Topic
Fabrication
About: Fabrication is a research topic. Over the lifetime, 20475 publications have been published within this topic receiving 235676 citations.
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TL;DR: In this paper, a computer model is developed to simulate the diffusion of reactants through the fiber preform, and SiC deposition on the fiber surfaces, in order to better understand the densification of the composites.
72 citations
TL;DR: In this article, a review of the research work carried out in the area of direct metal laser fabrication and their various challenges evolved during part fabrication consisting of different metals and alloys is presented.
72 citations
01 Apr 1997
TL;DR: In this article, the authors describe the use of proximal probes, such as the atomic force microscope (AFM) and the scanning tunneling microscope (STM), for nanofabrication.
Abstract: In this paper, we describe the use of proximal probes, such as the atomic force microscope (AFM) and the scanning tunneling microscope (STM), for nanofabrication. A resistless proximal probe-based lithographic technique has been developed that uses the local electric field of an STM or conductive AFM tip that is operated in air to selectively oxidize regions of a sample surface. The resulting oxide, typically 1-10 nm thick, can be used either as a mask for selective etching or to directly modify device properties by patterning insulating oxides on thin conducting layers. In addition to this resistless approach, we also describe the use of the STM/AFM to modify the chemical functionality of self-assembling monolayer films. Such modified films are used as a template for the selective electroless plating of metal films. The above processes are fast simple to perform, and well suited for device fabrication. We apply the anodic oxidation process to the fabrication of both semiconductor and metal-oxide devices. In these latter structures, sub-10 nm-sized device features are easily achieved, and we describe the fabrication of the smallest possible device, a single, atomic-sized metallic point contact by using in situ-controlled AFM oxidation.
72 citations
TL;DR: In this article, the state-of-the-art of grating fabrication in silica and polymer microstructured optical fibres is reviewed, focusing on the difficulties and challenges encountered during photo-inscription of such gratings and more specifically on the effect of the air hole lattice microstructure in the cladding of the fiber on the transverse coupling of the coherent writing light to the core region of the fibre.
Abstract: This paper reviews the state-of-the-art of grating fabrication in silica and polymer microstructured optical fibres. It focuses on the difficulties and challenges encountered during photo-inscription of such gratings and more specifically on the effect of the air hole lattice microstructure in the cladding of the fibre on the transverse coupling of the coherent writing light to the core region of the fibre. Experimental and computational quantities introduced thus far to assess the influence of the photonic crystal lattice on grating writing efficiency are reviewed as well, together with techniques that have been proposed to mitigate this influence. Finally, early proposals to adapt the microstructure in view of possibly enhancing multi-photon grating fabrication efficiency are discussed.
72 citations
TL;DR: In this article, a full-wafer process for fast and simple fabrication of glass microfluidic chips with integrated electroplated electrodes is presented, which employs the permanent dry film resist (DFR) Ordyl SY300 to create micro-fluidity channels, followed by electroplating of silver and subsequent chlorination.
Abstract: A full-wafer process is presented for fast and simple fabrication of glass microfluidic chips with integrated electroplated electrodes The process employs the permanent dry film resist (DFR) Ordyl SY300 to create microfluidic channels, followed by electroplating of silver and subsequent chlorination The dry film resist is bonded directly to a second substrate, without intermediate gluing layers, only by applying pressure and moderate heating The process of microfluidic channel fabrication, electroplating and wafer bonding can be completed within 1 day, thus making it one of the fastest and simplest full-wafer fabrication processes
72 citations