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Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.


Papers
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Patent
13 Mar 2013
TL;DR: In this paper, a refrigeration system that induces L2L refrigerant mixture flow from a flooded or falling film evaporator by means of the lubricant-liquefliquant mixture adsorbing heat from an electronic component is described.
Abstract: A refrigeration system that induces lubricant-liquid refrigerant mixture flow from a flooded or falling film evaporator by means of the lubricant-liquid refrigerant mixture flow adsorbing heat from an electronic component.

14 citations

Proceedings ArticleDOI
04 Oct 2004
TL;DR: Azar et al. as mentioned in this paper provide a review of some of the issues currently facing thermal designers of high power electronics, highlighting the need for an integrated approach to meet future cooling demands.
Abstract: This paper provides a review of some of the issues currently facing thermal designers of high power electronics. With the current market resistance to widely embrace advanced methods such as liquid cooling, air cooling will continue to be a popular choice (K. Azar, 8th THERMINIC workshop, 2002). As heat loads increase and system sizes reduce, further innovation and optimisation of system level air cooling design will need to continue. Selected case studies are presented to illustrate the range of design tools currently available and to highlight the need for an integrated approach to meet future cooling demands.

14 citations

Journal ArticleDOI
TL;DR: In this paper, the effects of the ratio of the channel height to the length of heat source and orientation on the heat transfer characteristics inside a liquid-cooled rectangular channel are investigated.

14 citations

Journal ArticleDOI
TL;DR: In this paper, a thermal-acoustic co-design of 3-D periodic porous foam structures is discussed, and an analytical framework that characterizes the governing performance indicators of both acoustic and thermo-fluid design on a unifying platform is laid out.
Abstract: Several thermal management applications involve fan-mounted heat sinks that result in fan-generated noise as an undesired by-product. These applications require noise reduction and attempt to reduce noise using separate muffler devices. However, space for separate heat-sinking and noise-reducing functionalities may be challenging in high-performance applications such as electronics cooling, data centers, automotive, aviation, and various others. A first-principles-based approach for combined heat sinking and noise reduction in the same functional volume is discussed in this paper. This paper reports on thermal-acoustic co-design of 3-D periodic porous foam structures. In order to enable a design strategy, an analytical framework that characterizes the governing performance indicators of both acoustic and thermo-fluid design on a unifying platform is laid out. A combination of analytical and phenomenological models is used to predict the absorption coefficient, transmission loss (TL), and other acoustic performance indicators. For thermal predictions, an experimentally validated semiempirical model is presented to estimate thermal resistance and static pressure drop of foam heat sink as a function of geometrical parameters as well as flow rates. Octave-band weighted values of acoustic indicators are then compared against thermal indicators to investigate thermal-acoustic co-design aspects. As hydraulic pore radius of porous foam decreases, the acoustic absorption coefficient increases reaching local maxima. Concomitantly, the pore radius decrease not only increases the absorption coefficient while dissipating heat, but also increases the heat sink pressure drop. For a chosen sound absorption region of interest, there exists a particular static pressure drop that maximizes heat sink dissipation for a given radius. The paper concludes by reporting TL and heat sink thermal performance for a generic electronics cooling configuration while elucidating the nuances of the proposed heat sink design using a thermal-acoustic index.

14 citations

Book ChapterDOI
01 Jan 2022
TL;DR: In this article, the characteristics of heat transfer for several cooling technologies with its possible applicability to the field of electronics cooling have been examined in the study, which serve as pointers for limitations of various heat transfer and power prerequisites of individual cooling arrangement.
Abstract: The ongoing accentuation on laptops and PCs has resulted in a transformed enthusiasm for the improvement of higher performance cooling systems. The gigantic heat produced in laptops and PCs chip or enormous integrated circuit raises lots of exigent problems to be settled. The improvement within a cooling of electronic components needs the compact heat dissipation mechanism which gives higher performance. By the technological progression of several electronics equipment, liquid coolants were utilized progressively in PCs, servers, and supercomputers. This review article covers the characteristics of heat transfer for several cooling technologies with its possible applicability to the field of electronics cooling. Several cooling technologies like conventional air cooling method, indirect liquid cooling by single/two-phase methods, and heat pipes have been examined in the study. The characteristics for performance evaluated based on values of heat flux, temperature and flow rate of coolant; which serve as pointers for limitations of various heat transfer and power prerequisites of individual cooling arrangement. An increase in the heating load, higher will be a decrement in the temperature occurred due to the cooling mechanism. In consideration of common computing methods, air cooling remains a reasonable choice as heat loads of every processor are limited to 190 W, albeit different factors like operational cost, reliability of device and recovery of waste heat might even now energize a utilization of liquid cooling. The liquid cooling is relied upon to be important into future thermal management of the laptop, where both proficient cooling and incredibly lower energy utilization are of significant role.

14 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202323
202255
202172
202045
201952
201849