Showing papers on "Electroplating published in 1970"

Electroplating cell including means to agitate the electrolyte in laminar flow

Abstract: An electroplating cell is constructed to prevent current spreading in the electrolyte during the plating of a metal or metal alloy onto a substrate. The cell is constructed such that the cross-sectional area of current path is substantially the same as the cross-sectional area of a pair of electrodes spaced apart in the cell. This is accomplished by placing the electrodes in the cell such that their edges are substantially in contact with the dielectric or insulating walls of the cell. The cell also contains electrolyte agitating means to provide uniform laminar flow of the electrolyte across the surface of one of the electrode. Metal alloy films deposited with the use of this cell exhibit uniform thicknesses on rather large surface areas. Where magnetic metal alloys are plated, the films not only exhibit uniform thicknesses laterally on the whole cathode but uniform composition and magnetic properties throughout as well.

Copper plating on zinc and its alloys

Abstract: Production of a uniform, continuous corrosion resistant bonded copper coating on a zinc or zinc alloy body, by a process which comprises contacting the zinc or zinc alloy body with an electroless copper plating composition or solution consisting essentially of a soluble copper salt, e.g., copper sulfate, a complexing agent, e.g., citric acid, and a reducing agent, e.g., sodium hypophosphite. The resulting zinc or zinc alloy body can then be contacted with a copper electroplating bath, and according to one embodiment the resulting copper plated zinc or zinc alloy body is then treated in a nickel electroplating solution, followed by treatment in a chromic acid electroplating solution, to provide a corrosion resistant bright attractive metal coating on the zinc or zinc alloy body. The above noted novel electroless copper plating composition, and the zinc or zinc alloy article coated with an electroless copper plating.

Apparatus for electroplating a curved surface

Abstract: Apparatus for electroplating a curved surface of a workpiece wherein a relative rotatable and reciprocable motion is provided between the anode and the surface to be plated for controlling variations in plating thickness, with the rotary motion being precessed to provide a constant phase shifting to cancel out plating irregularities. The anode is fabricated of a plurality of longitudinally spaced annular segments, with means to independently control the current to each segment.

Apparatus for selective electroplating of sheets

Abstract: Apparatus for selectively electroplating discrete areas on a sheet employs a plurality of dams to conduct plating solution to and from the sheet. A plurality of resilient seals bearing against the material to be plated seal preselected surface portions of the sheet into contact with the fluid zone and other portions out of such contact, the seals also forming a part of a conduit normal to the preselected portions. A pump pumps plating solution through the fluid zone so as to promote turbulence adjacent the preselected surface portions.

Method of treating plastic substrates and process for plating thereon

Abstract: PLASTIC SUBSTRATES, SUCH AS POLYPROPYLENE, ABS, ETC. ARE PLATED WITH AN ADHERENT METAL COATING IN A PROCESS WHICH AVOIDS COMPLETELY THE ART-EMPLOYED STEPS OF ETCHING IN A CHROMIC-SULFURIC ACID SOLUTION AS WELL AS THE DEPOSITION OF A THIN COATING OF METAL ON THE SUBSTRATE FROM AN ELECTROLESS PLATING BATH PRIOR TO THE ELECTROLYTIC PLATING OPERATION. PLASTIC SUBSTRATES ARE (1) TREATED WITH A SOLUTION OR DISPERSION OF SULFUR IN A SUITABLE SOLVENT, SUCH AS A TRICHLOROETHYLENE, (2) CONTACTED WITH AN AQUEOUS SOLUTION OF A CUPROUS SALT; SUCH AS CUPROUS CHLORIDE, (3) OPTIONALLY TREATED WITH AN AQUEOUS SOLUTION OF PALLADIUM CHLORIDE AND FINALLY (4) ELECTROPLATED TO FORM A COATING OF THE DESIRED METAL OF THE DESIRED THICKNESS.

Electrodeposition of bright acid tin and electrolytes therefor

Abstract: Improved baths or solutions are provided for the electroplating of tin, and containing as the primary brightener therefor the reaction product of furfural with crotonaldehyde in the presence of a catalytic amount of an alkali. In addition, this invention is concerned with brightening additive compositions for tinelectroplating baths, and with methods for preparing such additive compositions and for electroplating bright tin deposits.

Method and apparatus for electroplating

Abstract: This invention concerns an improved method and apparatus for electroplating in which rinse solutions and fumes from electroplating operations are treated to recover values contained therein, and to simultaneously adjust the concentration and the temperature of the electroplating bath. Fumes and spray from the electroplating and rinsing operations are contacted with controlled amounts of a process solution comprising overflow rinse water mixed with electroplating bath solution. The liquidvapor contacting operation is controlled to evaporate water at a rate substantially equivalent to the rate of addition of rinse water to the process so that a water balance is maintained throughout the system, and to cool the process solution. The process is preferably conducted in apparatus comprising an electroplating tank, a rinse tank, a fume exhaust system, a heat exchanger and a liquid-vapor contacting means.

Bath for electroplating tin-bismuth alloy

Abstract: Bath for electroplating tin-bismuth alloy upon a metal object such as a frame of a computer, including fluoboric acid in order to maintain the pH acid, tin fluoborate and a bismuth oxidebismuth sulphate mixture of low quantity. The utilized method is of the soluble anode type and the cathode is formed of the object to be coated.

Electrodeposited plain bearing liners

Abstract: A method for the manufacture of bearing metal liners, such as those suitable for connecting rod and main bearings. which comprises the electrodeposition of a composite electroplate of one or more of the metals of the group consisting of copper, nickel, cobalt, iron or their alloys containing densely codeposited fine non-metallic insulator particles, followed by a thin electroplate of copper, silver, nickel, cobalt, iron or their alloys that will have dense vertical porosity by virtue of having been deposited on the metallic surface containing the densely codeposited non-metallic insulator particles. The highly porous plate is then overlaid with a final lead-tin alloy electrodeposit, which by plating into the dense porosity of the underlying metal, produces in effect a copper-lead; a nickellead; a cobalt-lead; a silver-lead; or the like ''''alloy'''' plate with an overlayer of lead alloy plate.

Method of electroplating readily oxidizable metals

Abstract: IN A METHOD OF ELECTROPLATING READILY OXIDIZABLE METALS AND ALLOYS, AN ARTICLE TO BE PLATED IS FIRST PICKED WITH A MIXTURE OF NITRIC ACID AND HYDROFLUORIC ACID OR A MIXTURE OF BORIC ACID AND HYDROFLUORIC ACID, IMMEDIATELY WASHED WITH AN ANHYROUS ORGANIC SOLVENT, DRIED BY AN INERT GAS OR UNDER VACUUM, DIPPED IN A PLATING BATH WITHOUT BEING EXPOSED TO THE ATMOSPHERE AND THEN AFTER A SHORT TIME ELECTROLYTICALLY PLATED.

Composite ceramic package breakaway notch

Abstract: A small portion of the electrical circuit connecting at least two exposed conductive surfaces is applied on a segment, which may be single thin ply, of ceramic forming the composite structure. Breaking away of or otherwise removing the segment or thin ply is effective to separate the surfaces electrically. This is convenient in electroplating surfaces which are not readily accessible under certain plating conditions and provides grounding during mounting of chips.

Zinc electroplating electrolyte and process

Abstract: In accordance with certain of its aspects this invention relates to a process of producing bright zinc electrodeposits which comprises passing current from an anode to a metal cathode through an aqueous bath composition containing at least one zinc compound providing zinc ions for electroplating zinc, a bathsoluble polyether, and at least one non-aromatic Alpha , Beta unsaturated carbonyl compound for a time period sufficient to deposit a bright zinc electrodeposit upon said cathode.

Chromium electroplating process and product thereof

Abstract: A process for producing a duplex coating made up of a chromium containing oxide (0.5 to 2 mg./ft. 2) overlying a metallic chromium layer (1.5 to 20 mg./ft.2) which is adherent to the base material. After the stock is plated in a first stage, it is passed through an electrolyte containing 40-100 g./1.CrO3 plus sulfate and/or fluoride catalyst to effect a dissolution and control of the overlying oxide layer. It is subsequently passed to a third stage (which may be omitted) where it is cathodically treated at a current density of less than 500 a./ft.2 to effect further control of the oxide layer. To reduce costs and simplify the process, all three stages may be accomplished in the same electrolyte bath.

Method of protecting ferrous strip in hot-dip processes

Abstract: A METHOD FOR COATING BATCH ANNEALED FERROUS STRIP WITH MOLTEN METAL BY A HOT-DIP PROCESS IN WHICH FLUXING IS ELIMINATED. THE STRIP IS INITIALLY COATED WITH A VERY THIN METALLIC LAYER BY ELECTROPLATING OR VAPOR DEPOSITION AND THEN, AFTER SUITABLE ACTIVATION OF THE SURFACE, PASSED THROUGH A MOLTEN METAL COATING BATH.

Method of plating on stainless steel

Abstract: A process by which a metal may be plated on a stainless steel metal substrate whereby the final electroplated composite possesses greatly improved adherence. Said process involves the electrodeposition of a nickel strike layer on the stainless steel base metal prior to plating a ''''Woods strike'''' nickel electroplating bath in which the nickel therein is in the form of nickel bromide and the acid in the bath is hydrobromic acid. The composition and operating conditions of said bath comprise: NiBr2 100-800 g./l. HBr 0.2%-20% by weight Current Density 5-200 a.s.f. Bath Temperature 60*-115* F.

Electroless plating of plastics and fibers

Abstract: NYLON DACRON OR OTHER FIBERS OF RABRIC IS PLATED BY FIRST DEGREASING THE FIBRIC WITH AN ORGANIC SOLVENT SUCH AS METHYL ETHYL KETONE, THE FIBRIC IS THEN IMMERSED IN A NOVEL NON-AQUEOUS SOLUTION WHICH SIMULTANEOUSLY FURTHER DEGREASES, CLEANS AND WETS, ETCHES AND INITIATED SENSITIZATION OF THE SURFACE O THE FABRIC FIBERS, THE FABRIC IS THEN RINSED AFTER WHICH IT IS DEGLAZED BY IMMERSION IN AN OXIDIZING SOLUTION, RINSED, IMMERSED IN AMMONIA SOLUTION, TREATED IN A NOVEL SENSITIZING SOLUTION, ACTIVATED IN A NOVEL ACTIVATING SOLUTION, RINSED AND PLATED IN A NOVEL NICKEL OR COPPER PLATING SOLUTION. THE FABRIC MAY BE FURTHER PLATED BY ELECTROPLATING TECHNIQUES.

No rerack metal plating of electrically nonconductive articles

Abstract: No rerack process for the metal plating of electrically nonconductive articles or objects on vinyl plastisol-coated plating racks, involving contacting the rack prior to racking thereon the nonconductive articles destined to be plated with a liquid lower alkyl formamide, preferably N,N-dimethylformamide, or N-methyl-2-pyrrolidone, or a mixture thereof, for a time sufficient to render the rack substantially nonsusceptible to electroless deposition of metal thereon during a subsequent electroless metal plating step. Consequently the prior requirement of reracking of the articles on clean racks subsequent the electroless metal plating step and prior to the electroplating is eliminated.

Recovery of electro-chemical plating solutions

Abstract: A PROCESS FOR ECONOMICALLY RECOVERING ELECTROPLATING SOLUTIONS, WHICH ARE USUALLY DISCARDED, FROM AN ELECTROPLATING PRODUCTION LINE. THE PROCESS PROVIDES FOR ONE OR MORE STATIC RINSES WHERE THE PLATED MATERIAL IS WASHED FREE OF THE PLATING SOLUTION. THE RINSE SOLUTION IS THEN FILTERED AND TREATED IN A CATION EXCHANGER WHERE IMPURI TIES ARE REMOVED FROM THE RINSE AND THE PURIFIED SOLUTION RETURNED TO THE PLATING TANK FOR IMMEDIATE USE OR TO A HOLDING TANK FOR FUTURE USE.

Novel chromium plating compositions and processes

Abstract: IN ACCORDANCE WITH CERTAIN OF ITS ASPECTS, THIS INVENTION RELATES TO NOVEL COMPOSITIONS AND TO A PROCESS FOR ELECTROPLATING CHROMIUM PLATE ONTO A BASIS METAL WHICH COMPRISES PASSING CURRENT FROM AN ANODE TO A CATHODE AT LEAST A PORTION OF WHICH CONTAINS A CONDUCTIVE METAL LAYER THROUGH AN AQUEOUS ACIDIC CHROMIUM PLATING BATH COMPOSITION CONTAINING (1) AT LEAST ONE CHROMIUM COMPOUND PROVIDING HEXAVALENT CHROMIUM IONS FOR ELECTROPLATING CHROMIUM; AND (2) BROMATE ION AS COOPERATING ADDITIVE TO PROVIDE INCREASED CHROMIUM THROWING POWER; FOR A TIME SUFFICIENT TO DEPOSIT A CHROMIUM ELECTROPLATE HAVING A THICKNESS OF AT LEAST 1X10**-5 MM.

Highly conductive carrier particles

Abstract: ELECTRICALLY CONDUCTIVE CARRIER PARTICLES FOR USE IN APPLYING ELECTROSCOPIC TONER MATERIAL TO ELECTROSTATIC CHARGE PATTERNS ARE PREPARED BY OVERCOATING A MAGNETIC CORE MATERIAL, SUCH AS BY ELECTROLESS DEPOSITION OR ELECTROPLATING METHODS, WITH A THIN CONTINUOUS LAYER OF AN ELECTRICALLY CONDUCTING METAL HAVING A RESISTANCE TO AERIAL OXIDATION GREATER THAN THAT OF IRON. THESE CARRIER PARTICLES RETAIN THEIR ELECTRICAL PROPERTIES DURING REPEATED USAGE AND ARE HIGHLY ABRASION RESISTANT.

Black chromium plating process and composition

Abstract: BLACK CHROMIUM PLATE ARTICLES ARE PRODUCED BY THE USE OF A NOVEL ELECTROPLATING BATH, WHEREIN A LIGHT AND HEAT ABSORBING DECORATIVE AND PROTECTIVE ELECTROPLATE IS APPLIED TO A BASIS METAL OR OTHER CONDUCTIVE SUBSTRATE. THE BATH COMPRISES CHROMIC ACID, SODIUM OR POTASSIUM IONS, FLUOSILICATE IONS AND AN ORGANIC REDUCING AGENT.

Process for a continuous selective electroplating of strip

Abstract: AN ANODE POTENTIAL IS APPLIED TO ROLLER MEANS PARTLY IMMERSED IN AN ELECTROPLATING BATH OF LIQUID ELECTROLYTE THE STRIP TO BE ELECTROPLATED IS ARRANGED OVER THE ROLLER MEANS SO THAT THE LONGITUDINAL DIRECTION OF THE STRIP IS PARALLEL TO A TANGENT TO THE PERIPHERY OF THE ROLLER MEANS AND THE STRIP DEFINES A GAP WITH THE PERIPHERY A CATHODE POTENTIAL IS APPLIED TO THE STRIP THE STRIP IS MOVED IN SAID LONGITUDINAL DIRECTION AND THE ROLLER MEANS ARE ROTATED AT THE SAME TIME TO ENTRAIN ELECTROLYTE FROM THE BATH AND MAINTAIN SAID GAP FILLED WITH ELECTROLYTE

Use of cationic permselective membranes in anodizing

Abstract: IN ANODIZING OR ELECTROPLATING OF ANODIZABLE METALS SUCH AS ALUMINUM AND ALUMINUM BASE ALLOYS, EMPLOYING ELECTROLYTES WHICH CONTAIN METAL SALTS, DEPLETION OF THE METAL ION CONTENT OF THE ELECTROLYTE BY MIGRATION OF METAL IONS TO THE OPPOSITE ELECTRODE IS PREVENT BY THE USE OF A NONPOLORIZING AUXILIARY ELECTROLYTE, SUCH AS A MINERAL ACID, TO SURROUND THE OPPOSITE ELECTRODE, IN A CELL HAVING TWO COMPARTMENTS HOLDING THE RESPECTIVE ELECTROLYTES, THE ELECTROLYTES BEING SEPARATED IN THE CELL BY MEANS OF A CATIONIC PERM-SELECTIVE MEMBRANE. THE METHOD AND APPARATUS ARE ADAPTED FOR THE FORMATION OF HARD INTEGRALLY COLORED ANODIC COATINGS ON ALUMINUM, AND ALSO FOR CHROMIUM PLATING.

Electroplating a black nickel-zinc alloy deposit

Abstract: BLACK ELECTROPLATES ARE OBTAINED FROM AN ALKALINE SOLUTION OF NICKEL, ZINC, AND POLYETHYLENEIMINE.

Electrolytic treatment of nonferrous metals

Abstract: A two-step electrochemical treatment of a nonferrous metal article in which a first coating of electrolytic chromium plate is deposited on a nonferrous metal surface and a second or surface coating containing chromium both as an oxide of chromium and as metallic chromium is electrolytically codeposited over the chromium plate from a chromic acid solution containing an electroplating additive, preferably a halide ion. A duplex coating is formed which imparts very good corrosion resistance with small amounts of coating material and provides a paintable surface without a painting pretreatment.

Electro-depositing silver alloys

Abstract: 1283024 Electro-forming, electro-plating silver alloy BJS ELECTRO-PLATING CO Ltd 8 Feb 1971 [22 Jan 1970] 3206/70 Headings C7A and C7B An alloy of Ag with Se or Te is electrodeposited, either to electro-form an article or part e.g. on metallized plastic or as an electroplate on a metal (e.g. Cu) substrate, from an electrolyte into which Ag and from 0A1 to 5% Se or Te by weight of the Ag are anodically dissolved, e.g. from a single consumable Ag-Se or Te alloy or two anodes: a main Ag anode and an auxilliary anode wholly or partly of Se or Te. Preferably an alkaline cyanide electrolyte is used, e.g. containing AgCN, KCN, K 2 CO 3 , KNO 3 with EDTA or ethylene diamine for complexing Ag; a thiosulphate or other S compound may be also present. The Ag alloy article or part may be precipitation-hardened at 200-400‹C.

Multiplication of metal surface,by electroplating or anodic dissolution

Abstract: CREASED CURRENT DENSITY AT THE CATHODE IS ACHIEVED AND THE HARMFUL EFFECT OF THE RELEASED HYDROGEN IS AVOIDED. A METHOD OF AND AN APPARATUS FOR MULTIPLYING THE EFFECTIVE AREA OF A METAL SURFACE BY ELECTROPLATING AND/OR ANODIC DISSOLUTION BY USING A HIGH DENSITY ELECTROPLATING CURRENT WHILE AT THE SAME TIME THE CURRENT DENSITY AT THE START OF THE ELECTROPLATING CAN BE SUITABLE FOR MAINTAINING THE COHESION WITH THE ORIGINAL SURFACE, AND SIMULTANEOUSLY NEUTRALIZING ALL ANOMALIES WHICH RESULT FROM A STEADY STRONG HYDROGEN RELEASE WHICH CANNOT BE NEUTRALIZED THROUGH THE KNOWN METHOD OF CATHODE MOVEMENT, THE IN-

Electroplating of aluminum

Abstract: ALUMINUM IS ELECTROPLATED UPON METALLIC SUBSTRATES BY IMMERSING THE SUBSTRATE AS A CATHODE IN AN ELECTOYTE WHICH IS AN ELECTRICALLY CONDUCTIVE ORGANOALUMINUM COMPLEX. AN ALKYL HALIDE IS INCLUDED IN THE ELECTROLYTE IN AN AMOUNT OF FROM 1 TO 10 WEIGHT PERCENT AND FUNCTIONS AS A DEPOSIT MODIFIER.