Showing papers on "Electroplating published in 1975"

Conduction system for thin film and hybrid integrated circuits

Abstract: A metallization scheme for interconnection of elements in thin film and hybrid circuits is described. A thin layer of titanium is first formed, preferably by evaporation or sputtering, on the surface of the insulating substrate. A thin layer of copper is then formed in the same manner over the titanium layer. This is followed by electroplating of copper to a desired thickness onto selected portions of the Ti-Cu multilayer. Successive layers of nickel and gold are then selectively electroplated onto the plated copper regions. An additional layer of palladium may also be included between the titanium and copper layers for improved adhesion. The Ti-Cu-Ni-Au metallization system has been found unusually compatible with the major processing requirements of thin film circuits, for example, thermocompression bonding, soldering, via-hole coverage and resistor stabilization.

Metal plating of polymeric substrates

Abstract: Methods are disclosed for the metallizing of non-metallic substrates, i.e. polymeric substrates, by the coating of the substrate with polymerizable monomers in the presence of a small amount of silver ion. The substrate is cleaned, acid etched and then contacted with a monomer solution containing a soluble silver salt. The monomers are preferably polyfunctional and form a polymerized layer grafted onto the polymer substrate. A peroxide is also disclosed in the monomer solution for regeneration of the silver ion concentration and to combine with monomers to produce homopolymers which also attach to the active sites on the substrate and to side chains of the graft polymer. The grafted layer contains silver atoms closely bound to it and the silver atoms form nucleating agents for the deposition of copper from an electroless plating bath. The metallized substrate may then be further electroplated.

Monolithic ceramic capacitor

Abstract: A monolithic ceramic capacitor having fritless electrodes of nickel or other base metal particles coated with a precious metal such as platinum. The coating may be very thin and typically applied by electroless plating and/or electroplating. The particles may be used as the sole pigment for the electrodes or the particles may be mixed with other compatible pigments.

Electroplating contacts of printed circuits

Abstract: A printed-circuit board requiring precious metal electroplating of its contact finger areas is adapted for such plating by a temporarily affixed electroplating current carrier of metallic foil held in contact with other printed wiring interconnected with the contact finger areas. The metallic foil is shielded from contact with electroplating baths by a strip of dielectric plastic film, the film and the foil being temporarily held in a selected position on the board by a layer of non-setting pressure-sensitive adhesive.

Chemical Nickel Plating

Abstract: Metal layers can be deposited from aqueous solutions not only by electric current as in electroplating but also by strong reducing agents. Chemical deposition of nickel on metallic and nonmetallic substrates, together with the long-known silvering of glass, are the most widespread examples. This remarkable reaction has recently found a variety of industrial applications mainly in the preparation of corrosion-resistant, hard, and wear-resistant protective layers, in the metallizing of plastics, and in electronics.

Process for the treatment of metal surfaces by electro-deposition of metal coatings at high current densities

Abstract: A method of electroplating a crack-free hard chromium deposit comprises having present in the electroplating bath a complex halogen-containing compound which disassociates in an aqueous solution while maintaining the bond of a halogen in the complex. A plating voltage is used which periodically superimposes high voltage pulses on the base voltage.

Tin-gold electroplating bath and process

Abstract: Disclosed is an aqueous electroplating bath suitable for plating a tin-gold alloy and a process of plating employing that bath. The bath contains gold as the auricyanide complex and tin as a stannic halide complex. The bath is operated at a pH value not in excess of 3. Where desired, the bath also contains a brightener. The electroplating bath is extremely stable and produces high quality electrodeposits.

Electroplating method and apparatus

Abstract: An electroplating method is disclosed and includes the rotation of a substrate, submerged within an electrolytic solution, under the application of ultrasonic waves, and the ejection of the electrolytic solution containing bubbles in a direction opposite the direction of rotation of the substrate. The electroplating apparatus for electroplating the substrate submerged within the electrolytic solution disposed within an electrolytic cell applies ultrasonic waves to the solution and additionally includes a driving device for rotating the substrate, a bubble generator for entraining bubbles within the electrolytic solution, and an ejector for ejecting the electrolytic solution containing the bubbles generated by means of the bubble generator in a direction which is opposite to the direction of rotation of the substrate.

Method of electroplating precious metals in localized areas

Abstract: A method of electroplating precious metal in localized areas. The deposits obtained are usually nonuniform and limited to only those areas where coating is actually required thus offering considerable economic savings. The method uses shaped anodes approaching the cathodes very closely, high parallel flow rates of electrolyte and high current densities of at least 100 milliamperes per cm.2 in order to electroplate the precious metal quickly. The preferred precious metal is gold. The method is applied to the coating of electronic circuits and components such as connectors and switches.

Acidic plating bath and additives for electrodeposition of bright tin

Abstract: An aqueous acid tin electroplating bath contains as a brightening agent an alkoxy naphthalene carboxaldehyde, certain emulsifying agents and certain synergistically acting carboxylic acids, amides, and esters to give extremely bright electrodeposits

Method and apparatus for electroplating

Abstract: A method and apparatus for electroplating elongated metal pieces, such as bars, pipes, cylinders, according to which an electroplating bath is provided between an electrode and the surface opposite thereto of the piece to be plated; the electrode and associated electroplating bath are moved along the surface of the piece to be plated, while replenishing the electroplating liquid.

System for electroplating a sequence of moving plate members

Abstract: A continuously operating system is provided to convey a sequence of steel plates in a generally vertical positioning to a plating station where a plurality of power supplied interlinked cathode-plate conveyor members are arranged to carry each plate past a vertically elongated plating head which contains an anode and the electroplating solution. The anode is also vertically elongated, and is adjustably positioned in the plating head or container to be relatively close to the face of the steel plate which is being plated but, at the same time, provides a space for the plating solution to have turbulent flow between the anode and the moving plate. A second plating head may be positioned along side the first to provide for the depositing of a nodular form of copper onto the initial deposit.

Tin-lead acidic plating bath

Abstract: A method for electroplating tin-lead compositions, a bath for electroplating of tin-lead alloys and stable, solid salt compositions for make up of a bath for plating the tin-lead alloys, said bath contains, besides the two metals, thiourea, potassium, hypophosphite and hydrochloric acid with the pH of the bath being from 0.5 to 1.5.

Surface treatment electroplating or electroforming - where strip substrate is fed over fine jets of treatment liq

Abstract: Device for undertaking a treatment- or prodn.- operation on at least one of the surface of a flexible strip substrate, using a treatment liq. The novelty is the use of a liq. feeder unit possessing a convex cylindrical surface (I) and contg. a liq. under pressure, surface (I) possessing numerous fine outlet holes in contact with the strip substrate, which is fed over surface (I) using longitudinal tension. The tension may be constant or adjusted to suit the pressure of the treatment liq. The continuous substrate may be a conductor or non-conductor, and may be used to form a deposit subsequently removed from the substrate and/or in electrochemical processes. Used e.g. for anodic oxidn. of al; pickling; electroplating of plastics or metals; or electroforming.

Elimination or control of acid mists over electrolytic cells

Abstract: The formation of acid mist or spray over electroplating tanks, such as in the electrowinning of copper, is substantially inhibited by utilizing a tank system in which the surface of the electrolyte has floating thereon a freely movable assembly of floatable elongated members arranged parallel with the electrodes therein across the surface of the electrolyte between the electrodes and extending beyond the sides of the electrodes in parallel self-locating relationship.

Method of and electrolytic bath for the electrodeposition of semibright nickel and nickel-cobalt coatings upon a metal surface

Abstract: Semibright (matte-gloss) coatings of nickel or nickel-cobalt are deposited on a metal substrate from a WATT'S-type sulfamiate or fluorobate electroplating bath at a pH of 2.5 to 5.8, a temperature of 15° to 70° C and a current density of 0.5 to 20 A/dm 2 in the presence of a substance which deposits with the metal and ensures a semibright or matte-gloss finish. The substances form in situ within the bath from a cationic or amphoteric first component and a second component consisting of an organic anion interactive with the first component to produce a flocculate.

Electrolysis appts. for recovering silver from aq. soln. - comprising vertical tubular anode, concentric ring of vertical cathode bars, a second anode and filter for metal powder

Abstract: Device for electrolytic recovery of metals, esp. Ag. from aq. solns., uses a vertical tubular anode, a cathode, a top inlet between the electrodes and a bottom outlet. The novelty comprises the use of several vertical cathode bars arranged in a circle round the anode; and between the bottom ends of the cathodes and the outlet is a filter for catching the amorphous metal powder deposited on the cathodes. The concentric ring of cathode bars is pref. located on both the outside and the inside of the tubular anode; and a second anode is used at the middle of the tank. The cathodes are pref. highly polished stainless steel bars, the anodes graphite. Used for recovery of Ag from electroplating rinsing baths, also for the recovery of other metals from aq. solns. e.g. Au, Cd, Cu. High current densities can be used so only amorphous metal powder is deposited on the cathodes; the powder is swept off the cathodes by the flow of soln. into the filler.

Anti-oxidation coatings

Abstract: An anti-oxidation coating, particularly for the exposed peripheral regions of graphite brake discs for aircraft, comprises a layer of silicon on the surface of the graphite, a layer of nickel overlying the silicon layer and a layer of chromium overlying the nickel layer. The silicon layer is suitably formed by flame-spraying followed by arc-melting, and the nickel and chromium layers by electroplating.

Additives for bright plating nickel, cobalt and nickel-cobalt alloys

Abstract: An acidic aqueous solution for use in bright nickel, cobalt, or nickel-cobalt alloy electroplating which includes nickel, cobalt, or nickel-cobalt ions respectively, and at least 0.005 but not exceeding 0.3 grams per liter of the solution consisting of diethylaminopropyne sulfate. The invention also relates to a process for producing bright nickel, cobalt or nickel-cobalt alloy deposits which comprises electrodepositing nickel, cobalt or nickel-cobalt alloy from an aqueous acidic solution containing at least one salt of nickel, cobalt or nickel-cobalt and containing as an addition agent from about 0.005 to about 0.3 grams per liter of the solution consisting of diethylaminopropyne sulfate. In the process, the solution may be heated above 60° C so as to increase the efficiency of the process.

Cadmium electroplating process and bath therefor

Abstract: An aqueous cadmium electroplating bath containing cadmium ions, sulfuric and/or fluoboric free acid and a surfactant comprised of a combination of a cationic polyoxyalkylated amine compound and an anionic surfactant. Preferably, the bath also contains one or more brighteners.

The surface structure of gold films

Abstract: For most industrial applications gold is used in the form of thin layers. This is especially true for components in the electronics and telecommunication industry, where it is applied, for example, in the production of conductor networks and for many types of contacts. The mechanical, chemical and physical properties of gold make it easy to apply to a variety of substrates, among which metals and ceramics are, of course, the most prominent. Depending on the application, and on the thickness needed, various processes for deposition are utilised, including vacuum evaporation, sputtering in an inert gas, the production of inlay contact bi-metal strip by rolling, welding, electroplating and, particularly on ceramics, deposition in finely divided form with an admixture of fluxes, the so-called thick film technology. In the course of a research programme sponsored by the Stifterverband der Deutschen Wissenschaft a comparative investigation has been made on the properties of fine gold layers produced by thermal vacuum evaporation, radio frequency sputtering, electroplating, and rolling. Surface topography, wear resistance, porosity and annealing behaviour for layers of various thicknesses were investigated. In this brief report only the results on surface topography and its change with annealing temperature will be discussed.

Thioether sulfonates for use in electroplating baths

Abstract: A composite nickel-containing electroplate is formed on a base metal surface by electroplating on the surface an adherent nickel or nickel alloy layer having a thickness of from about 0.15 to 1.5 mils and an average sulfur content of less than about 0.03%. An intermediate nickel or nickel alloy layer, having a thickness of from about 0.005 to 0.2 mils and an average sulfur content of from about 0.05 to 0.3% is then electroplated on the lower layer. An adherent upper nickel or nickel alloy having a thickness of from about 0.2 to 1.5 mils and average sulfur content of from about 0.02 to 0.15% is then electroplated on the intermediate layer, the upper layer containing a lower percentage of sulfur then the lower layer. The source of sulfur, for at least the intermediate layer, is provided by including novel thioethersulfonates of nitriles or amides in the plating bath for that layer.

Zinc anode benefaction

Abstract: This invention relates to an improved method of electroplating zinc while simultaneously effecting enhanced anode corrosion characteristics, which comprises passing current from a zinc anode to a metal cathode through a plating solution containing at least one organic brightener, a chloride-containing salt providing chloride anions and boric acid as a buffer in the absence of ammonium cations, chelating agents, and complexing agents for a time period sufficient to deposit a zinc electrodeposit upon said cathode; the improvement consisting of the current passing through an aqueous acidic bath composition containing zinc sulfamate providing zinc cations for electroplating zinc.

Solderable silver-metal oxide electrical contact composite - has backing layer of silver-copper alloy

Abstract: The ag-metal oxide contact is backed up on one side with a solderable Ag-Cu alloy which wets the composite workpiece. Pref. the alloy contains 10-28% Cu and is fused onto the surface of the contact. More pref. the Ag-metal oxide contact is initially electroplated with Ni prior to bonding with the Ag alloy. The solderable layer is oxide free and brazing alloys are readily joined to it. Typically the Ag-metal oxide component contains 10% CdO and the initial thickness of the Ag-Cu layer is 1.5 mm. The composite is subsequently rolled to an overall thickness of 2mm with intermediate annealing.

Method of local electroplating of strip material

Abstract: Local electroplating of strip material by means of a cylinder which is non-conductive at its surface and wets the workpiece and by means of at least one separate anode. The strip material is preferably fed in a direction parallel to the axis of the cylinder.

Negative plate for lead-acid accumulator - has expanded copper base dipped in tin bath followed by electro-plating with lead

Abstract: To reduce the plate weight for lead-acid accumulators and to increase the conductivity at increased mechanical strength a negative electrode made of expanded copper is used. This is tinned and is then covered with a layer of lead. To avoid poisoning of the lead by the copper during the electro-chemical reactions the tin layer must have a thickness of 0.2 mm and any pockets or holes in the layer must have a diameter of less than 0.2 mm. The tin layer is obtained by dipping the copper electrode into a bath of molten tin at a suitable temperature. The lead layer is obtained by electro-plating to a thickness of 0.15 to 0.2 mm.