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Electroplating

About: Electroplating is a research topic. Over the lifetime, 18865 publications have been published within this topic receiving 145334 citations.


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Patent
21 Aug 2013
TL;DR: In this article, a method and device for pulse texturing treatment of the surface of a metal material, belonging to the technical field of materials, is described, which comprises the following steps of: (1) pretreating a matrix material; (2), preparing electrolyte; and (3) after the surface surface of the matrix surface, which is cleaned, is dried, putting the dried matrix material in the electrolyte to serve as a negative electrode; and with an lead-antimony alloy as a positive electrode, applying a pulse current to the two electrodes by using a
Abstract: The invention relates to a method and device for pulse texturing treatment of the surface of a metal material, belonging to the technical field of materials. The method comprises the following steps of: (1) pretreating a matrix material; (2), preparing electrolyte; and (3) after the surface of the matrix surface, which is cleaned, is dried, putting the dried matrix material in the electrolyte to serve as a negative electrode; and with an lead-antimony alloy as a positive electrode, applying a pulse current to the two electrodes by using a power supply to obtain a chromium textured layer on the surface of the matrix material. The device comprises an electroplating tank, a temperature control device and a lifting device, wherein the positive electrode is arranged in the electroplating tank and is connected with the power supply, and the temperature control device is a temperature control tank or a coiler; and the lifting device is also arranged above the electroplating tank and consists of a lifting motor and a lifting rod. The method disclosed by the invention has a strong texturing effect and has the advantages of low cost, stable process and the like, and parameters are easy to control.

2 citations

Patent
10 Sep 2019
TL;DR: In this article, a manufacturing method for the diamond wire for efficiently cutting the silicon wafer comprises the following steps of surface modification of diamond micro-powder, pre-plating, sanding, secondary plating, cleaning, drying, wire winding and the like.
Abstract: The invention relates to the technical field of diamond wires and discloses a manufacturing method for a diamond wire for efficiently cutting a silicon wafer. The manufacturing method for the diamondwire for efficiently cutting the silicon wafer comprises the following steps of surface modification of diamond micro-powder, pre-plating, sanding, secondary plating, cleaning, drying, wire winding and the like, wherein in the step of pre-plating, two methods of chemical plating and electroplating are provided, and a bus and the diamond micro-powder are subjected to surface pretreatment to obtainmicro-nano-scale pits, so that an adhesion area of nickel ions on the bus can be enhanced, adhesion force of a nickel layer and the surfaces of diamond particles is strengthened, and finally, bindingforce of the diamond particles and the bus is strengthened, wherein by adjusting an additive proportion of a electroplating solution, current distribution, a pH value, a viscosity and a liquid flow rate, controlling an operation speed of the bus and adopting a more stable additive adding mode in the sanding process, the diamond particles can be ensured to be uniformly dispersed on a bus, the adhesion force is stable, and no agglomeration phenomenon exists.

2 citations

Patent
11 Sep 2013
TL;DR: In this article, a high-melting-point alloy sputtering electro-deposition rapid molding method is described, in which an unbaked conductive ceramic female die is used as a composite substrate, then a highmelting point alloy electroplating liquid is sputtered on the surface of the female die, after a sputtering coating achieves a given thickness, an alloy die shell of the die shell is obtained, a die frame is additionally arranged on the back surface of die shell, resin and high-strength cement backing are filled, the after-treatment such as edge cutting
Abstract: The invention relates to a high-melting-point alloy sputtering electro-deposition rapid molding method. The method is characterized in that an unbaked conductive ceramic female die is used as a composite substrate, then a high-melting-point alloy electroplating liquid is sputtered on the surface of the female die, after a sputtering coating achieves a given thickness, an alloy die shell of the female die is obtained, a die frame is additionally arranged on the back surface of the die shell, resin and high-strength cement backing are filled, the after-treatment such as edge cutting and polishing is carried out on the surface of the die shell after the die is stripped, so that a utilizable die can be obtained. The die is made of alloy, so that compared with a single-metal die, the die has excellent properties of high strength, high hardness, high temperature resistance, and the like; the service life of the sputtering electro-deposition die can be greatly prolonged, and the application range of the sputtering electro-deposition die can be widened.

2 citations

Patent
16 Oct 2001
TL;DR: A cutting tool or wear surface having diamond particles chromium mounted thereon is described in this paper, where the diamond particles are preferably less than approximately 1,000 nanometers in length.
Abstract: A cutting tool or wear surface having diamond particles chromium mounted thereon. The diamond particles are preferably less than approximately 1,000 nanometers in length. Chromium or chromium like material is preferably mounted to an article through immersion in a bath and electroplating, amongst other techniques.

2 citations

Patent
28 Oct 1987
TL;DR: In this paper, a photo resist film was applied to the core materials of a bobbin and the extrinsic parts of the bobbin were treated by a photo etching method to form a one-layer coil pattern.
Abstract: PURPOSE:To manufacture coils correctly, in large quantities and rapidly, to enable the manufacture of toroidal coils and so on, and to contrive the shortening of the manufacturing time and the improvement of the yield of the coils by a method wherein such a conductive metal as copper is adhered on core materials by such a means as electrolytic plating and plated parts are formed on this metal by a photo etching method lik as a conductive wire is wound on. CONSTITUTION:Core materials 1 for forming a bobbin are put in an electroplating tank the necessary number of pieces only and a conductive coat 2 consisting of copper and so on is formed on the peripheries of the core materials 1 by electrolytic plating. Then, a photo resist film 3 is coated on the coat 2 and unexposed parts 4 are formed for forming a coil pattern 5. The unnecessary copper is etched by treating these parts by a photo etching method, the photo resist film is removed and a one-layer coil is formed. Then, when the number of turns of coil is numerously necessitated, the width of the pattern 5 is formed narrowly or a coating of insulator is performed on the coil pattern 5 and the coil can be formed in multilayer by performing again a photo etching method.

2 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
2023259
2022519
2021261
2020729
2019905
2018844