heat transfer medium is contained in the heat transfer chamber which is vaporized by heat from the operating chamber, then condensed by the heat sink medium to be absorbed into the wicking member and transported through the wicking member by capillary action back to the operating chamber for revaporization. Heat transfer chamber is isolated from operating chamber.

Modeling of Thermal Phenomena in Liquid Cooling System for Aircraft Electric Unit

Abstract: The aim of this paper is to show the complex thermal analyses used for examining cooling properties of a liquid cooling system integrated into an aircraft fuel metering pump. The cooling is provided by flow of aviation fuel-kerosene. The main advantage of this solution is easy implementation in the place of engine bay. Two methods of thermal analyses are used according to the level of cooling system development. Thermal network analysis is intended for first estimation of thermal conditions and cooling system properties. Numerical thermal analysis based on the finite-element method is used for examination of limit operating conditions which cannot be realized during laboratory testing. The experimental measurement by an infrared camera is used for result verification and identification of thermal properties in laboratory conditions. The goal is to maintain the temperature conditions of the control electronics within the temperature limits.

Numerical simulation of flow and conjugate heat transfer in a microchannel for electronics cooling

Abstract: Microchannel heat sinks are minute flow channels fabricated onto the back of the thin silicon chip substrate with hydraulic diameter ranging from 10 μm to 103 μm. These heat sinks are characterized by extremely high surface area per unit volume of working fluid and low thermal resistance. This paper documents the modeling methodologies and the results of the numerical investigation on a laminar forced convection in a heated microchannel. A conjugate heat transfer model was set up using a commercial software STAR-CD to investigate the localized flow and heat transfer in a microchannel. The model was then solved using typical flow, heat transfer and dimensional parameters. The temperature distributions in both the solid and fluid region and the flow field in terms of velocity and pressures were shown and discussed with the help of the numerical simulation.

Selectively grooved cold plate for electronics cooling

Abstract: An improved heat exchange device adaptable for cooling electronic components mounted over at least one external surface of the device, comprising a base plate (1); a cover plate (3) ; a clad sheet (2) interposed between the base plate (1) and the cover plate (3) the base plate (1) and the cover plate (3), with the clad sheet (2) being rigidly jointed to form a single integrated plate; at least one inlet port (5) and at least one outlet port (6) at one end and/or at the opposite ends of the formed plate for entry and exit of a cooling medium, characterized in that the base plate (1) is configured to have a plurality of flow-passages each comprising several machined grooves (4) having varied dimensions predetermined in registration with respective thermal footprint of the electronic components thereby optimizing the heat transfer rate, and in that a plurality of interconnections being designed between the grooves (4) constituting one of a series and parallel flow-paths .