Showing papers on "Electroplating published in 1980"

Rotary electroplating cell with controlled current distribution

Abstract: An apparatus and a method for rotary electroplating a thin metallic film having a uniform thickness and composition throughout. The apparatus includes a flow-through jet plate having nozzles of increasing size and uniformly spaced radially therethrough, or the same sized nozzles with varying radial spacing therethrough so as to provide a differential flow distribution of the plating solution that impinges on the wafer-cathode where the film is deposited. The spacing and size of the nozzles are critical to obtaining a uniform thickness. The electrical currents to the wafer and to the thieving ring are controlled by variable resistors so as to keep the electrical current to the cathode constant throughout the plating process. In a preferred embodiment the flow-through jet plate has an anode associated therewith in which the exposed area of the anode is maintained at a constant amount during the deposition. This method can simultaneously deposit with a uniform thickness and composition elements having a minimum gap or part size of 1 micrometer or less.

Surface melting of a substrate prior to plating

Abstract: Substrates for use in electrical contacts are prepared prior to plating by rapid surface melting by means of a laser beam or an electron beam. Improved microscopic surface characteristics are obtained. In a preferred embodiment, improved macroscopic surface roughness characteristics are also obtained by shorter-duration melting, typically by means of a pulsed YAG laser. Gold which has been electroplated onto copper alloys prepared by this technique has shown improved resistance to sulfur and chlorine corrosive atmospheres. This allows, for example, a thinner layer of a protective metal to be used to obtain a given degree of protection.

Method for the production of copper-boron carbide composite

Abstract: A process for manufacturing nuclear radiation shields consisting of neutron-absorbing boron carbide particles embedded in a heat-dissipating copper matrix. Copper is electroplated through a layer of loose, electrically nonconductive boron carbide particles on a metal substrate. The carbide particles may be deposited on the substrate while electroplating, and heat exchanger ductwork may be incorporated. To make cylindrical shields, a cylindrical metal substrate is rotated about its axis giving rise to centrifugal forces which hold the carbide particles on the inner surface and aid electrodeposition. A thermo-mechanical process is described in which boron carbide particles pre-encapsulated with copper are consolidated into a unitary mass on the inner surface of a heated cylindrical substrate with or without the aid of a roller within the cylinder.

Apparatus for electroplating particles of small dimension

Abstract: The thickness, uniformity, and surface smoothness requirements for surface coatings of glass microspheres for use as targets for laser fusion research are critical. Because of their minute size, the microspheres are difficult to manipulate and control in electroplating systems. The electroplating apparatus (10) of the present invention addresses these problems by providing a cathode cell (20) having a cell chamber (22), a cathode (23) and an anode (26) electrically isolated from each other and connected to an electrical power source (24). During the plating process, the cathode (23) is controllably vibrated along with solution pulse to maintain the particles in random free motion so as to attain the desired properties.

Preparation of metal plated polyamide thermoplastic articles having mirror-like metal finish

Abstract: Disclosed is an improved process for preparing metal plated thermoplastic compositions by electroless metal deposition and subsequent electrolytic plating. This process comprises the sequence of etching a filled thermoplastic resin substrate with dilute acid solution, treating with a sensitizer such as a tin salt, activating with a noble metal salt solution, electroless metal deposition using an electroless copper or nickel plating solution, and electrolytic plating with a metal selected from the group consisting of copper, nickel, chromium, or combinations thereof. The improvement is in the use of a wollastonite filler having an average particle size of less than about 3.5 microns, wherein 95 numerical percent of the particles are smaller than 10 microns in the longest dimension. The resulting electroplated articles exhibit a mirror-like finish and a peel strength of at least about 3 lbs./in. Also disclosed is a nylon-6 plating composition useful in the process containing the above-described wollastonite filler and an organosilane coupling agent.

Electroplating of nickel-iron alloys for uniformity of nickel/iron ratio using a low density plating current

Abstract: Electroplating nickel-iron alloys onto objects having complex topographical shapes with projections and hollows such as upper pole pieces of thin film magnetic recording heads has been found to yield a substantial variation in nickel-iron alloy composition from point to point within a single pattern. Providing a low total dischargeable ion concentration in the bath is helpful to reduce such variations when plating in the 80:20 Ni:Fe alloy range. That is, it is desirable to use a low value of Fe ++ and Ni ++ ion concentrations and a relatively low current density to operate at the relatively flat peak of the curve of the iron percentage in the plated alloy vs. current density curve. The curve can be raised or lowered by increasing or decreasing the total dischargeable ion concentration respectively for a given Ni ++ /Fe ++ ion ratio. The preferred Fe ++ ion concentration range for Ni:Fe alloy ratio near 80:20 is about 0.15-0.3 g/l for a range of 10-14 g/l of Ni ++ ion in a solution with a pH of about 3, a temperature of about 20°-35° C. where the Ni ++ /Fe ++ ratio in the solution ranges from about 45 to 1 to about 70 to 1. Preferably, an electrolyte for reducing pitting such as 0-100 g/l of NaCl is employed. The cation (Na + ) of the latter electrolyte should not be a dischargeable ion. Plating current density is preferably between about 2 ma/cm 2 and 12 ma/cm 2 , and optimum results are achieved for values from about 4 to 8 ma/cm 2 .

Method for selectively electroplating portions of articles

Abstract: A plurality of articles are advanced in continuous sequence in spaced relation to each other through an electroplating bath to pass in sliding engagement with a pair of lands, thereby to move selected, laterally-extending strips of the articles along an anode surface located between the lands in selected, closely spaced, facing relation to the anode surface. Jets of the electroplating solution are directed through a plurality of openings in the anode surface to provide a continuous positive flow of electroplating solution in a direction from the anode surface against the selected strips of the articles moving past the anode surface and to permit the flow of electroplating solution to pass between the articles while the lands substantially restrict the flow of the electroplating solution in other directions. Electrical current is directed through the flowing electroplating solution between the anode surface and the article strips for plating the selected article strips to a desired thickness.

Resin composition for plating

Abstract: PURPOSE: To provide a resin composition which permits application of electroplating directly by excluding electroplating by compounding respective prescribed ratios of a thermoplastic polyurethane, carbon black, sulfur, and metallic powder or metallic sulfide with a thermoplastic resin. CONSTITUTION: A resin composition for plating consisting of compounding 1W 30pts.wt. a thermoplastic polyurethane, 15W70pts.wt. carbon black, 0.05W7pts.wt. sulfur and 1W20pts.wt. metallic powder or metallic sulfide to thermoplastic resin 100pts.wt.. Powder of Ni, iron or the like is used for said metallic powder and zinc sulfide, antimony sulfide, etc. are used for the metallic sulfide, respectively. This resin composition excludes electroless plating (chemical plating) processes completely and permits direct electroplating. When strike nickel plating is applied on the moldings of this resin composition, the moldings exhibit ≥2.0kg/ cm plating adhesive strength within 5min/dm 2 throwing power time, and have a good appearance free from pinholes and the like. COPYRIGHT: (C)1982,JPO&Japio

Electrode and sludge collector support device and electroplating therewith

Abstract: An electrode and sludge collector support device is provided which permits the immersing of electrode and sludge collector into an electrolytic plating bath and which permits the removal of spent electrodes and subsequent replacement of electrodes without the removal of the sludge collector from the bath.

Zinc-nickel alloy electroplating bath

Abstract: An aqueous bath for producing a bright zinc-nickel alloy electroplated deposit. The bath includes a soluble zinc containing compound, a soluble nickel salt, an ammoniated electrolyte, a non-ammoniated electrolyte, a non-ionic polyoxyalkylated surfactant and an aromatic aldehyde. The bath can also be ammonia-free, wherein the bath also includes boric acid and an aromatic carbonyl compound.

Surface texturing of fluoropolymers

Abstract: This invention is concerned with providing improved surface texturing for adhesive bonding, metal bonding, substrate plating, decal substrate preparation, and biomedical implant applications. The invention is particularly concerned with epoxy bonding to polymers that typically exhibit low adhesion and bonding metals to a desired thickness to a polymer substrate. The surface 12 to be bonded is first dusted in a controlled fashion to produce a disbursed layer of fine mesh particles 14 which serve as masks. The surface texture is produced by impinging gas ions on the masked surface. The textured surface takes the form of pillars or cones. The bonding material, such as a liquid epoxy, flows between the pillars which results in a bond having increased strength. For bonding metals a thin film of metal is vapor or sputter deposited onto the textured surface. Electroplating or electroless plating is then used to increase the metal thickness to the desired amount.

Process for the preparation of low overvoltage electrodes

Abstract: An improved process is described for the electrodeposition of both a low overvoltage metal and a sacrificial metal onto an electrically conductive substrate. The sacrificial metal is later removed by leaching the electrodeposited substrate with alkali metal hydroxide. The improvement comprises adding a sacrificial metal to the electroplating solution after electrodeposition is initiated. The amount of electric current supplied to the electroplating solution during electrodeposition may be increased or decreased over time intervals to increase the surface area and the electrochemical activity of the electroplated substrate.

High speed electroplating

Abstract: An electroplating arrangement, particularly suitable for forming stamper plates for video or audio recordings. The arrangement has a means for inhibiting flow of electrolyte from the region of the anode to the cathode. This means may be a tube which encloses the region between the cathode and anode and has a plurality of inwardly facing holes. Filtered electrolyte is supplied to the tube.

Electroplating device and method

Abstract: The invention relates to the plating of conductive components by electrolytic deposition. An electroplating device in accordance with the invention comprises at least one electrolytic cell containing a tubular anode and having inlet and outlet connections for a bath of electrolyte flowing longitudinally through the anode. A removable component-holder of the device comprising means for gripping a component for plating, which component holder is electrically connected to a cathode-supply plate and is adapted to be mounted on the cell to close it and suspend the component along the axis of the anode. The device can be used inter alia for plating with hard chromium.

Observation of the tin whisker by micro‐Auger electron spectroscopy

Abstract: An observation by micro‐Auger electron spectroscopy has been made of the tin whisker grown on electroplated tin films. Direct experimental evidence has been obtained for the existence of zinc and oxygen impurities on tin whiskers as well as on the electroplated film surfaces when a brass or zinc‐coated metal is used as a substrate. The localization of these impurities on these surfaces may be related to the growth mechanism of tin whiskers or to the driving force by lowering the surface energy.

Method of making printed circuit boards

Abstract: A process of making printed circuit boards in which the individual substrates involved are hot set formed from a suitable thermosetting resin and filler composition, with the cure being limited to the resin B stage. The side surfacing of the individual substrates that is to bear the metallic electrically conductive circuiting is catalyzed and then electrolessly plated with copper or the like electrically conductive metallic material to a thickness in the range of from about 50 to about 100 millionths of an inch, and thereafter the thusly plated substrates are hot set to fully cure same and perfect the bond between the substrate and its plating. Each substrate then has a masking and non-conductive resist applied to its plated side (that is to bear the circuit), in a pattern that defines the printed circuit configuration and exposes the underlining electroless plating in the configuration of the circuit for electroplating, after which the substrate is electroplated with copper or the like in the circuit defining voids of the resist thereafter, the resist is stripped from the substrate, and the electroless plating thereby exposed is removed by etching.

Process of electroplating a platinum-rhodium alloy coating

Abstract: The present invention provides a process of electroplating a platinum-rhodium alloy coating of predetermined composition and predetermined thickness on a metal substrate. The composition is substantially uniform throughout the electrodeposited coating. The process includes the steps of electrolytically dissolving an anode made of platinum or rhodium into a molten cyanide bath to prepare separately a platinum bath and a rhodium bath, forming a mixed bath having a predetermined ratio of platinum to rhodium from the separate platinum and rhodium baths, and electroplating platinum and rhodium onto a metal substrate, using a predetermined electrical charge and alternating a platinum anode with a rhodium anode, while monitoring and controlling the deposition potential of the metal substrate. This coating substantially corresponds in composition to the composition of the mixed bath. The process is carried out in a dry, inert gas environment. The molten cyanide bath is moisture-free, and there is immersed in this bath a selective ion transport membrane, such as a Pyrex, that maintains the cathode in a moisture-free cyanide bath separate from the bath in which the anode is immersed. Also provided is a process wherein the electroplating step is followed by an alloy electrodissolution step.

Steel material with plural plating layers

Abstract: PURPOSE:To prevent the rust formation caused from pinholes generated on a surface of an electrodeposited painting surface by a method wherein a Fe type continuous coating surface is formed on a steel plate subjected to the cation electrodeposition painting and an inner layer is coated with a corrosion resistant metal. CONSTITUTION:In carry out the cation electrodeposition painting against a surface of a steel plate plated with Zn or a Zn alloy such as a steel plate for an automobile, an electroplating layer of Fe is formed on a surface of the above described steel plate plated with Zn or the Zn alloy. If the cation electrodeposition painting is applied thereon, a cause of the local rust formation due to the pinholes generated on the electrodeposition painting surface is prevented from being generated. If the cation electrodeposition painting is directly applied on the steel plate, because excellent corrosion resistance is shown in a coating existing condition but the corrosion resistance is extremely low after the coating is broken, a Zn type plating layer excellent corrosion resistance is further interposed thereunder to enhance the corrosion resistance of the painted steel plate over a long period.

Method of electroplating tin and alkaline electroplating bath therefor

Abstract: An improved electroplating process and electroplating bath therefor is disclosed which is adapted to electrodeposit a tin-bismuth alloy. The electroplating bath contains tin ions, an alkali metal hydroxide, and bismuth citrate. Bismuth citrate exhibits relatively high solubility in hot alkaline alkali metal stannate electroplating baths when compared to conventional alkali metal bismuthates or other bismuth compounds which in general have poor solubility in hot alkali metal stannate electroplating baths. An improved process is provided for electrodepositing a tin-bismuth alloy on panels as adherent and uniform plates without signs of staining or tin-bismuth nodules. An additional and important feature of this invention is the advantageous blending of the bismuth citrate with the alkalic metal stannate in the dry solid state, if and when desired.

Method for electroplating

Abstract: PURPOSE: To stabilize the composition of a plating bath and enable to operate for a long period by providing an insoluble auxiliary anode, in addition to a soluble anode, in an aqueous acid soln. via a cation exchange membrane in a plating tank, and flowing a part of current thereto for plating. CONSTITUTION: In a plating tank 1, an insoluble auxiliary anode 5 delineated by a cation exchange membrane 3 is additionally provided, aside from a soluble anode 7, and an aqueous acid soln. is filled therein. A DC power source 6 is connected in series to the auxiliary anode 5 via a current controller 9 and an ammeter 8. The current corresponding to the difference in the current efficiencies of the soluble anode 7 and cathode 10 in the plating bath 2 is flowed to the auxiliary anode 5, whereby electroplating is accomplished. The rate of the current supply to the auxiliary anode 5 is controlled by the current controller 9 according to the fluctuations in the pH value of the plating bath 2. For example, titanium, platinum or the like is used for the auxiliary anode 5. Thereby, hydrogen ions may be supplied to the plating bath through the cation exchange membrane 3, and the increase in the pH and the metallic ion concn. of the plating bath 2 may be suppressed. COPYRIGHT: (C)1981,JPO&Japio

Electroplating bath and process for white palladium

Abstract: Particular electroplating baths suitable for obtaining white deposits of palladium metal. The bath comprises (a) palladosamine chloride; (b) an ammonium salt such as ammonium sulfate or ammonium chloride; (c) chloride ions; and (d) a brightener selected from the group of organic brighteners, inorganic brighteners, and mixtures thereof. The process of using such electroplating baths to produce white deposits of palladium metal on substrates is also disclosed and claimed.

Zn type alloy coated steel plate of superior corrossion resistant phosphating property having two-layer coating layers

Abstract: PURPOSE:To improve corrosion resistance, phsophating property and properties of painted plates by forming a single metal plating layer of Ni, Co, Sn, Cu, etc. on the surface of a steel plate, then subjecting to form an alloy plating layer of one or >=2 kinds of Ni, Fe, Sn, Mn, etc. and Sn. CONSTITUTION:In order to improve the corrosion resistance, of a steel plate as a steel plate for automobiles, first one kind of Ni, Co, Sn, Cu, etc. is electroplated to 0.03-1.50mu thicknesses. Next, a Zn type alloy contg. one or >=2 kinds of Ni, Fe, Sn, and Mn at 10-95% ratios is electroplated on this single metal plated layer to 1-10mu thickness. The corrosion resistance and phosphating property of the steel plate and the corrosion resistance and weldability after painting are improved by the above-mentioned double plating layers.

Composition and method for gold plating

Abstract: A bath for electroplating hard gold deposits at relatively high current efficiencies comprises an aqueous solution of a phosphate electrolyte, 1-hydroxyethylidene-1,1-diphosphonic acid, metal constituent, alkali metal gold cyanide and a small amount of free alkali metal cyanide. The bath is maintained at a pH of 3.0-13.0 and operated at a current density of 0.1-165 amperes per square decimeter.

Suppressing method for oxidation of tin in golddtin alloy electroplating

Abstract: PURPOSE:To suppress the oxidation of the Sn in the plating solution in a cathode chamber to Sn , even the electrodeposition characteristic of said plating and improve appearance by isolating the isoluble anode by a diaphragm and performing the gold-tin alloy electroplating. CONSTITUTION:The oxidation of Sn to Sn at the time of performing the gold- tin alloy electroplating in the cathode chamber by using the electroplating bath in which the insoluble anode of platinum or the like is isolated by a diaphragm is suppressed. The plating solution composition of this case is citric acid; 50-500g/l, potassium gold cyanide; 1.5g-60g/l, stannous chloride; 10-200g/l, and is suitably changed depending upon the rate of tin to the gold of the desired alloy. The foregoing diaphragm is desirably of the one of less than 1mu in pore size. This gold-tin alloy plating is used for brazing for bonding the crystal vibrator of a wristwatch or the like to plug part, etc.

Production of zinc-iron type alloy coated high tensile steel plate

Abstract: PURPOSE:To obtain a high tensile steel plate coated with zinc-iron type alloy of superior corrosion resistance having no unplated parts by subjecting the high tensile steel plate applied with a prescribed amt. of iron electroplating to zinc hot dipping, then to alloying heat treatment. CONSTITUTION:A slab is prepd. from molten steel which is produced in a melting furnace such as converter and is controlled of components by the addition of deoxidizing elements such as P, A, Si or the like and fortifying elements, and further it is subjected to rolling and heat treatment, whereby a steel plate to be plated is produced. Next, iron plating of >=0.50g/m is applied by an electroplating method on this steel plate to be plated, after which it is applied with zinc hot dipping in succession. Thence, the resultant laminated plated steel plate of iron and zinc is subjected to alloying heat treatment at ordinary heating temps. (480-600 deg.C) and heating time (within 10sec), whereby the intended zinc- iron type alloy coated high tensile steel plate is produced.

Electroplating apparatus and method

Abstract: An electroforming or electrodeposition system in which the depleted metallic component in the electrolyte is replenished by an electrolyzing unit having an anode chamber communicating with the electroforming electrolyte receptacle and separated by an ion-exchange membrance from a cathode chamber. An anode in the anode chamber is dissolved electrolytically to furnish the metallic component. The electroforming current is measured to indicate the rate of depletion of the metallic component from the electroforming electrolyte, the measurement signal being used to control the electrolyzing current to dissolve the metallic component from the anode so that the ionic concentration of the metal in the receptacle is maintained substantially constant.

High-speed plating arrangement and stamper plate formed using such an arrangement

Abstract: An electroplating arrangement, particularly suitable for forming stamper plates for video or audio recordings. The arrangement has a means (7) for inhibiting flow of electrolyte from the region of the anode (6) to the cathode (1). This means may be a tube which encloses the region between the cathode and anode and has a plurality of inwardly facing holes. Filtered electrolyte is supplied to the tube.

Non-contacting technique for electroplating X-ray lithography

Abstract: An apparatus and method for coating a substrate. An electrically conductive substrate is placed in an electrolytic bath with the surface to be coated facing the anode. The cathode is placed near but not touching the other side of the substrate and an electric potential is applied to both electrodes. Means are provided to prevent electroplating of the cathode.