Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.

A miniature-scale refrigeration system for electronics cooling

Abstract: A miniature-scale refrigeration system suitable for electronics cooling applications was developed and experimentally investigated. A detailed review of the literature on refrigeration systems and system simulation models for application to electronics cooling is also provided. Experimental results obtained with the prototype system demonstrate its feasibility for use in cooling compact electronic devices. The cooling capacity of the system investigated varied from 121 to 268W, with a COP of 2.8 to 4.7, at pressure ratios of 1.9 to 3.2. The effectiveness of the condenser ranged from 52% to 77%, while a thermal resistance of 0.60 and 0.77degC-cm 2/W was achieved at the evaporator. The evaporator-heat spreader thermal resistance is defined as the ratio of the temperature difference between the chip surface and the refrigerant evaporator to the evaporator heat transfer rate. The overall system thermal resistance, defined as the ratio of the temperature difference between the chip surface and the condenser air inlet, is of 0.04 to 0.18degC-cm2/W. An overall second-law efficiency ranging from 33% and 52% was obtained, using a commercially available small-scale compressor. The measured overall isentropic efficiency was between 25% and 60%

Experimental Investigation of a Miniature-Scale Refrigeration System for Electronics Cooling

Abstract: A miniature-scale refrigeration system suitable for electronics cooling applications was developed and experimentally investigated. A detailed review of the literature on refrigeration systems and system simulation models for application to electronics cooling is also provided. Experimental results obtained with the prototype system demonstrate its feasibility for use in cooling compact electronic devices. The cooling capacity of the system investigated varied from 121 to 268W, with a COP of 2.8 to 4.7, at pressure ratios of 1.9 to 3.2. The effectiveness of the condenser ranged from 52% to 77%, while a thermal resistance of 0.60 and 0.77degC-cm 2/W was achieved at the evaporator. The evaporator-heat spreader thermal resistance is defined as the ratio of the temperature difference between the chip surface and the refrigerant evaporator to the evaporator heat transfer rate. The overall system thermal resistance, defined as the ratio of the temperature difference between the chip surface and the condenser air inlet, is of 0.04 to 0.18degC-cm2/W. An overall second-law efficiency ranging from 33% and 52% was obtained, using a commercially available small-scale compressor. The measured overall isentropic efficiency was between 25% and 60%

Application of Two-Phase Spray Cooling for Thermal Management of Electronic Devices

Abstract: Recent studies provide ample evidence of the effectiveness of two-phase spray cooling at dissipating large heat fluxes from electronic devices. However, those same studies point to the difficulty predicting spray performance, given the large number of parameters that influence spray behavior. This paper provides a complete set of models/correlations that are required for designing an optimum spray cooling system. Several coolants (water, FC-72, FC-77, FC-87 and PF-5052) are used to generate a comprehensive spray-cooling database for different nozzles, flow rates, subcoolings, and orientations. High-speed video motion analysis is used to enhance the understanding of droplet formation and impact on the device's surface, especially near the critical heat flux (CHF) point. A previous CHF correlation for normal sprays is modified for both inclination and subcooling effects. A new user-friendly CHF correlation is recommended which shows excellent predictive capability for the entire database. Also discussed in this paper is a new theoretical scheme for assessing the influence of spray overlap on cooling performance.