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Showing papers on "Electroplating published in 1983"


Patent
Duane E. Bacon1, Spencer S. Hecox1
16 Dec 1983
TL;DR: In this article, a semiconductor wafer is selectively electrolytically plated to form metal deposits, such as contacts, adjacent to anodes of diode regions within such wafer by mounting the wafer in a plating chamber opposite first and second electrodes.
Abstract: An article, such as a semiconductor wafer (31), is selectively electrolytically plated to form metal deposits, such as contacts (26), adjacent to anodes of diode regions within such wafer by mounting the wafer in a plating chamber (36) opposite first and second electrodes (61 and 62), filling the chamber (36) with a metal plating electrolyte (49) and applying alternatingly plating pulses between the wafer (31) and the first electrode (61) and deplating pulses between the wafer (31) and the second electrode (62) The plating pulses are current controlled yielding a predetermined total plating current The deplating pulses are voltage controlled yielding a deplating current which tends to subside in the course of the plating operation The electrolyte in the chamber is agitated by streams of electrolyte pumped at a comparatively high rate toward the wafer (31) to break down surface layers of electrolyte adjacent to the wafer

151 citations


Patent
11 Jul 1983
TL;DR: In this article, a plastic substrate is injection molded to provide a pattern of channels in at least one of its sides to define a predetermined set of conductive paths, and the surfaces of the channels and the non-channel surfaces therebetween are metalling through one or more steps of flame spraying, a combination of electroless plating and electroplating, gas plating or vacuum deposition.
Abstract: A plastic substrate is injection molded to provide a pattern of channels in at least one of its sides to define a predetermined set of conductive paths. Both the surfaces of the channels and the non-channel surfaces therebetween are metalling through one or more steps of flame spraying, a combination of electroless plating and electroplating, gas plating or vacuum deposition. In one form of the invention the metallization over the non-channel surfaces is removed by abrading. In another form of the invention the initial metallization over the non-channel surfaces is coated with a resist prior to the deposition of another metal layer. The metal covering the channels is subsequently removed by stripping the resist and etching away the initial metallization.

107 citations


Patent
30 Dec 1983
TL;DR: In this paper, a process for the electrodeposition of a nickel chromium alloy on a catho substrate is described, which involves contacting the substrate with an aqueous electrolyte containing: about 50-125 g/l of CrCl 3.6H 2 O; about 10-125g/l NiCl 2.6 H 2 O, 10-115 g/L of formic acid; about 25-50 g /l of boric acid; and about 50 -100 g / l of sodium citrate dihydrate; adjusting the pH of
Abstract: A process for the electrodeposition of a nickel chromium alloy on a catho substrate comprises: contacting the substrate with an aqueous electrolyte containing: about 50-125 g/l of CrCl 3 .6H 2 O; about 10-125 g/l of NiCl 2 .6H 2 O; about 10-115 g/l of formic acid; about 25-50 g/l of boric acid; and about 50-100 g/l of sodium citrate dihydrate; adjusting the pH of the bath to about 1-5 and the temperature to about 20°-60° C.; and passing a sufficient current through the solution and to the substrate to effect deposition thereon of a nickel-chromium alloy.

62 citations



Patent
04 Feb 1983
TL;DR: In this paper, a conforming anode is fit into the die leaving a small clearance between the die cavity surface and the anode, and a metal layer is electroplated onto the exposed mold surfaces of the die in less than a minute by using a high current density and a turbulent flow of electroplating solution.
Abstract: A die (12) used for plastic injection molding is masked on its inner surface with a plating resist (11) to leave only a selected area exposed. A conforming anode (14) is fit into the die leaving a small clearance between the die cavity surface and the anode. A metal layer (16) is electroplated onto the exposed mold surfaces of the die in less than a minute by using a high current density and a turbulent flow of electroplating solution. The die is then assembled with a second die (12A) to form a mold. A plastic molding composition is injected into the mold cavity (19) and comes in contact with and adheres to the metal electroplate (16) more tightly than the metal electroplate adheres to the surface of the mold member. As the mold is separated, the metal electroplate reamins bonded to the plastic molding composition to form a metal-clad plastic article (26). Adhesion between the metal electroplate and the plastic can be improved by forming nodular growths on the metal electroplate. This is done by varying the current density and/or the electroplating solution flow-rate near the end of the electroplating process. The electroplating and molding steps may be sequentially combined into an automated process for the continuous production of metal-clad articles.

33 citations


Journal ArticleDOI
TL;DR: In this paper, a mechanism for the growth of whiskers was proposed, based on the experimental results of micro-Auger electron spectroscopy and X-ray micro analysis.
Abstract: Observations by micro Auger electron spectroscopy and X-ray micro analysis have been made on tin films electroplated on substrates of brass or zinc-coated copper, and on whiskers grown on the films. Direct experimental evidence has shown the existence of zinc and oxygen atoms on the surfaces both of the whiskers and the films. Copper atoms have also been detected in the whiskers and the films. A mechanism for the whisker growth is proposed, based on these experimental results. After electroplating, zinc atoms migrate onto the tin surface and bind there with oxygen atoms. At this stage, the nuclei of whiskers are formed, and the whiskers begin to grow with the aid of the internal stresses caused by the recrystallization of tin grains and/or the formation of intermetallic compounds of tin with copper.

28 citations


Patent
02 May 1983
TL;DR: In this paper, a mixture of a carbonyl-processed nickel powder and a polymer is applied to a substrate, curing the polymer, and immersing the cured polymer pattern in an augmentative replacement reaction to form a contiguous layer of conducting metal on the substrate and thereafter electroplating an additional metal layer on the contiguous layer.
Abstract: Electrical conductors having enhanced resolution/spacing and adhesion characteristics are prepared by applying a mixture of a carbonyl-processed nickel powder and a polymer to a substrate, curing the polymer, and immersing the cured polymer pattern in an augmentative-replacement/electroplating bath, to effect an augmentative replacement reaction to form a contiguous layer of conducting metal on the substrate and thereafter electroplating an additional metal layer on the contiguous layer.

26 citations


Journal ArticleDOI
TL;DR: Using the potentiostatic pluse method the kinetics of silver dissolution and silver deposition in cyanic silver salt solutions have been examined in this paper, where the exchange current densities could be verified with a rotating disc electrode.

25 citations


Journal ArticleDOI
TL;DR: Non-aqueous electrolyte solutions are nowadays intensively studied owing to their unique properties for their application in various electrochemical devices and procedures.
Abstract: Non-aqueous electrolyte solutions are nowadays intensively studied owing to their unique properties for their application in various electrochemical devices and procedures. Important advances have already been made in high-energy primary batteries, wet capacitors, electroplating, phase-transfer catalysis and electro-organic synthesis; advances are expected in further fields such as high-energy secondary batteries, non-emissive displays, solar cells, thin-film procedures and coating. A survey is given both for successful recent applications and expectations.

24 citations



Patent
28 Jun 1983
TL;DR: In this article, a method for electroplating non-metallic surfaces on a substrate (e.g., of plating hole walls in metal-clad laminates), metallic sites are formed on the surface to be plated and the resulting site-containing surface is electroplated by means of an electro-plating bath comprising a component (i.e., a dye, surfactant, chelating agent, brightener, levelling agent or pyrophosphate ions) which causes the plating to preferentially occur at the sites in comparison to
Abstract: In a method for electroplating non-metallic surfaces on a substrate (e.g., of plating hole walls in metal clad laminates), metallic sites are formed on the surface to be plated and the resulting site-containing surface is electroplated by means of an electroplating bath comprising a component (e.g. a dye, surfactant, chelating agent, brightener, levelling agent or pyrophosphate ions) which causes the plating to preferentially occur at the sites in comparison to the plating on surfaces of the same metal as the one plated out; whereby an increased rate of plating on the site surfaces is achieved with respect to the plating reaction on a surface consisting of the metal to be plated out. The method allows non-metallic surfaces to be rapidly and uniformly electroplated, without the need to electrolessly plate the surfaces first.

Patent
Joseph Anthony Abys1
11 Jul 1983
TL;DR: In this paper, a silver electroplating procedure is described, which permits rapid and efficient plating and yields ductile, adherent silver films, and is also useful for a variety of silver alloys.
Abstract: A silver electroplating procedure is disclosed which permits rapid and efficient plating and yields ductile, adherent silver films. The electroplating bath comprises silver complexed with an aliphatic polyamine compound with 3 to 20 carbon atoms. Particularly useful are such polyamines as diaminopropane (particularly 1,3-diaminopropane), diethylenetriamine, 1,4-diaminobutane, 1,6-diaminohexane, etc. The procedure is also useful for electroplating a variety of silver alloys. In addition, the bath is highly stable, does not adversely affect the base material being plated and does not contain hazardous materials which require special disposal procedures.

Patent
22 Dec 1983
TL;DR: In this article, the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, and alkyllsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and or the solderability of tin alloy deposits.
Abstract: This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, and alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound. The bath is formulated to have a cloud point above about 90° F.

Patent
23 Nov 1983
TL;DR: In this paper, a process for producing one-side electroplated steel sheet with the non-electroplating side having a high affinity for chemical conversion treatment is disclosed.
Abstract: A process for producing one-side electroplated steel sheet with the non-electroplating side having a high affinity for chemical conversion treatment is disclosed. The process comprises preparing a one-side electroplated steel sheet by applying a cathodic current thereto in an acidic plating bath simultaneously while slightly electroplating the non-electroplating surface thereof with a coating weight of 0.5 to 5 g/m2 by applying a cathodic current through said non-electroplating surface, and then applying electrolysis to said non-electroplating surface by passing an anodic current through said non-electroplating surface to thoroughly remove said electrodeposition on said non-electroplating surface.

Patent
24 Feb 1983
TL;DR: In this article, a corrosion resistant iron or steel material such as a pipe is coated with an alloy containing 70 to 80% by weight Pb, 5 to 10% of Sn and 10 to 25% of Zn by weight Zn.
Abstract: A corrosion-resistant iron or steel material such as a pipe is coated with an alloy containing 70 to 80% by weight Pb, 5 to 10% by weight Sn and 10 to 25% by weight Zn, by hot dipping and a chromate film is then applied. A copper film may be applied, preferably by electroplating, on the iron or steel surface under the alloy layer. A thermoplastic resin layer may be formed on the chromate film, if required. The coated material has exhibited considerably improved corrosion resistance, and workability.

Journal ArticleDOI
TL;DR: In this article, it is shown that the application of a thin layer of a relatively poor heat-conducting material may lead to a considerable local temperature increase, and the dimensionless parameter determining this effect is given by the product of the ratio of the thermal conductivities of bulk and layer material and that of layer thickness to laser-spot diameter.
Abstract: Laser-enhanced electroplating on good heat-conducting bulk materials is not very effective, as laser-beam irradiation results in a limited temperature rise only. It is shown, both experimentally and theoretically, that the application of a thin layer of a relatively poor heat-conducting material may lead to a considerable local temperature increase. The dimensionless parameter determining this effect is given by the product of the ratio of the thermal conductivities of bulk and layer material and that of layer thickness to laser-spot diameter.


Patent
05 Aug 1983
TL;DR: A zinc/iron alloy electroplating bath comprising a conductive aqueous solution containing zinc ions, iron ions, and a brightening additive which is a derivative of B-aminopropionic acid or a polymer thereof is described in this paper.
Abstract: A zinc/iron alloy electroplating bath comprising a conductive aqueous solution containing zinc ions, iron ions, and a brightening additive which is a derivative of B-aminopropionic acid or a polymer thereof. A semi-bright to bright zinc/iron alloy deposit can be electrodeposited from the bath onto a substrate.

Journal ArticleDOI
TL;DR: In this paper, it was shown that nickel boron composite coatings can be obtained by electroplating nickel from a bath containing dispersed Boron particles, and further heating to 400°C converts it into Ni-Ni2B composite.
Abstract: It is shown that nickel boron composite coatings can be obtained by electroplating nickel from a bath containing dispersed boron particles. This deposit heated to 300°C forms Ni-Ni3B composite. Further heating to 400°C converts it into Ni-Ni2B composite. Mechanical properties, corrosion resistance and wear resistance Ni-Ni2B composite are better than nickel or the electroless Ni-B composite in the as-deposited condition. The properties of heat-treated electroplated Ni-B composite are similar to that of heat-treated electroless Ni-B composites.

Patent
29 Dec 1983
TL;DR: In this article, a composite plated steel sheet having excellent resistance to corrosion was produced by using composite plating liquid prepd. by adsorbing a specific amt. of Na 2+, etc.
Abstract: PURPOSE: To produce a composite plated steel sheet having excellent resistance to corrosion by using a composite plating liquid prepd. by adsorbing a specific amt. of Na 2+ , etc. on oxide particles of SiO 2 , etc. having a specific grain size, charging electrostatically positive the particles and dispersing the same in a specifically composed zinc alloy plating bath in plating the steel sheet. CONSTITUTION: A material prepd. by adsorbing one or ≥2 kinds among Ni 2+ , Fe 2+ and Co 2+ at ≥2mg for each 1g on a mixture composed of one or ≥2 kinds among SiO 2 , TiO 2 , ZrO 2 , Nb 2 O 5 , Ta 2 O 5 , Al 2 O 3 having 1W100μm grain size and charging electrostatically positive the mixture is dispersed at 10W150g/l into a zinc alloy plating bath contg. 10W100g/l Zn 2+ and 5W70g/l in total of one or ≥2 kinds among Ni 2+ , Fe 2+ and Co 2+ and the pH thereof is adjusted to 1W4, by which a composite plating bath is prepd. A steel sheet is electroplated by using such composite plating bath, by which the composite electroplated steel sheet having the much improved corrosion resistance is obtd. COPYRIGHT: (C)1985,JPO&Japio

Journal ArticleDOI
TL;DR: In this paper, the authors investigated the mechanism of deposition of metallic chromium and the role of surface films in this process and confirmed that chromium deposition occurs at potentials negative to −1.6 V versus Hg/Hg2SO4 and under galvanostatic or potentiostatic conditions, the current efficiency is 30-45%.
Abstract: The investigation of the electrode reactions occurring at metal and vitreous carbon cathodes in the standard chromium electroplating solution, 200 g dm−3 CrO3 and 2 g dm−3 H2SO4, has been continued and this paper considers the mechanism of deposition of metallic chromium and the role of surface films in this process. It is confirmed that chromium deposition occurs at potentials negative to −1.6 V versus Hg/Hg2SO4 and under galvanostatic or potentiostatic conditions, the current efficiency is 30–45%. Moreover at a vitreous carbon electrode, potential step experiments lead to risingI-t transients characteristic of instantaneous nucleation and three dimensional phase growth. At potentials just prior to metal deposition the potential sweep and step experiments show clear evidence for the formation of a strongly passivating film (this may be in addition to an existing less passivating layer). The important of the film varies with H2SO4 concentration and at intermediate concentrations, potential step experiments lead to unusual oscillatingI-t transients.

Patent
Seizun Higuchi1, Minoru Kamada1, Kazuhiro Tano1, Tetsuo Fushino1, Minoru Fujinaga1 
07 Jan 1983
TL;DR: A steel sheet plated with Pb-Sn alloy is suitable for use as the material of automobile fuel tanks for containing fuel having alcoholic content as mentioned in this paper. But it is not suitable for automotive applications.
Abstract: A steel sheet plated with Pb-Sn alloy, suitable for use as the material of automobile fuel tanks for containing fuel having alcoholic content. The steel sheet has an NiSn alloy layer or a composite layer including a backing Ni layer and the NiSn alloy layer; the NiSn alloy layer or the composite layer being formed on the steel surface to have a thickness of 0.035 to 1μ; and a plating layer of Pb-Sn system alloy formed on the sole NiSn layer on the NiSn layer of the composite layer. The steel sheet plated with Pb-Sn alloy can be produced by plating the steel sheet with Ni backing, forming a Pb-Sn system alloy layer by a hot dip plating, and rapidly cooling the steel sheet. Alternatively, the steel sheet plated with Ni is subjected to successive electroplating with Sn and then with Pb, and is then treated at a specific temperature for melting and diffusing Sn into Ni to form the NiSn layer.

Patent
16 Feb 1983
TL;DR: An electrode in particular an oxygen-evolving anode for metal electrowinning from an acid electrolyte comprises a body of aluminum or other metal coated with lead or a lead alloy by electroplating preferably from a nonaqueous electrolyte.
Abstract: An electrode in particular an oxygen-evolving anode for metal electrowinning from an acid electrolyte comprises a body of aluminum or other metal coated with lead or a lead alloy by electroplating preferably from a non-aqueous electrolyte The substrate can be a sheet of aluminium or compacted particles of aluminium plated with lead or a lead alloy A sheet of lead or lead alloy is clad to the electroplated substrate and advantageously an electrocatalytic material such as surface-activated valve metal sponge is applied to the surface of the lead or lead alloy

Patent
15 Dec 1983
TL;DR: Aqueous electroplating solutions for the electrodeposition of palladium-silver alloys comprising a soluble palladium compound, a soluble silver compound and an excess of a strong acid in an amount sufficient to maintain the palladium and silver compounds in solution and process for electrolytically plating alloys are described in this article.
Abstract: Aqueous electroplating solutions for the electrodeposition of palladium-silver alloys comprising a soluble palladium compound, a soluble silver compound and an excess of a strong acid in an amount sufficient to maintain the palladium and silver compounds in solution and process for electrolytically plating palladium-silver alloys.

Journal ArticleDOI
TL;DR: In this paper, the I-E curve shows a wave or peak for the reduction of chromium (VI) to chromium(III) and it is demonstrated that this process is mass transport controlled, apparently by the transport of sulphate ions to the electrode surface.
Abstract: The electrode reactions occurring at C, Cr, Cu and Ni cathodes in the standard electroplating solution for chromium, 200 g dm−3 CrO3 and 2 g dm−3 H2SO4, have been reinvestigated. This paper emphasises the study of those reactions which lead to solution-free products; these occur at potentials positive to that necessary for film or metal deposition. For each cathode, theI-E curve shows a wave or peak for the reduction of chromium (VI) to chromium(III) and it is demonstrated that this process is mass transport controlled, apparently by the transport of sulphate ions to the electrode surface. At Cr, Ni and Cu, the potential of the chromium(VI)/chromium(III) couple is determined by the removal of an insulating oxide film which forms spontaneously when the metal is immersed in the bath. In certain conditions it is also possible to define a well formed wave for proton reduction.

Patent
28 Jan 1983
TL;DR: An electroplating bath solution comprising an alkali metal or ammonium gold sulphite, a water soluble salt of thallium metal to effect brightening and grain refining, and a non-hydroxy, non-amino carboxylic acid such as formic acid and oxalic acid to ensure that the bright gold metal deposit has a hardness lower than about 90 Knoop.
Abstract: An electroplating bath solution comprising an alkali metal or ammonium gold sulphite, a water soluble salt of thallium metal to effect brightening and grain refining, and a non-hydroxy, non-amino carboxylic acid such as formic acid and oxalic acid to ensure that the bright gold metal deposit has a hardness lower than about 90 Knoop. The method of depositing the bright gold metal on various substrates from such electroplating solutions is also described and claimed.

Patent
27 Apr 1983
TL;DR: In this article, the authors proposed a method to improve the adhesion of a Zn alloy film formed on a steel sheet by plating by electrodepositing a very small amount of a specified metal on the steel sheet before plating with an anticorrosive Zn Alloy.
Abstract: PURPOSE: To improve the adhesion of a Zn alloy film formed on a steel sheet by plating by electrodepositing a very small amount of a specified metal on the steel sheet before plating the steel sheet with an anticorrosive Zn alloy. CONSTITUTION: When one side of an automobile steel sheet or the like is electroplated with an anticorrosive Zn alloy such as Zn-Ni, Zn-Fe, Zn-Mn, Zn-Ti, Zn- Cr or Zn-Co-Cr, the steel sheet is subjected to electrolysis as a cathode in a pickling soln. contg. soluble salts of one or more among Cr, Mn, Fe, Co, Ni, Cu, In, Zn, Cd, Sn and Pb in a pickling stage before the plating stage to deposit said metals on the surface of the steel sheet by 1W1,000mg/m 2 . The steel sheet may be pickled and subjected to electrolysis as a cathode in an electrolytic soln. contg. one or more kinds of said metals to carry out preplating by 1W 1,000mg/m 2 . The steel sheet is then plated with said Zn alloy. The resulting Zn alloy film has very high adhesion to the steel sheet. COPYRIGHT: (C)1984,JPO&Japio

Patent
31 Aug 1983
TL;DR: In this paper, a zinc alloy plating film of >= 1g/m is formed by electroplating, etc., and then the plated surface is subjected to an electrolysis or coating type chromate treatment to form a chromate film of about 10-200mg/m.
Abstract: PURPOSE:To produce a steel plate coated with a highly corrosion-resistant film having excellent appearance on one side by plating a zinc alloy on one surface of the steel plate, subjecting the plated surface to a chromate treatment and forming further an org. composite silicate film thereon then subjecting the plate to a heat treatment at a relatively low temp. CONSTITUTION:A zinc alloy plating film of >=1g/m , more preferably, about 5- 40g/m coating weight is formed by electroplating, etc. on the one surface of a steel plate. The plated surface is subjected to an electrolysis or coating type chromate treatment to form a chromate film of about , more preferably, about 10-200mg/m coating weight thereon. The plated surface is successively treated with an org. composite silicate soln. to form an org. composite silicate film of about 0.5-4.0g/m , more preferably about 1.0-3.0g/m coating weight and thereafter the steel plate is subjected to a heating treatment at 50-250 deg.C to improve the corrosion resistance of each layer. The generation of a temper color is thus prevented and the steel plate coated with the highly corrosion-resistant film having good appearance on one side is thus obtd.

Journal ArticleDOI
TL;DR: In this paper, thin films of Fe-Ni alloys have been electroplated from acidic sulphate bath (0.06 mol dm−3 NiSO4, O.O15 mol Dm −3 FeSO4 and O.
Abstract: Thin films of Fe-Ni alloys have been electroplated from acidic sulphate bath (0.06 mol dm−3 NiSO4, O.O15 mol dm−3 FeSO4, 0.005 mol dm−3 ascorbic acid, 20 g dm−3 boric acid and 1 g dm−3 saccharin) containing aliphatic amines. The percentage Ni in the alloy varied with bath composition (Fe/Ni), current density, stirring of the medium, nature and concentration of the amine. Increase of temperature and pH of the medium increased the percentage Ni in the deposit. The composition of the alloy remained constant with thickness of the film. The cathodic current efficiency depends on the plating variables. The plating potential in acidic sulphate bath was shifted in the less noble direction by the presence of amines. Smooth and bright films are obtained with small grain size when the Ni in the film is 75% or above. Electroplating conditions are optimized to get thin, magnetic 20∶80 Fe-Ni films.

Patent
11 Apr 1983
TL;DR: In this article, a strip horizontally travels within an electroplating apparatus while the plating solution is applied between the strip and anode, in which relative speed of the solution to the strip, and/or current density are varied.
Abstract: A strip horizontally travels within an electroplating apparatus while the plating solution is applied between the strip and anode, in which relative speed of the solution to the strip and/or current density are varied, whereby an outer plated layer on the strip is provided with Fe-Zn alloy of high Fe content while an inner plated layer on the strip is provided with Fe-Zn alloy of low Fe content.