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Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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TL;DR: In this article, surface radiation interchange in an annular enclosure is numerically modeled together with evaporating meniscus-driven convection, for investigating the application of the concept for cooling in microelectronic devices.
13 citations
TL;DR: In this article , the authors used the Finite Volume Method (FVM) to find the temperature distribution and flow rate for the selected pressure drop values within a single microchannel, where the base area of the microchannel heat sink (Al 6063-T05) was kept constant, while the heat flux value of 100 W/cm2 was selected as the cooling target with the heat removal requirements in electronics cooling.
13 citations
Patent•
14 Aug 1998TL;DR: In this article, a pulsed jet with variable duty cycle impinging upon a heat transfer surface is capable of enhancing heat transfer relative to the heat transfer rate for steady flows for electronics cooling and drying processes in the manufacturing industry.
Abstract: There are various methods for increasing heat transfer rates between a fluid jet (or array of jets) and an impingement surface. In a current investigation of pulsed flow impingement heat transfer, a pulsed jet with variable duty cycle impinging upon a heat transfer surface is capable of enhancing heat transfer relative to the heat transfer rate for steady flows. This principle is the subject of an in-depth experimental study. In the future this work will be extended to include numerical simulations. Potential applications include electronics cooling and drying processes in the manufacturing industry. Initial results indicate more than 50% heat transfer enhancement associated with control of the duty cycle parameter with a mechanical valve for use in industrial systems which is currently under development. Further experiments into boundary layer instability, and high frequency pulsations are under way.
13 citations
Patent•
15 Sep 2011TL;DR: An electronics cooling system comprises a tubular fan duct and an electronics housing as discussed by the authors, which is mounted directly on the fan duct, such that the electronics housing and the fans together enclose an interior space.
Abstract: An electronics cooling system comprises a tubular fan duct and an electronics housing The fan duct includes has a fan duct casing containing a fan with rotor blades and stator vanes The electronics housing is mounted directly on the tubular fan duct, such that the electronics housing and the fan duct casing together enclose an interior space A cooling airflow path extends from a high-pressure region of the tubular fan duct, through an inlet hole into the interior space, and out a bleed hole into a surrounding environment The electronics cooling system further comprises three electronics mounts within the interior space A first electronics mount is located immediately adjacent to the inlet hole, on the fan duct A second electronics mount is located immediately radially outward of the stator vanes, on the fan duct A third electronics mount is located immediately adjacent to the bleed hole, on the housing
13 citations
TL;DR: In this paper, the authors used the Finite Volume Method (FVM) to find the temperature distribution and flow rate for the selected pressure drop values within a single microchannel, where the base area of the microchannel heat sink (Al 6063-T05) was kept constant, while the heat flux value of 100 W/cm2 was selected as the cooling target in parallel lines with the heat removal requirements in electronics cooling.
13 citations