Topic
Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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TL;DR: The performance of single and multiple nozzle sprays for high heat flux electronics cooling using nitrogen-saturated FC-72 was studied in a multi-chip module (MCM) test setup, similar to MCM's used in current high end computer systems.
110 citations
TL;DR: In this paper, the authors evaluate the flow, heat transfer and second law characteristics of a hybrid nanofluid containing graphene-silver nanoparticles inside two new microchannel heat sinks.
110 citations
IBM1
TL;DR: A review of thermoelectric cooling and its application to the cooling of electronic equipment is provided in this article, with a background discussion of early history, current developments, and the defining temperature-pumping equations.
Abstract: This paper provides a review of thermoelectric cooling and its application to the cooling of electronic equipment. A background discussion of thermoelectric cooling is provided briefly citing early history, current developments, and the defining thermoelectric heat pumping equations. Several examples are provided of early IBM applications of thermoelectric cooling. An analysis to assess thermoelectric cooling enhancement in terms of increases in allowable power dissipation or chip temperature reduction is described along with results.
107 citations
TL;DR: Two designs for electrocaloric cooling suggest that it may be competitive with vapor compression cooling, an emerging technology that has broad potential to disrupt conventional air conditioning and refrigeration as well as electronics cooling applications.
Abstract: Electrocaloric (EC) cooling is an emerging technology that has broad potential to disrupt conventional air conditioning and refrigeration as well as electronics cooling applications. EC coolers can be highly efficient, solid state, and compact; have few moving parts; and contain no environmentally harmful or combustible refrigerants. We report a scalable, high-performance system architecture, demonstrated in a device that uses PbSc0.5Ta0.5O3 EC multilayer ceramic capacitors fabricated in a manufacturing-compatible process. We obtained a system temperature span of 5.2°C and a maximum heat flux of 135 milliwatts per square centimeter. This measured heat flux is more than four times higher than other EC cooling demonstrations, and the temperature lift is among the highest for EC systems that use ceramic multilayer capacitors.
106 citations
TL;DR: In this article, the first known implementation of a compact two-phase thermosyphon for cooling of a microprocessor in a commercial desktop computer is presented, which involves four components in a loop: an evaporator with a boiling enhancement structure, a rising tube, a condenser and a falling tube.
Abstract: Thermosyphons are a promising option for cooling of high heat dissipating electronics. In this paper, the first known implementation of a compact two-phase thermosyphon for cooling of a microprocessor in a commercial desktop computer is presented. The implemented thermosyphon involves four components in a loop: an evaporator with a boiling enhancement structure, a rising tube, a condenser and a falling tube. The performance of the thermosyphon with water and PF5060 as working fluids, and the effect of inclination are studied experimentally under laboratory conditions. Experimental observations are also made at actual operating conditions to monitor the thermal behavior with changes in power output of the microprocessor. The inside cabinet of the desktop computer is also numerically simulated to understand the airside performance of the condenser.
104 citations