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Fabrication

About: Fabrication is a research topic. Over the lifetime, 20475 publications have been published within this topic receiving 235676 citations.


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Journal ArticleDOI
TL;DR: In this paper, the authors present the fundamental studies of this research to identify embedding methods and working range for the fabrication of adaptive composite structures, which is targeted at the fabrication with the ability to measure external stimuli and respond by adapting their structure accordingly, through the action of embedded active and passive functional fibres within a freeform fabricated metal-matrix structure.
Abstract: Ultrasonic consolidation (UC) has been used to embed thermally sensitive and damage intolerant fibres within aluminium matrix structures using high frequency, low amplitude, mechanical vibrations. The UC process can induce plastic flow in the metal foils being bonded, to allow the embedding of fibres at typically 25% of the melting temperature of the base metal and at a fraction of the clamping force when compared to fusion processes. To date, the UC process has successfully embedded Sigma silicon carbide (SiC) fibres, shape memory alloy wires and optical fibres, which are presented in this paper. The eventual aim of this research is targeted at the fabrication of adaptive composite structures having the ability to measure external stimuli and respond by adapting their structure accordingly, through the action of embedded active and passive functional fibres within a freeform fabricated metal–matrix structure. This paper presents the fundamental studies of this research to identify embedding methods and working range for the fabrication of adaptive composite structures. The methods considered have produced embedded fibre specimens in which large amounts of plastic flow have been observed, within the matrix, as it is deformed around the fibres, resulting in fully consolidated specimens without damage to the fibres. The microscopic observation techniques and macroscopic functionality tests confirms that the UC process could be applied to the fabrication of metal–matrix composites and adaptive composites, where fusion techniques are not feasible and where a ‘cold’ process is necessary.

106 citations

Journal ArticleDOI
TL;DR: In this paper, materials and methods for 1DPC fabrication are summarized, with a special emphasis on sensing platforms and photovoltaic devices together with full color display, and the possibility of building 3D stacked structures based on 1D layers through chemical routes is discussed; a relatively convenient and flexible method.
Abstract: A one-dimensional photonic crystal (1DPC), which is a periodic nanostructure with a refractive index distribution along one direction, has been widely studied by scientists. In this review, materials and methods for 1DPC fabrication are summarized. Applications are listed, with a special emphasis on sensing platforms and photovoltaic devices together with full color display. After that, some typical 3D ordered structures with stacked layers are highlighted, fabrication methods are also described, and remaining problems are pointed out. Lastly, the possibility of building 3D stacked structures based on 1D layers through chemical routes is discussed; a relatively convenient and flexible method. We believe such a method is a promising way to conduct 3D fabrication.

106 citations

Patent
10 Mar 1986
TL;DR: Submicron lateral device structures, such as bipolar transistors, Schottky barrier diodes and resistors, are made using selfaligned fabrication techniques and conventional photolithography.
Abstract: Submicron lateral device structures, such as bipolar transistors, Schottky Barrier diodes and resistors, are made using self-aligned fabrication techniques and conventional photolithography. The devices are made using individual submicron silicon protrusions which extend outwardly from and are integral with a silicon pedestal therefor. Both PNP and NPN transistors may be made by diffusing appropriate dopant material into opposing vertical walls of a protrusion so as to form the emitter and collector regions. The protrusions themselves are formed by anisotropically etching the silicon using submicron insulating studs as a mask. The studs are formed using sidewall technology where a vertical sidewall section of as layer of insulating material is residual to a reactive ion etching process employed to remove the layer of insulating material.

106 citations

Journal ArticleDOI
TL;DR: In this paper, the authors demonstrate the fabrication of individual Cu nanowires with a probe-based electrochemical deposition method, which eliminates the need for a plating bath and creates a clean environment for the continuous fabrication of nanostructures.
Abstract: We demonstrate the fabrication of individual Cu nanowires with a probe-based electrochemical deposition method. The electrolyte used for the electrochemical deposition was carried within a pipette probe, which eliminated the need for a plating bath and created a clean environment for the continuous fabrication of nanostructures. The fabrication of vertically aligned, solid, polycrystalline Cu nanowire arrays was realized, with the Cu nanowires having diameters down to 200nm and lengths up to 10μm.

105 citations

Journal ArticleDOI
TL;DR: In this paper, a protocol for the inexpensive fabrication of catalytic microburners with integrated thermocouples is introduced, and experimental data for the oxidation of hydrogen/air mixtures over platinum/alumina is presented.
Abstract: A protocol for the inexpensive fabrication of catalytic microburners with integrated thermocouples is introduced. Experimental data for the oxidation of hydrogen/air mixtures over platinum/alumina ...

105 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
20241
20235,291
202210,627
2021845
2020805
2019944