Showing papers on "Electroplating published in 1968"
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TL;DR: In this article, the authors present an evaluation of materials and processes applicable to the fabrication of hybrid microstrip microwave circuits, including vacuum deposition, sputtering, electroless and electroplating, thick-film screening and firing, and photoetching.
Abstract: This paper presents an evaluation of materials and processes applicable to the fabrication of hybrid microstrip microwave circuits. Substrate materials evaluated included aluminas, beryllias, quartz, and glass of varying purities and surface finishes. Conductor materials evaluated included silver, copper, gold, and aluminum. Fabrication processes studied included vacuum deposition, sputtering, electroless and electroplating, thick-film screening and firing, and photoetching. Sapphire and high-purity alumina (99.5 percent pure or better) substrates were found superior as substrates for microstrip circuits. Conductor materials and processing methods found best were 1) vacuum deposited chromium-gold thin film which was gold electroplated and photoetched; 2) thick-film silver which was photoetched to delineate the microwave pattern.
18 citations
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26 Sep 1968
TL;DR: In this paper, a drawing of a tank with a cyclodynamic cathode is shown, with a fixed-anode-plates arrayed in a ring around the cylindrical cathyode.
Abstract: A SCHEMATIC DRAWING OF A TANK IS SHOWN WITH A ROTATABLE CYLINDRICAL CATHODE ELECTRODE POSITIONED INWARDLY OF FIXED ANODE PLATES ARRANGED IN A RING AROUND THE CATHODE. A DETAIL IS SHOWN OF IMPELLER BLADES ATTACHED TO A PLATE FOR CIRCULATION OF THE SOLUTION PAST THE ELECTRODES. THE PLATE BEING MOUNTED ON THE SAME SHAFT AND ROTATED WITH THE CYLINDRICAL CATHODE. D R A W I N G
18 citations
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06 Dec 1968TL;DR: A BATTERY ELECTRODE is composed of a POUOUS FABRIC BASE, SUCH AS NON-WOVEN NYLON, on which there is NONELECTROLYTICALLY PLATED a THIN COATING of CONDUCTIVE METAL onto WHICH there is ELECTROPLATED a RELATIVELY THICK COating of METAL, SUch as NICKEL, and the THUS PLATED BASE then has an ACTIVE MATERIAL, SU CH AS NICKel HYDROXide OR CAD
Abstract: A BATTERY ELECTRODE IS COMPOSED OF A POUOUS FABRIC BASE, SUCH AS NON-WOVEN NYLON, ON WHICH THERE IS NONELECTROLYTICALLY PLATED A THIN COATING OF CONDUCTIVE METAL ONTO WHICH THERE IS ELECTROPLATED A RELATIVELY THICK COATING OF METAL, SUCH AS NICKEL, AND THE THUS PLATED BASE THEN HAS AN ACTIVE MATERIAL, SUCH AS NICKEL HYDROXIDE OR CADMIUM HYDROXIDE DEPOSITS IN ITS PORES. AN ELECTRODE TERMINAL MAY BE CONNECTED DIRECTLY TO THE RESULTING ELECTRODE STRUCTURE OF TWO SUCH BASES MAY BE SANWICHED TOGETHER WITH A NICKEL MESH INTERPOSED THEREBETWEEN AND WITH THE ELECTODE TERMINAL ATTACHED TO THE MESH.
18 citations
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04 Mar 1968TL;DR: In this paper, a CYCLDRICAL OBJECT is used to serve as a cathode in the plating process and is positioned adjacent to an ANODE IMMERSED in the bath.
Abstract: IN ELECTROPLATING A CYLINDRICAL OBJECT WHICH SERVES AS CATHODE IN THE PLATING PROCESS AND IS POSITIONED ADJACENT TO AN ANODE IMMERSED IN THE PLATING BATH, THE OBJECT IS MOUNTED IN SUCH MANNER THAT IT IS ONLY PARTIALLY SUBMERSED AND THE BATH IS AGITATED WITH SUFICIENT FORCE THAT THE EXPOSED SURFACE OF THE OBJECT IS MAINTAINED COMPLETELY AWASH WITH THE ELECTROLYTE SOLUTION. DEFECTS IN THE PLATING RESULTING FROM OCCLUSION OF AIR BUBBLES OR SOLID PARTICLES ARE THEREBY MINIMIZED AND A HIGH PLATING RATE IS ATTAINED.
13 citations
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23 Feb 1968
TL;DR: An insoluble anode suitable for use in electrolysis and a method for its production are provided in this article, where the anode comprises three components which are: A base substrate treated by sandblasting, SAID SUBSTRATE being selected from the group consisting of TITANIUM, ZIRCONIUM and TANTALUM OR ALLOYS THEREOF; B.
Abstract: An insoluble anode suitable for use in electrolysis and a method for its production are provided. The anode comprises three components which are: A. A BASE SUBSTRATE TREATED BY SANDBLASTING, SAID SUBSTRATE BEING SELECTED FROM THE GROUP CONSISTING OF TITANIUM, ZIRCONIUM AND TANTALUM OR ALLOYS THEREOF; B. A THIN METAL LAYER FORMED ON SAID SUBSTRATE, SAID THIN METAL LAYER BEING SELECTED FROM THE GROUP CONSISTING OF PLATINUM, PALLADIUM AND RHODIUM OR ALLOYS THEREOF; AND C. AN OUTERMOST LAYER OF MANGANESE DIOXIDE ELECTROPLATED ON SAID THIN METAL LAYER IN AN AQUEOUS SOLUTION OF MANGANESE SULFATE CONTAINING ABOUT 10 TO ABOUT 30 GRAMS/LITER OF FREE SULFURIC ACID AT A CURRENT DENSITY OF ABOUT 0.015 TO ABOUT 0.007 A./dm.2. The anode is produced by sandblasting a base substrate metal of titanium or its alloy to form minute indentations on the surface, electroplating on said base substrate metal a thin layer of platinum, and electrodepositing a layer of manganese dioxide on said thin layer in an aqueous solution of manganese sulfate containing 10-30 g./l. of free sulfuric acid at a current density of 0.015-0.007 A./dm.2.
13 citations
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31 Jul 1968
TL;DR: In this paper, an ADHERENT WEARABLE NICKEL COATING is applied to a METAL SURFACE by a multistep process in which the METAL surface is (A) SUBJECTed to an ANODIC CURRENT DENSITY in an AQUEOUS ACID TREATMENT BATH, Pthis paperERABLY CONTAINING SULFURIC ACID in an amount between 20 and 30% by volume, at a bath TEMPERATURE of 40 to 85*F.
Abstract: AN ADHERENT, WEARABLE NICKEL COATING IS APPLIED TO A METAL SURFACE BY A MULTISTEP PROCESS IN WHICH THE METAL SURFACE IS (A) SUBJECTED TO AN ANODIC CURRENT DENSITY IN AN AQUEOUS ACID TREATMENT BATH, PREFERABLY CONTAINING SULFURIC ACID IN AN AMOUNT BETWEEN ABOUT 20 AND 30% BY VOLUME, AT A BATH TEMPERATURE OF 40 TO 85*F. AND A CURRENT DENSITY OF 75 TO 250 A.S.F.; (B) COATED WITH A THIN NICKEL BASE COAT BY MEANS OF A NICKEL STRIKE APPLIED FROM AN ELECTROPLATING BATH PREFERABLY CONTAINING 30 TO 34 OZ./GAL. OF NICKEL CHLORIDE AND 9 TO 12% BY VOLUME OF HYDROCHLORIC ACID, AND UTILIZING A 99% MINIMUM PURITY NICKEL ANODE AND A CATHODIC CURRENT DENSITY BETWEEN ABOUT 50 AND 100 A.S.F., AND (C) THEN APPLYING A NICKEL COATING OF THE DESIRED THICKNESS TO THE METAL SURFACE IN A NICKEL SULFAMATE PLATING BATH MAINTAINED AT A TEMPERATURE OF 110 TO 125*F. AND AT A PH OF 3.5 TO 4.2. THE NICKEL SULFAMATE PLATING BATH PREFERABLY CONTAINS 62 TO 66 OZ./ GAL. OF NICKEL SULFAMATE (27 TO 31*BE.), 0.7 TO 2.0 OZ./GAL. NICKEL CHLORIDE, 4 TO 5 OZ./GAL. BORIC ACID, 1 TO 3 OZ./GAL. NAPHTHYLENE TRISULFONIC ACID, AND A SUFFICIENT QUANTITY OF AN ORGANIC WETTING AGENT TO MAINTAIN THE BATH SURFACE TENSION AT BETWEEN ABOUT 20 AND 60 DYNES/CM.2. A 99% MINIMUM PURITY NICKEL ANODE IS USED IN THE NICKEL SULFAMATE PLATING BATH AND PLATING IS CARRIED OUT AT A CURRENT DENSITY PREFERABLY BETWEEN 60 AND 100 A.S.F. THIS PROCESS CAN BE APPLIED TO VARIOUS METAL SURFACES INCLUDING COPPER, BRASS AND BOTH HIGH AND LOW CARBON STEELS. THE RESULTANT ARTICLE HAS AN ADHERENT, WEARABLE NICKEL COATING HAVING AN EXCELLENT COMBRINATION OF HARDNESS, DUCTILITY AND COMPRESSIVE STRESS PROPERTIES.
12 citations
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12 Nov 1968
TL;DR: In this article, a CONVENTIONAL SPIRAL VIBRATORY CONVEYOR is IMMERSED into an ELECTROLYTIC TANK, to AUTOMATICALLY time and electrOLytic OPERATION CARRIED out of moving MASSES OF SMALL METAL PARTS.
Abstract: A CONVENTIONAL SPIRAL VIBRATORY CONVEYOR IS IMMERSED INTO AN ELECTROLYTIC TANK, TO AUTOMATICALLY TIME AND ELECTROLYTIC OPERATION CARRIED OUT OF MOVING MASSES OF SMALL METAL PARTS. TYPICAL OPERATIONS INCLUDE DE-ELECTROPLATING OR STRIPPING TIN COATINGS FROM BITS OF COPPER WIRE, AND THE ELECTROPLATING OF NUTS. AS THE MASS OF METAL PARTS IS VIBRATED UPWARD, CONDUCTIVE CONTACT IS MADE, IN THE INTERVALS BETWEEN SUCCESSIVE VIBRATORY PULSES, WITH ELECTRODE MEANS ON THE SPIRAL FLIGHT.
11 citations
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14 May 1968
TL;DR: In this paper, a large hole is cut into the end wall of the VESSEL and a pre-assemeBLed ANODE is brought into the vessel through this hole.
Abstract: THIS SPECIFICATION DISCLOSES A METHOD AND APPARATUS FOR ELECTROPLATING THE INTERIOR SURFACE OF A LARGE VESSEL SUCH AS THE TANK OF A RAILROAD TANK CAR. A LARGE HOLE IS CUT INTO THE END WALL OF THE VESSEL AND A PREASSEMBLED ANODE IS BROUGHT INTO THE VESSEL THROUGH THIS HOLE. THE VESSEL IS MOUNTED ON ROLLERS FOR ROTATION ABOUT THE ANODE. THE HOLE IN THE END WALL IS CLOSED WITH A CIRCULAR PLATE DESIGNED FOR THIS PURPOSE. THE INTERIOR SURFACE OF THE VESSEL IS FIRST ACTIVATED BY TREATING IT WITH ACID AND REVERSE CURRENT WHILE THE VESSEL IS ROTATED ABOUT THE ANODE AND PURGED BY MEANS FOR AN INERT GAS. THE VESSEL IS THEN PARTIALLY FILLED WITH ELECTROPLATING SOLUTION AND IS ROTATED ABOUT THE ANODE WHILE THE ELECTROPLATING OF THE INTERIOR SURFACE OF TH VESSEL IS CARRIED OUT. THE ANODE IS THEN REMOVED AND THE PORTION OF THE END WALL WHICH IS CUT AWAY IS WELDED BACK IN PLACE, THE PORTION HAVING BEEN PREVIOUSLY ELECTROPLATED IN A CONVENTIONAL MANNER.
11 citations
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11 Jan 1968TL;DR: In this article, a procedure for pre-preparing POLYOXYMETHYLENE HOMOPOLYMER for ELECTROPLATING by ACID ETCHING, E.G. in OrthopHOSPHORIC ACID, FOLLOWED by BASIC TREATMENT, 10% SODIUM HYDROXIDE.
Abstract: A PROCESS FOR PREPARING POLYOXYMETHYLENE HOMOPOLYMER FOR ELECTROPLATING BY ACID ETCHING, E.G. IN ORTHOPHOSPHORIC ACID, FOLLOWED BY BASIC TREATMENT, E.G. 10% SODIUM HYDROXIDE.
10 citations
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11 Apr 1968
TL;DR: In this paper, a semi-conductor device including two superimposed dielectric layers, e.g., SiO 2 layer 5 and glass layer 10, on a semiconductor surface, is prevented by the provision of a coating 9 of a conductive barrier material over the dot 7.
Abstract: 1,246,414. Semi-conductor devices. ITT INDUSTRIES Inc. 11 April, 1969 [11 April, 1968], No. 18795/69. Heading H1K. In a semi-conductor device including two superimposed dielectric layers, e.g. SiO 2 layer 5 and glass layer 10, on a semi-conductor surface, undesirable migration of ions from an Ag electrode dot 7 into the upper dielectric layer 10 is prevented by the provision of a coating 9 of a conductive barrier material over the dot 7. In the diode shown, the Ag dot 7 is alloyed on to a preliminary Au/Ni layer on the semi-conductor surface, and the barrier coating 9 is of Ni. Alternative barrier materials are W, Mo, Pt, Pd or Rh. Application of the coating 9 may be by electroless plating or electroplating. The lower electrode 8 comprises Sn-coated Ag. The glass layer 10 is applied initially as a frit and is fused after having been removed from the surface of the upper electrode and from channels around individual devices in a wafer. The wafer is then scribed and diced in the channels. Transistors and integrated circuits are also referred to.
8 citations
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TL;DR: Sapphire and high-purity alumina (99.5 percent pure or better) substrates were found superior as substrates for microstrip circuits and vacuum deposited chromium-gold thin film which was gold electroplated and photoetched to delineate the microwave pattern.
Abstract: This paper presents an evaluation of materials and processes applicable to the fabrication of hybrid microstrip microwave circuits. Substrate materials evaluated included aluminas, beryllias, quartz, and glass of varying purities and surface finishes. Conductor materials evaluated included silver, copper, gold, and aluminum. Fabrication processes studied included vacuum deposition, sputtering, electroless and electroplating, thick-film screening and firing, and photoetching. Sapphire and high-purity alumina (99.5 percent pure or better) substrates were found superior as substrates for microstrip circuits. Conductor materials and processing methods found best were 1) vacuum deposited chromium-gold thin film which was gold electroplated and photoetched; 2) thick-film silver which was photoetched to delineate the microwave pattern.
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21 Oct 1968TL;DR: In this paper, a PLATINUM METAL COATED TITANIUM ELECTRODE for use in the extraction of brine is described, and the results show that by electraplating the platinum group metals from an ELECTROLYTE CONTAINING a POLYBASIC, HYDROXY ORGANIC ACID, the resulting PLATED ElectRODE is activated.
Abstract: THE INVENTION RELATES TO A PLATINUM METAL COATED TITANIUM ELECTRODE FOR USE IN ELECTROLYSIS OF BRINE. BY ELECTROPLATING THE PLATINUM GROUP METAL FROM AN ELECTROLYTE CONTAINING A POLYBASIC, HYDROXY ORGANIC ACID THE RESULTING PLATED ELECTRODE IS "ACTIVATED."
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02 Dec 1968
TL;DR: In this article, a method is described for treating PLASTIC SHEATHED METAL JIGS or RACKS CONVENTIONally USED in Supporting and TRANSPORTing NON-CONDUCTIVE ARTICLES THROUGH CHEMICAL and ELECTROPLATING SOLUTIONS in the COURSE of a Continuous PLATING CYCLE for METALLIZING the ARTICESS, whereby to PREVENT OR REDUCE DEPOSIT of METAL on the RACKs TheMSELVES.
Abstract: A METHOD IS DISCLOSED FOR TREATING PLASTIC SHEATHED METAL JIGS OR RACKS CONVENTIONALLY USED IN SUPPORTING AND TRANSPORTING NONCONDUCTIVE ARTICLES THROUGH CHEMICAL AND ELECTROPLATING SOLUTIONS IN THE COURSE OF A CONTINUOUS PLATING CYCLE FOR METALLIZING THE ARTICESS, WHEREBY TO PREVENT OR REDUCE DEPOSIT OF METAL ON THE RACKS THEMSELVES. O THIS END, THE RACKS ARE TREATED TO CAUSE ADSORPTION OF HEXAVALENT CHROMIUM IONS AT THE SURFACE OF THEIR PLASTIC SHEATHED PROTIONS.
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26 Aug 1968
TL;DR: An electroplating bath for the deposition of palladium from a palladium-urea complex was proposed in this paper, where an electric current was passed through the solution, whereupon palladium deposits on the surface of a workpiece or a cathode.
Abstract: An electroplating bath for the deposition of palladium from a palladium-urea complex. A method for depositing palladium from a chemical solution containing a palladium-urea complex by passing an electric current through the solution, whereupon palladium deposits on the surface of a workpiece or a cathode.
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25 Oct 1968
TL;DR: A CORE-FORMER-FORMING WIRE, to be COVERED with METAL, is continuedUOUSLY DRAWN first THROUGH a CIRCUMFERENTIAL MILLING DEVICE for SKIN REMOVAL and then THROUGH an AXIALLY OPERATING SHAVING and PROTECTive DIE to PROVIDE a VIRGIN SURFACE.
Abstract: A CORE-FORMING WIRE, TO BE COVERED WITH METAL, IS CONTINUOUSLY DRAWN FIRST THROUGH A CIRCUMFERENTIAL MILLING DEVICE FOR SKIN REMOVAL AND THEN THROUGH AN AXIALLY OPERATING SHAVING AND PROTECTIVE DIE TO PROVIDE A VIRGIN SURFACE. FROM THE SHAVING DIE IT MOVES IN UNCONTAMINATED CONDITION INTO A BATH FOR APPLYING A METAL COVER OR SHEATH TO ITS SURFACE BY ELECTROPLATING, HOT-DIPPING, TINNING OR THE LIKE. THE CORE IS IN COVERED CONDITION AFTER LEAVING THE BATH AND AFTER SOLIDIFICATION OF THE SHEATHING MATERIAL IS PASSED THROUGH SUITABLE FINISHING MEANS. THE ELECTROPLATING, HOT-DIPPING OR TINNING OF CONTINUOUS LENGTHS OF CORE-FORMING METAL FOR FORMING A DIFFERENT METALLIC COATING OR SHEATH THEREON REQUIRES THAT THE CORE SURFACES BE VERY CLEAN. THIS IS PARTICULARLY TRUE IN THE CASE OF ALUMINUM WIRE REQUIRED TO BE ELECTROPLATED WITH COPPER, FOR ALUMINUM IS EXTREMELEY PRONE TO RAPID REOXIDATION IN AIR AFTER OXIDE REMOVAL. SUCH OXIDE ACTS AS A CONTAMINANT INTERFERING WITH APPLICATION OF A STAISFACTORY METAL COVERING. THUS THE INVENTION IS PARTICULARLY USEFUL FOR IMPROVEDLY ELECTROPLATING A COPPER SHEATH ON AN ALUMINUM CORE WIRE BUT IT IS ALSO USEFUL FOR OTHER COMBINATIONS OF CORE AND COVERING METALS EMPLOYING HOT-DIPPING, TINNING OR THE LIKE.
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24 Dec 1968TL;DR: In this article, the authors describe a process for producing metallic film resistors, which involves forming two or more layers of different metals on the surface of a movie set.
Abstract: A PROCESS FOR PRODUCING METALLIC FILM RESISTORS, COMPRISING FORMING TWO OR MORE LAYERS OF DIFFERENT METALS ON THE SURFACE OF HEAT-RESISTANT INSULATING SUBSTRATES ONE ON THE OTHER BY NON-ELECTROLYTIC PLATING OR ELECTROPLATING AND THEREAFTER SUBJECTING THE COATED SUBSTRATES TO HEAT TREATMENT, WHEREBY THE DIFFERENT METALS ARE ALLOYED BY INTERLAYER DIFFUSION AND THUS A METAL ALLOY COATING IS FORMED ON THE SURFACE OF THE INSULATINGSUBSTRATES.
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18 Dec 1968
TL;DR: A fluid diffusion electrode as mentioned in this paper is a fluid diffusion device that is produced by successively contacting a non-metallic porous solid with a reducing agent, contacting the so-treated solid with the solution of a readilyreducible compound of a metal to deposit the metal on the surface of the solid, depositing a conductive metal on a metallized surface by electroless plating, and electroplating a continuous layer of conductive metals on and within the pores of the nonmetallic solid.
Abstract: 1,137,127. Fuel cell electrodes. PULLMAN Inc. 20 Dec., 1965 No. 53964/65. Heading H1B. [Also in Division C7] A fluid diffusion electrode suitable for use in batteries or fuel cells is produced by successively (a) contacting a non-metallic porous solid with a reducing agent, (2) contacting the so-treated solid with a solution of a readilyreducible compound of a metal to deposit the metal on the surface of the solid, (3) depositing a conductive metal on the metallized surface by electroless plating, and (4) electroplating a continuous layer of conductive metal on and within the pores of the non-metallic solid. The non-metallic body may be a sheet of thermoplastic or natural or synthetic elastomers such as alkylene or vinyl polymers which may be halogenated and may be co-polymerized with phenol- or urea-formaldehyde resins or casein; synthetic ion-exchange resins; ceramics, metal oxide refractories, porous glass, porous graphite, or asbestos; woven textiles or woven asbestos, glass or other inorganic fibres; mats of deposited fibres, asbestos paper, parchments; or PTFE- coated woven glass fibres, or woven graphite formed by pyrolysis of woven synthetic fibre. The non-metallic body may be a sheet or a series of contiguous tubes formed by bonding two corrugated plastic or elastomeric sheets along their registered ridges. The chemical plating steps (1) to (3) may be assisted by passing the treating solutions through the porous body by a vacuum impregnating technique. The metals used for the conductive layers may be any selected from Periodic Groups I, IIB, III to VIII, and may include alloys. Typically the reducing agent of step (1) is stannous chloride or hydrazine applied in aqueous solution and the reacting metal solution of step (2) contains PdCl 2 , KAu(CN) 2 , or H 2 PtCl 6 . The electroless plating solution may contain CuSO 4 , Cu(NO 3 ) 2 , NiCl 2 and/or CoCl 2 , KAu(CN) 2 , FeSO 4 , or Pd(NH 3 ) 4 Cl 2 together with a reducing agent such as formaldehyde, hydrazine or NaH 2 PO 2 , a complexing agent such as sodium citrate, sodium EDTA or Rochelle salt, and optionally NH 4 Cl. Typically the electroplated metal is Ag from a cyanide bath but reference is made to electroplating with Au, Zn, Al, Mn, Fe, Pt, Pd. The resulting electrodes may have a resistivity between 5 and 10 times that of a porous conductor of the same metal, e.g. silver; and may be impregnated with catalyst metal or oxides or salts of such metals either simultaneously with the conductive metal or subsequently by electroless or electrolytic plating, vapour deposition, sputtering, electrophoretic deposition or by impregnation with catalyst precursors followed by decomposition, or by anodizing the electrode surface with or without pre-treatment with reducible salts. The electrodes may be used in a fuel cell either as the fuel electrode fed with hydrogen, hydrocarbons, or alcohols or as the oxidizing electrode fed with air, oxygen, chlorine or bromine, using as electrolyte aqueous or non- aqueous solutions, molten inorganic salts or liquefied gases e.g. NH 3 . The electrodes may also be employed as one or both of two electrodes sandwiching a porous layer impregnated with a catalyst with optionally a metal screen or perforated plate between the catalyst layer and the electrodes. Silver-zinc and silver-nickel batteries may include porous electrodes formed as described above.
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TL;DR: In this paper, the authors present an evaluation of materials and processes applicable to the fabrication of hybrid microstrip microwave circuits, including vacuum deposition sputtering electroless and electroplating, thick-film screening and firing, and photoetching.
Abstract: This paper presents an evaluation of materials and processes applicable to the fabrication of hybrid microstrip microwave circuits. Substrate materials evaluated included aluminas, beryllias, quartz, and glass of varying purities and surface finishes. Conductor materials evaluated included silver, copper, gold, and aluminum. Fabrication processes studied included vacuum deposition sputtering electroless and electroplating, thick-film screening and firing, and photoetching. Sapphire and high-purity alumina (99.5 percent pure or better) substrates were found superior as substrates for microstrip circuits. Conductor materials and processing methods found best were 1) vacuum deposited chromium-gold thin film which was gold electroplated and photoetched; 2) thick-film silver which was photoetched to delineate the microwave pattern.
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29 Feb 1968
TL;DR: In this article, a method of electrodepositing metal on a large nonconducting surface involving the use of nonconductive surface having an exposed network of interconnecting electrical conductors is described.
Abstract: A method of electrodepositing metal on a large nonconducting surface involving the use of nonconductive surface having an exposed network of interconnecting electrical conductors. Methods of electroforming and electroplating involving the use of such a surface. A method of making an electroforming mold and an electrodeposition form with such a surface. An electroforming mold and an electrodeposition form with such a surface. An electroplated article having a base containing such a surface. A method of making a foraminous metal article utilizing such a surface.
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24 Apr 1968
TL;DR: A method of metallizing an electrically nonconductive surface (e.g. of plastics, paper laminated phenolic boards, glass, other mineral, vegetable or synthetic material) comprises the steps of cleaning the surface, rendering the surface porous by removing at least part of the outermost surface layer, washing, or washing and heating the porous surface, or treating the same chemically so as to remove resulting residues and precipitates, providing a priming or keying medium for the nuclei of a catalytic salt solution by the application of a base metal salt solution (
Abstract: A method of metallizing an electrically non-conductive surface (e.g. of plastics, paper laminated phenolic boards, glass, other mineral, vegetable or synthetic material) comprises the steps of (a) initially cleaning the surface, (b) rendering the surface porous by removing at least part of the outermost surface layer, (c) washing, or washing and heating the porous surface, or treating the same chemically so as to remove resulting residues and precipitates, (d) providing a priming or keying medium for the nuclei of a catalytic salt solution by the application of a base metal salt solution (e.g. an alcholic or aqueous SnCl2 solution) acting as a priming or keying solution, (e) applying a solution of the catalyst (which may comprise Ag, Au, Pd or Pt), (f) heating the surface, and (g) chemically depositing a metal (e.g. Cu, Ni or Sn) from a solution on the surface after the catalyst has penetrated into the same. After the step (c) and prior to the step (d) a coat of resin may be applied to the surface, the outer surface of the coat being rendered porous. Step (b) for rendering the surface porous may be (i) chemical using an aqueous acid or alkaline etchant or an organic solvent, or (ii) mechanical using grit blasting or honing or (iii) by irradiating the surface with electrons or (iv) by subjecting the surface to electric discharges, e.g. using a corona discharge. The catalyst of step (e) may be derived from a salt solution of Au or Pt in either an aqueous or organic medium, e.g. of alcohol, ketone, ester or aromatic hydrocarbon, and may contain surface active agents and penetrants. Heating step (f) may be carried out in an inert atmosphere or vacuum and after the heating the surface may be cooled or quenched in air or water. In metal-deposition step (g), Cu may be deposited from Fehling's solution using HCHO and NH2NH2 as reducing agents; Ni may be deposited from alkaline or acid nickel chloride solutions using hypophosphite as a reducing agent; or Sn may be deposited from a solution comprising K2SnO3, KCN and KOH. The surface to be plated may be dipped in a concentrated solution of the reducing agent before immersing in a plating bath. The metal may be applied from a plurality of solutions of decreasing concentrations. Successive solutions may comprise different metals, the metal in the preceding solution being catalytic to depostion of metal in a succeeding solution. After plating, the metallized surface may be annealed in an oven, its thickness be increased by electro-plating and then be machined. In metallizing Si plastics or polytetrafluoroethylene plastics, the extra step of applying resin to the cleaned surface is included between steps (c) and (d). The Examples are of (1) making printed circuits on both sides of a polyester film by depositing chemically reduced Cu followed by electro-plated Cu and chemically reduced Sn. Details of masking during plating are given. (2). Making printed circuits on paper laminated phenolic boards by depositing chemically reduced Ni followed by chemically reduced Cu and electroplated Cu. (3). Making acetal resin mechanical components such as wheels, gears, pinions and rollers by depositing electroless Ni, and chemically reduced Cu for the initial deposits followed by electroplated Cu and Ni and finished with hard Cr. (4). Making metallized "Terylene" (Trade Mark) fabric, e.g. for safety belts in motor vehicles, by depositing either chemically reduced Cu or electroless Ni and electro-plating with Cu and/or Ni. Other objects which may be metallized are glass or other mineral fibres, before or after they have been woven, felted or otherwise joined into sheets or mats, and ropes, cords or strings made of mineral, vegetable or synthetic fibres.
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13 Nov 1968
TL;DR: The hot junction bridging members of a thermocouple array are soldered or brazed to a heat conductive element via a layer of insulation deposited on the bridges and another layer of solderable metal on the insulation as mentioned in this paper.
Abstract: 1,133,611 Thermoelectric generators G V PLANER Ltd 6 Jan, 1966 [8 Oct, 1964], No 41130/64 Heading H1K The hot junction bridging members of a thermocouple array are soldered or brazed to a heat conductive element via a layer of insulation deposited on the bridges and a layer of solderable metal deposited on the insulation In a typical array the thermoelements, alternately of P and N type bismuth telluride, are interconnected by nickel or copper junction-pieces and are spaced apart by resin, glass or ceramic cement Layers of insulation 5000 S thiek deposited at the hot and cold faces of the array are coated in turn with copper by vapour deposition or electroless plating The faces are then soldered or brazed to copper slabs after electroplating to thicken the copper layer Other suitable insulators are vapour deposited silicon and silicon nitride, and sputtered tantalum oxide, zirconium oxide, niobium oxide and cerium oxide Alternative thermoelement materials are the tellurides of lead and germanium
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07 Nov 1968
TL;DR: An AQUEOUS BATH for ELECTROPLATING TIN UPON VARIOUS CONDUCTIVE SUBSTRates CONTAINS STAMNOUS ION, SULFATE RADICAL, IMIDAZOLINE DERIVATIE and a HETEROCYCLIC ALDEHYDE.
Abstract: AN AQUEOUS BATH FOR ELECTROPLATING TIN UPON VARIOUS CONDUCTIVE SUBSTRATES CONTAINS STAMNOUS ION, SULFATE RADICAL, AN IMIDAZOLINE DERIVATIE AND A HETEROCYCLIC ALDEHYDE. THE BATH IS HIGHLY ACID AND IS OPERABLE TO PRODUCE SMOOTH ADHERENT DEPOSITS OVER A WIDE RANGE OF CURRENT DENSITIES AND DEPOSITS OF SPECTRAL BRIGHTNESS WITH THE OPTIMUM FORMULATIONS.
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26 Jul 1968TL;DR: In this paper, a semi-conductive substrate of one conductivity type having adjacent one surface thereof an array of charge storage regions, and a layer 22 of insulating material covering the surface except for at least part of the regions and adapted to shield the surface from a scanning electron beam, are formed on the regions by electroless or electrolytic deposition.
Abstract: 1,249,714. Image pick-up tubes; semiconductor targets. WESTERN ELECTRIC CO. Inc. 22 July, 1969 [26 July, 1968], No. 36720/69. Headings H1D and H1K. [Also in Division C7] In a method of making a target structure for an image pick-up tube, the structure comprising a semi-conductive substrate 20 of one conductivity type having adjacent one surface thereof an array of charge storage regions 21 which are preferably of opposite conductivity type, and a layer 22 of insulating material covering the surface except for at least part of the regions and adapted to shield the surface from a scanning electron beam; an array of conductive metal deposits 23 are formed on the regions 21 by electroless or electrolytic deposition. The deposits 23 may extend outwardly of the surface of the layer 22 thereby partly shielding the layer and increasing the beam landing area, or may alternatively be flush with the surface. The regions 21 may be partly etched out before the metal areas 23 are deposited so that these areas are anchored within the substrate and the space charge regions are brought closer to the bottom of the target and the resolution is improved (Fig. 3, not shown). In one example a silicon target having a 10 ohm-cm. N-type base region and a hexagonal array of diodes formed by boron diffused regions 8 microns in circumference on 15 micron centres defined by a SiO 2 insulating film is cleaned in HF and immersed in a gold cyanide bath. The bath consists of 21.3 g./l. KAu(CN) 2 and 50 g./l. (NH 4 ) 2 HC 6 H 5 O 7 at 65‹ C. and the target is cathodic with a current density of 4 ma./cm. 2 of exposed silicon. After plating for one hour a gold layer 6-8 microns thick covers each diode region. Alternative metals for electroplating are nickel, cobalt, palladium, platinum or the platinum group, silver, or copper; for electroless deposition the metals nickel, cobalt and platinum are suitable. A minimum thickness of 300 S is adequate. The storage areas need not be PN junctions but may be M1S diodes or rectifying barriers constituted by metal-semiconductor contacts as in Schottkybarrier devices.
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16 Oct 1968
TL;DR: An AQUEOUS BATH for ELECTROPLATING TIN UPON METAL SURFACES CONTAINS STANNOUS ION, SULFATE RADICAL, SURFACEACTIVE Sulfated POLYOXYALKyl CARBINAMINE and an IMIDAZOLINE DERIVATIVE the bath has a HYDROGEN ION CONCENTRA TION of about 09 to 41 GRAMS per LITER, and it OPERates EFFECTIVELY ever a wide range of current DENSITIES to produce DESIRA
Abstract: AN AQUEOUS BATH FOR ELECTROPLATING TIN UPON METAL SURFACES CONTAINS STANNOUS ION, SULFATE RADICAL, A SURFACEACTIVE SULFATED POLYOXYALKYL CARBINAMINE AND AN IMIDAZOLINE DERIVATIVE THE BATH HAS A HYDROGEN ION CONCENTRA TION OF ABOUT 09 TO 41 GRAMS PER LITER, AND IT OPERATES EFFECTIVELY EVER A WIDE RANGE OF CURRENT DENSITIES TO PRODUCE DESIRABLE DEPOSITS AT RELATIVELY HIGH PLATING RATES
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29 Jan 1968
TL;DR: In this paper, the authors describe a scenario where at least one continuous metal layer is stored on the wall of an insulative base station, and the rest of the metal layers are used to construct separate cabins.
Abstract: AN INSULATIVE SUBSTRATE HAS AT LEAST ONE CONTINUOUS METAL LAYER SECURED THEREON, WHICH METAL LAYER IS TO BE ETCHED AWAY TO FORM SEPARATE CIRCUIT ELEMENTS. ELECTROPLATING OF ADDITIONAL METAL IS ACCOMPLISHED BEFORE SUCH ETCHING SO THAT THE CONTINUOUS METAL LAYER CAN ACT AS A CATHODE DURING THE ELECTROPLATING PROCESS. THEREAFTER, PORTIONS OF THE METAL LAYER ARE ETCHED AWAY TO DEFINE SEPARATE CIRCUIT ELEMENTS.