Topic
Fabrication
About: Fabrication is a research topic. Over the lifetime, 20475 publications have been published within this topic receiving 235676 citations.
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TL;DR: A fabrication process for the Lightly Doped Drain/Source Field Effect Transistor, LDDFET, that utilizes RIE produced SiO 2 sidewall spacers is described in this paper.
Abstract: A fabrication process for the Lightly Doped Drain/Source Field-Effect Transistor, LDDFET, that utilizes RIE produced SiO 2 sidewall spacers is described. The process is compatible with most conventional polysilicon-gated FET processes and needs no additional photomasking steps. Excellent control and reproducibility of the n-region of the LDD device are obtained. Measurements from dynamic clock generators have shown that LDDFET's have as much as 1.9X performance advantage over conventional devices.
145 citations
TL;DR: In this paper, a two-step process for fabrication of thin-film absorber material is introduced, which presents some interesting challenges in fabrication when compared with Cu(In,Ga)Se2.
Abstract: Cu2ZnSnS4 (CZTS) is a promising thin-film absorber material that presents some interesting challenges in fabrication when compared with Cu(In,Ga)Se2. We introduce a two-step process for fabrication ...
145 citations
TL;DR: The process is based on conventional microfabrication techniques to create a planar pattern in an InGaAs/GaAs bilayer that self-assembles into 3D structures during a wet etch release to be proposed to function as nanosprings for electromechanical sensors.
Abstract: This paper presents the use of a novel fabrication technique to produce three-dimensional (3D) nanostructures The process is based on conventional microfabrication techniques to create a planar pattern in an InGaAs/GaAs bilayer that self-assembles into 3D structures during a wet etch release The nanostructures are proposed to function as nanosprings for electromechanical sensors Nanomanipulation inside a scanning electron microscope (SEM) was conducted to probe the structures for mechanical characterization The results were validated by simulation
144 citations
TL;DR: In this article, the fabrication of a novel capacitive-type relative humidity sensor of which the electrode films are deposited using the high speed printing process, offset lithography, is described, and details of the fabrication process and sensor characteristics such as linearity, sensitivity and response time are included.
Abstract: This paper reports on the fabrication of a novel capacitive-type relative humidity sensor of which the electrode films are deposited using the high speed printing process, offset lithography. Parallel-plate capacitor sensor structures have been formed with a number of humidity sensitive polymers including polyimide and polyethersulphone (PES). Details of the fabrication process and sensor characteristics such as linearity, sensitivity and response time are included.
143 citations
TL;DR: In this article, a new class of organic dielectrics, benzocyclobutenes, are described and their application to the fabrication of thin-film multichip modules is detailed.
Abstract: A new class of organic dielectrics, benzocyclobutenes, 1, are described and their application to the fabrication of thin film multichip modules is detailed. Key properties for3, a siloxy containing BCB derivative include low dielectric constant (2.7), low loss (0.008 at 1 MHz), low water absorption (0.25% after 24 h water boil) and high degree of planarization (>90% from one layer coverage). All other properties meet the requirements necessary for fabrication of thin film MCM structures.
142 citations