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Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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TL;DR: In this paper, the performance of miniature heatpipe developed for cooling of electronic equipment, and on evaluating the notebook computer cooling systems in which they are used, is reported. But the results indicate the miniature heat-pipe can be applied to electronic equipment cooling.
Abstract: This paper reports on the performance of miniature heat-pipes developed for cooling of electronic equipment, and on evaluating the notebook computer cooling systems in which they are used. Experiments for the miniature heat-pipe were conducted on their thermal properties and reliability. The results indicate the miniature heat-pipe can be applied to electronic equipment cooling. Evaluating tests of the cooling system using this miniature heat-pipe have clarified the effectiveness of the miniature heat-pipe.
10 citations
20 Jan 2021
TL;DR: In this paper, the authors numerically study the heat transfer and hydrodynamic performance of a graphene-based hybrid nanofluid flowing through a microchannel for electronics cooling applications.
Abstract: The objective of this paper is to numerically study the heat transfer and hydrodynamic performance of a graphene-based hybrid nanofluid flowing through a microchannel for electronics cooling applic...
10 citations
TL;DR: In this article, a brief description of recent advances of convective heat transfer in some surface modified ducts using liquid crystal thermography and computational fluid dynamics is given, and influences of configuration and arrangement of surface modifications on the heat transfer are presented.
Abstract: Enhancement and control of forced convection heat transfer is important in many engineering applications and ducts of various surface complexity are used. Surface modifications like rib-roughening, grooves, dimples, protrusions, etc., are commonly applied in applications such as compact heat exchangers, electronics cooling as well as cooling in gas turbines and aircraft engines. This chapter gives a brief description of recent advances of convective heat transfer in some surface modified ducts using liquid crystal thermography and computational fluid dynamics. Details of temperature and heat transfer coefficient distributions are highlighted and influences of configuration and arrangement of surface modifications on the heat transfer are presented.
10 citations
01 Jan 2009
TL;DR: In this paper, the effects of pore size and gravitational force on the flow-related properties of the wick structures of a heat pipe were investigated. But, the pore sizes were not considered.
Abstract: Heat pipes have been gaining a lot of popularity in electronics cooling applications due to their ease of operation, reliability, and high effective thermal conductivity. An important component of a heat pipe is the wick structure, which transports the condensate from condenser to evaporator. The design of wick structures is complicated by competing requirements to create high capillary driving forces and maintain high permeability. While generating large pore sizes will help achieve high permeability, it will significantly reduce the wick’s capillary performance. This study presents a novel experimental method to simultaneously measure capillary and permeability characteristics of the wick structures using fluorescent visualization. This technique will be used to study the effects of pore size and gravitational force on the flow-related properties of the wick structures. Initial results are presented on wick samples visually characterized from zero to nine g acceleration on a centrifuge. These results will provide a tool to understand the physics involved in transport through porous structures and help in the design of high performance heat pipes.© 2009 ASME
10 citations
01 Jan 2008
TL;DR: In this article, a volumetric coefficient of performance (COPv) analysis of a heat sink and a piezoelectric fan system is presented, where the heat sink not only provides surface area, but also flow shaping for the unusual three-dimensional flow field of the fans.
Abstract: Piezoelectric fans have been investigated for electronics cooling over the last decade. The primary usage or method has been to place the vibrating fan near the surface to be cooled. The piezofan used in the current study is composed of a piezo actuator attached to a flexible metal beam. It is operated at up to 120VAC and at 60 Hz. While most of the research in the literature focused on cooling bare surfaces, larger heat transfer rates are of interest in the present study. A proposed system of piezoelectric fans and heat sink is presented as a more efficient method of system cooling with these fans. In this paper, a heat sink and piezoelectric fan system demonstrated a capability of cooling an area of about 75 cm2 (about 1 C/W) where electronic assemblies can be mounted. The heat sink not only provides surface area, but also flow shaping for the unusual three-dimensional flow field of the fans. A volumetric coefficient of performance (COPv ) is proposed, which allows a piezofan and heat sink system volume to be compared against the heat dissipating capacity of a similar heat sink of the same volume for natural convection. A piezofan system is shown to have a COPv of five times of a typical natural convection solution. The paper will further discuss the effect of nozzles in flow shaping obtained via experimental and computational studies. A three-dimensional flow field of the proposed cooling scheme with a piezofan is obtained via laser Doppler anemometry (LDA) flow visualization method. Velocities at the heat sink in the order of 1.5 m/s were achieved through this critical shaping. Finally, the overall system characterization to different heat loads and fan amplitudes will be discussed.Copyright © 2008 by ASME
10 citations