Topic
Fabrication
About: Fabrication is a research topic. Over the lifetime, 20475 publications have been published within this topic receiving 235676 citations.
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TL;DR: In this article, the thermophotovoltaic (TPV) cells with efficiencies of >40% were fabricated and measured for thermal energy grid storage (TEGS) to enable dispatchable renewable energy.
Abstract: We report the fabrication and measurement of thermophotovoltaic (TPV) cells with efficiencies of >40%. The TPV cells are 2-junction devices with high-quality 1.0-1.4 eV materials that target high emitter temperatures of 1900-2400°C. These cells can be integrated into a TPV system for thermal energy grid storage (TEGS) to enable dispatchable renewable energy. With these new TPV cells, TEGS has a pathway to reach sufficiently high efficiency and sufficiently low cost to enable full decarbonization of the grid. Furthermore, the high demonstrated efficiency gives TPV the potential to compete with turbine-based heat engines for large-scale power production with respect to both cost and performance, thereby enabling possible usage in natural gas or hydrogen-fueled electricity production.
64 citations
TL;DR: Tonnesen et al. as discussed by the authors presented an additive integration technology for fabrication of MEMS with an electroplating technology on top of a CMOS signal processing circuit, which can be manufactured using a low cost CMOS production line and adding the mechanical sensor elements via a specialized back-end process.
Abstract: This paper presents an additive integration technology for fabrication of MEMS with an electroplating technology on top of a CMOS signal processing circuit. It reports on the development of an inertial sensor-array device for automotive applications and shock-monitoring systems. This device can be manufactured using a low-cost CMOS production line and adding the mechanical sensor elements via a specialized back-end process. The basic fabrication process for the additive electroplating technology and a first device for inertial sensing was reported by the group at MME'97 [T. Tonnesen, O. Ludtke, J. Noetzel, J. Binder, G. Mader, Simulation, design and fabrication of electroplated acceleration switches, J. Micromech. Microeng. 7 (1997) 237–239.]. The additive electroplating technology represents a new alternative to other devices realized with bulk and surface micromachining as described, e.g., in Analog Devices [Analog Devices, Monolithic accelerometer with signal conditioning ADXL50, Application Notes, 1995.]. This paper concentrates on improvements in the fabrication technology and the development of the wafer-level capping and back-end packaging sequence for a sensor-array device, which can be manufactured within an industrial processing line.
63 citations
TL;DR: In this paper, a polymer composite was fabricated by solidification of a particle suspension in ultrasonic standing waves, where particles of various materials and shapes can be arranged periodically at the nodes of standing waves.
Abstract: A polymer composite was fabricated by solidification of a particle suspension in ultrasonic standing waves. Particles of various materials and shapes can be arranged periodically at the nodes of standing waves. A polysiloxane resin is suitable as a host material of the composite, since it is synthesized easily from a solution and it yields a small periodic structure even at a low ultrasonic frequency due to the low sound velocity. This method is useful for fabrication of bulk materials with periodic microstructures. Optical diffraction of a laser beam was observed in a polymer composite made of a polysiloxane resin and acrylic particles.
63 citations
TL;DR: In this article, a fabrication method for the formation of various shapes of silicon freestanding microfluidic channels and microstructures in one-step photolithography was developed and demonstrated.
Abstract: In this research, we have developed and demonstrated a fabrication method for the formation of various shapes of silicon freestanding microfluidic channels and microstructures in one-step photolithography. The fabrication process utilizes the silicon direct wafer bonding with silicon nitride as an intermediate layer, local oxidation of the silicon (LOCOS) process and wet anisotropic etching. Two different types of etchants (non-ionic surfactant (Triton-X-100) added and pure 25 wt% TMAH solutions) are used in series to perform silicon anisotropic etching. Surfactant-added tetramethyl ammonium hydroxide (TMAH) is employed to define the shapes of the structures, while pure TMAH is used to get high undercutting for their fast releasing. The non-ionic surfactant is preferred considering the complementary metal-oxide semiconductor (CMOS) post process issue of wet anisotropic etching. The undercutting at sharp and rounded concave corners, edges aligned along 1 0 0 directions, is measured and analyzed in both pure and surfactant-added TMAH solutions. Mask design issues that must be taken into consideration for the fabrication of desired shape and size structures are also presented.
63 citations