Showing papers on "Electroplating published in 1985"

Electrode wire for use in electric discharge machining and process for preparing same

Abstract: An electrode wire for wire electric discharge machining a workpiece at high speed and high accuracy and a process for preparing the same are provided. The electrode wire comprises a core wire made of a copper clad steel wire, 10 to 70% of the sectional area of the copper clad steel wire being occupied by copper, and a copper-zinc alloy layer covering the core wire. The copper-zinc alloy layer is prepared by coating the core wire with zinc by electroplating or hot galvanizing, followed by heating to disperse copper in the zinc layer to convert the same into a copper-zinc alloy layer wherein the concentration of zinc is increased gradually along the radially outward direction. The preferable thickness of the copper-zinc alloy layer ranges from 0.1 to 15 microns and the average concentration of zinc in the copper-zinc alloy layer is preferably less than 50% by weight but not less than 10% by weight.

Apparatus and method for controlling plating induced stress in electroforming and electroplating processes

Abstract: Internal stress on an object being electroplated is monitored continuously with a gauge. The gauge includes a metal receptor which is employed as a second cathode in the electrodeposition process. A separate plating current is supplied between the anode and second cathode, distinct from the separately controllable current between the anode and object being plates or electroformed. The stress on the second cathode is measured with a strain gauge, and a stress deviation from a desired plating stress is determined. The currents between the anode and first and second cathodes are adjusted in accordance with the measured internal stress on the metal receptor to achieve a desired stress condition. The internal stress is advantageously monitored with a foil resistance strain gauge. The strain gauge is connected to a carrier disposed in parallel with the metal receptor. The carrier is rigidly connected at opposite ends to the metal receptor. A stress transmission link centrally located between ends of the metal receptor and the carrier transmits the force applied by the electroplating material on the receptor to the carrier. The strain gauge provides an indication of the stress which results from the electroplating. The currents between the anode and first and second cathodes may be controlled in accordance with this stress measurement.

Method for electroplating non-metallic surfaces

Abstract: Method for electroplating non-metallic surfaces on a substrate, e.g. of plating holes in metal clad laminates, is disclosed. Metallic sites are formed on the surface and the resulting site-containing surface is electroplated by means of an electroplating bath comprising a component which causes the plating to preferentially occur at said sites in comparison to the plating on surfaces of the same metal as the one plated out; whereby a rate differential of the plating-reaction on site-surfaces is achieved with respect to the plating-reaction on a surface consisting of the metal to be plated out.

Electrodeposition of submicrometer metallic interconnect for integrated circuits

Abstract: Formation of a metallic interconnect pattern in submicron geometry architectures, without the photoresist being lifted off the substrate and resulting in the deposited metal being electroplated therebeneath, is achieved by a combination of a toughened-skin photoresist and pulsed electroplating. For toughening the skin of the photoresist and thereby enhancing its ability to withstand encroachment of the electrodeposited metal, the photoresist layer is illuminated with ultraviolet radiation. After the UV-irradiated photoresist has been allowed to cool, the resulting structure is placed in an electroplating bath, with appropriate electrodes disposed in the bath and connected to a said layer on the wafer for the deposition of the interconnect metal. The electrode differential is pulsed to provide a low frequency plating current through which the conductor metal is plated onto the seed metal on the wafer, as defined by the pattern of the toughened photoresist. After a prescribed, controlled electrodeposition interval during which the interconnect conductor has been plated to a desired level by the pulsed electroplating current, the wafer is removed from the bath and the photoresist layer is etched off, to leave only the electrodeposited interconnect layer and the underlying base (seed) metal. The exposed base metal is then etched leaving only the desired electrodeposited interconnect pattern.

Electrolytic bath and methods of use

Abstract: An electrolytic bath, suitable for depositing a metal on or removing a metal from a substrate is provided which comprises an anode and cathode, an acid having a pKa of about 6 or less, and a chalcogen-containing compound soluble in said bath and having the empirical formula ##STR1## wherein X is a chalcogen, each of R1 and R2 is selected from hydrogen, NR3 R4 and NR5, at least one of R1 and R2 is other than hydrogen, each of R3 and R4 is hydrogen or a monovalent organic radical, and R5 is a divalent organic radical, in which the molar ratio of the chalcogen compound to the acid is about 1 or more, and the molar ratio of water to the combination of acid and chalcogen compound is about 10 or less The electrolytic bath enables the use of higher concentrations of strong acids than would otherwise be possible, minimize hydrogen and/or oxygen evolution at the electrodes with attendant advantages, and is useful in a variety of methods such as electroplating (including immersion plating), electroforming, electrolytic machining, electropolishing, electrolytic roughening, anodizing and electrowinning

Nickel Plating on Porous Silicon

Abstract: Depot electrolytique de nickel, a partir d'un electrolyte de composition: NiSO 4 0,2 M, 6H 2 O, perchlorate de tetraethylammonium 0,1 M; le solvant est un melange 85% d'ethyleneglycol et 15% d'eau desionisee

Bath and process for plating lead and lead/tin alloys

Abstract: This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, an alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound.

Bath and process for plating tin, lead and tin-lead alloys

Abstract: This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, an alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound.

Commercial nickel phosphorus electroplating

Abstract: A plating bath for nickel and/or cobalt phosphorus amorphous alloy coating can last almost indefinitely. The anode current density of the bath is controlled so as to maintain the amount of phosphoric acid in the bath constant, and less than a level (e.g. around 0.5 molar) at which it has significant deleterious effects on the bath, i.e. maintaining the free acid concentration in the bath in an acid titer range of about 9-14. The anode current density is maintained at about 200 amperes per square foot or greater, and preferably about 500 amperes per square foot or greater, by employing an anode construction that comprises a plurality of widely spaced strips (e.g. wires) of platinum or rhodium; e.g. platinum wires each having a diameter of about 0.010 inches and, for example, a length of about 3.2 inches, and disposed vertically and generally parallel to, but spaced from, a face of a cathode-workpiece that is to be plated with nickel phosphorus, cobalt phosphorus, or nickel/cobalt phosphorus. The anode alternatively may comprise a wire extending in zig-zag fashion between a pair of spaced bus bars. The methods according to the invention are particularly useful for plating fluid jet orifice plates, electrical contacts, carbon steel or stainless steel cutlery, aluminum articles, cookware substrates (such as aluminum, stainless steel, copper, iron, or cast iron substrates), magnetic or magnetizable material such as computer memory storage discs, and wear surfaces such as thrust bearings, shafts for high speed machinery, or the like.

Method of plating plastics

Abstract: A method is provided for electrodepositing a layer of copper on a plastic substrate which method comprises: positioning the plastic substrate on a supporting member, with the supporting member being in contact at a plurality of spaced apart points with the substrate for the passage of electrical current therebetween; electrolessly depositing a thin layer of metal selected from the group consisting of copper, nickel, cobalt and mixtures thereof on a surface of the plastic substrate; positioning the supported substrate in an electroplating bath including from about 10.0 to about 45.0 g/l of copper ions, at least one acid selected from the group consisting of sulfuric acid, fluoroboric acid and sulfamic acid, with the acid being present in an amount sufficient to cause the electroplating bath to have a conductivity ranging from about 0.40 to about 0.60 mhos and from about 30 to about 150 mg/l of chloride ions; and passing electrical current through the bath so as to cause a layer of copper to be electrolytically deposited over the layer of electrolessly deposited metal.

Photoelectrochemical reduction products of carbon dioxide at metal coated p-GaP photocathodes in aqueous electrolytes.

Abstract: In order to increase the current efficiency of the photoelectrochemical reduction of CO2 in aqueous electrolytes, metals such as Pb and Zn, which have a higher overpotential for the hydrogen evolution reaction, were coated on a p-GaP photocathode by sputtering and electroplating. Au was also coated by sputtering. Then, the photoelectrolytic experiments were carried out in a gas-tight cell with a cyclic gas-flow system. The products in a gas phase were determined as well as the products in the electrolyte. Accordingly, CO in addition to HCOOH as a reduction product of CO2 was found to be produced as well as substantial amount of H2 as a by-product. However, other products such as HCHO and CH3OH were not found at all. In the case of the Pb coated p-GaP electrode, the current (faradaic) efficiency, η, for HCOOH formation was increased up to 48.2%, although in the case of bare p-GaP it was only 4.8% at maximum. On the other hand, the η for CO formation at the Zn-coated p-GaP electrode went up to 16.5%. While,...

Method for selectively plating plastics

Abstract: A method for plating first selected surfaces of a platable plastic substrate without plating second selected surfaces is disclosed. The method comprises first electrolessly plating the substrate to provide an electroless metal layer over all of the first selected surfaces and at least a portion of the second selected surfaces. The substrate is then mounted on an electroplating rack so that the current density at the second selected surfaces is lower during electroplating than at the first selected surfaces. The substrate is then electroplated to provide one or more intermediate metal layers which extends over at least all of the first selected surfaces and then electroplated with a final metal different from the metals of the electroless and intermediate layers at a voltage whereby the final metal deposits over the first selected surfaces but not over the second selected surfaces. The electroplated substrate is then immersed in a stripping solution which dissolves the electroless and intermediate metals but not the final metal for a time sufficient to dissolve the electroless and intermediate metals covering the second selected surfaces.

Process and electrolyte for electroplating tin, lead or tin-lead alloys

Abstract: A process and bath for electroplating tin, lead and tin-lead alloys. Improved brightness, solderability and broader current density ranges are achieved by the use in the baths of a soluble alkylene oxide condensate to provide a cloud point of the bath above about 90° F., a soluble bismuth compound, an aromatic aldehyde and acetaldehyde. Tin and lead are supplied to the bath as salts of alkyl or alkylol sulfonic acids with sufficient free alkyl or alkylol sulfonic acid to provide a bath pH of less than 3.

Nickel plating of refractory metals

Abstract: An improved method of depositing nickel on a clean refractory metal surface to form a multilayer article is disclosed, wherein the full thickness of nickel can be plated prior to the intermetallic bonding of the metals The metal surface is cleaned and etched prior to the application of a first layer of nickel on the surface by electroplating means After the article is rinsed, a second layer of nickel is applied to the first layer of nickel by electroplating means The article is then heated in the absence of air to cause intermetallic bonding between nickel and the refractory metal substrate

Tensile properties of acid copper electrodeposits

Abstract: For proprietary acid copper sulphate electroplating baths representing two major categories identified previously, deposit tensile properties are presented as functions of the bath additive and chloride concentrations. The effects of species that accumulate in the bath during circuit board plating and of variations in current density and the concentrations of copper sulphate and sulphuric acid are also discussed.

Bath and process for plating tin/lead alloys on composite substrates

Abstract: An electroplating bath and process for electroplating composite substrates having an electroplatable metallic portion (4) (5) and a non-conductive inorganic portion (1) (2) (3) with a tin-lead alloy which will plate only on the metallic portions of the substrate and not plate on or otherwise adversely affect the non-conductive inorganic portions.

Laser induced deposition on polymeric substrates

Abstract: A method for high resolution maskless deposition of metals onto a polymer without application of an electrical potential by contacting a polymeric workpiece with an electroplating solution and directing a laser beam through the solution onto the polymer to locally achieve plating.

Electroplating of Tungsten Carbide from Molten Fluorides

Abstract: The modification of the plating process from two-electrode to three-electrode appears to have improved the coating stucture considerably with respect to density, surface smoothness, and conformity to substrate. The surface structure of the coating is markedly dependent on plating conditions: melt composition, voltage, and even total charge passed. From a practical point of view, for producing wear resistant coatings, one would need to consider whether the cost of such a procedure was justified or whether further research should be done to improve the ''as-grown'' surface structure.

Pretreatment for electroplating mineral-filled nylon

Abstract: A method of preparing the surface of molded mineral-filled nylon to receive an adherent electrodeposited metal coating comprising the steps of: exposing the surface to a plasma glow discharge; vacuum depositing a film of chromium or titanium onto the plasma-treated surface; vacuum depositing a nickel film onto the chromium or titanium film to prevent oxidation thereof; and then vacuum depositing a copper film onto the nickel film. The plasma gas is preferably inert (e.g., argon, helium, etc.) and metal deposition is effected so as to avoid oxidation of the chromium/titanium and nickel films during processing.

Method for electroplating a zinc-iron alloy from an alkaline bath

Abstract: A method for electroplating a zinc-iron alloy from an alkaline bath which comprises electroplating a zinc-iron alloy on a metal surface from an alkaline zinc plating bath having a pH of at least 13.0 and containing 0.02 to 5 g/liter of iron solubilized with a chelating agent, thereby to form on the metal surface a zinc-iron alloy layer having excellent corrosion resistance containing 0.02 to 20% of iron based on the total weight of the deposited metal.

High‐speed electroplating of copper using the laser‐jet technique

Abstract: The laser‐jet electroplating technique has been applied to the high‐speed deposition of copper at rates up to 50 μm/s. The high plating efficiency of the Cu/Cu++ system makes the deposition rate independent of laser power (unlike that of gold). On the other hand, the morphology of the copper is greatly improved with increasing laser power. Four‐point probe measurements for laser‐jet copper depositions indicate a resistivity close to that of the published bulk value.

Method for producing a thin tin and nickel plated steel sheet for welded can material

Abstract: A method for producing a thin tin and nickel plated steel sheet having a surface structure in which the distribution of numerous nodules of metallic tin are observed by using an electron microscope on an iron-tin-nickel alloy layer formed on a steel sheet which comprises electroplating nickel on the steel sheet which is anodically treated in an alkaline electrolyte with a pH of above 10 followed by electrotinplating the nickel plated steel sheet, reflowing, quenching, and then chromate treating the tin and nickel plated steel sheet. This tin and nickel plated steel sheet is suitable for welded can materials since it is excellent in corrosion resistance after lacquering and weldability.

Manufacture of thin film photoelectric conversion element

Abstract: PURPOSE:To prevent the generation of short-circuit between a second electrode on a photoelectric conversion film and a base first electrode by a method wherein, in, after the photoelectric conversion film was formed, an electroplating is performed to form a plating formation film, a metal is made to precipitate at pinhole parts in the photoelectric conversion film, a second electrode is formed thereon, and after that, the plating formation film, an oxide film formed on the plating formation film and the second electrode in the photoelectric conversion film are all removed. CONSTITUTION:A Cr electrode 2 patterned as a first electrode is formed on an insulative substrate 1. A hydrogenated amorphous Si layer 3, which is used as a photoelectric conversion film, is accumulated. A plating formation film 4 of Cu is formed in pinholes, namely, at the exposed parts of the electrode 2 in the film 4 by an electroplating method. An InSn oxide film 5, which is used as a second electrode, is accumulated on the layer 3. The film 4 is removed by performing an etching, and at the same time, the film 5 on the film 4 is also removed as well. As a result, the generation of short- circuit between the second electrode 5 and the first electrode 2 can be prevented, because the second electrode 2 is removed from the pinhole generating parts in the layer 3.

Aluminum electroplating bath and plating method by said plating bath

Abstract: PURPOSE: To develop an electroplating bath of Al which is inexpensive and has excellent current efficiency and long service life by compounding a specific org. solvent with a molten salt bath consisting of an Al halogen compd. and alkyl pyridinium halogen compd. CONSTITUTION: The plating bath prepd. by compounding 10W75vol% arom. org. solvent such as benzene with the molten salt bath in which 40W80mol% Al halogen compd. AlX 3 (X is a halogen atom of Cl, Br, I, etc.) and 20W60mol% alkyl pyridinium halogen compd. C 5 H 5 N-R-X (R is an alkyl group of 1W5C, X is a halogen atom) is used as the plating bath to be used in the stage of electroplating Al to the surface of a cold rolled steel sheet, etc. A consumable anode consisting of an Al plate is used for the anode and the electroplating is executed by passing DC or pulse current of 0.1W10A/dm 2 current density in the plating bath kept at 0W40°C in a dry oxygen-free atmosphere of N 2 , Ar, etc. The life of the plating bath is thus extended and the Al plating layer having the excellent resistance to heat, oxidation and corrosion is formed. COPYRIGHT: (C)1987,JPO&Japio

Method of manufacturing an optical fibre comprising a coating of a metal

Abstract: Optical fibres consisting of a synthetic resin at least on their outer circumference are continuously provided with a metal coating by electroplating. For this purpose the synthetic resin coating is made electrically conductive, for example, by continuous electroless metallization.