Fabrication

About: Fabrication is a research topic. Over the lifetime, 20475 publications have been published within this topic receiving 235676 citations.

Three-dimensional memory array and method of fabrication

Abstract: A multi-level memory array is described employing rail-stacks. The rail-stacks include a conductor and semiconductor layers. The rail-stacks are generally separated by an insulating layer used to form antifuses. In one embodiment, one-half the diode is located in one rail-stack and the other half in the other rail-stack.

A three-dimensional optical photonic crystal with designed point defects.

Abstract: Photonic crystals1,2,3 offer unprecedented opportunities for miniaturization and integration of optical devices. They also exhibit a variety of new physical phenomena, including suppression or enhancement of spontaneous emission, low-threshold lasing, and quantum information processing4. Various techniques for the fabrication of three-dimensional (3D) photonic crystals—such as silicon micromachining5, wafer fusion bonding6, holographic lithography7, self-assembly8,9, angled-etching10, micromanipulation11, glancing-angle deposition12 and auto-cloning13,14—have been proposed and demonstrated with different levels of success. However, a critical step towards the fabrication of functional 3D devices, that is, the incorporation of microcavities or waveguides in a controllable way, has not been achieved at optical wavelengths. Here we present the fabrication of 3D photonic crystals that are particularly suited for optical device integration using a lithographic layer-by-layer approach15. Point-defect microcavities are introduced during the fabrication process and optical measurements show they have resonant signatures around telecommunications wavelengths (1.3–1.5 µm). Measurements of reflectance and transmittance at near-infrared are in good agreement with numerical simulations.

Design and fabrication of compliant micromechanisms and structures with negative Poisson's ratio

Abstract: This paper describes a new way to design and fabricate compliant micromechanisms and material structures with negative Poisson's ratio (NPR). The design of compliant mechanisms and material structures is accomplished in an automated way using a numerical topology optimization method, The procedure allows the user to specify the elastic properties of materials or the mechanical advantages (MA's) or geometrical advantages (GA's) of compliant mechanisms and returns the optimal structures. The topologies obtained by the numerical procedure require practically no interaction by the engineer before they can be transferred to the fabrication unit. Fabrication is carried out by patterning a sputtered silicon on a plasma-enhanced chemical vapor deposition (PECVD) glass with a laser micromachining setup. Subsequently, the structures are etched into the underlying PECVD glass, and the glass is underetched, all in one two-step reactive ion etching (RIE) process. The components are tested using a probe placed on an x-y stage. This fast prototyping allows newly developed topologies to be fabricated and tested within the same day.

Dynamic micromechanics on silicon: Techniques and devices

Abstract: New fabrication procedures ate described for constructing thin, electrostatically deflectable SiO 2 membranes on a silicon wafer in a very controllable manner. Performance parameters of these membranes are analyzed and three examples of typical applications for the micromechanical structures are discussed: a light modulator array, a micromechanical voltage-controlled switch, and the measurement of the mechanical properties of thin insulating films unconstrained by the substrate. Since the lifetimes of the membranes can be very long (>1010cycles), their dimensions very small (8.3 µm long, 950 A thick have been demonstrated), and the fabrication technique is simple and versatile, the potential applicability of such devices seems promising.

VLSI fabrication principles : silicon and gallium arsenide

Abstract: Material Properties. Phase Diagrams and Solid Solubility. Crystal Growth and Doping. Diffusion. Epitaxy. Ion Implantation. Native Films. Deposited Films. Etching and Cleaning. Lithographic Processes. Device and Circuit Fabrication. Appendix. Index.