Fabrication

About: Fabrication is a research topic. Over the lifetime, 20475 publications have been published within this topic receiving 235676 citations.

Fabrication of buried channel waveguides on silicon substrates using spin-on glass.

Abstract: A new process for the deposition of thick (≈10-μm) films of silica and titania-doped silica on silicon substrates is described. Films are built up by repetitive operation of a simple process cycle in which a layer of sol-gel material is deposited by spin coating, then densified by rapid thermal annealing. Stress-free layers are obtained through careful choice of the anneal temperature. Bilayer structures suitable for waveguide fabrication may also be constructed by performing two successive deposition runs using sol-gel precursors with different titania concentrations. These bilayers may be patterned topographically into ridges by using reactive ion etching, and the ridges may be planarized by applying additional layers of sol-gel material to form buried channel waveguides.

Controlled Self‐Assembly of Organic Semiconductors for Solution‐Based Fabrication of Organic Field‐Effect Transistors

Abstract: The solubility and low processing temperatures of organic semiconductors enable fabrication of electronic devices using relatively simple printing technologies, and hold promise for realizing flexible plastic devices by environment-friendly production methods at low cost. In particular, by effectively using the self-assembling ability of molecules, production methods for organic semiconductor devices are expected to become more efficient in terms of energy and material consumption. We have developed two solution-based methods for self-organized formation of organic semiconductor crystals, including area selective nucleation of crystalline semiconductor films and direct formation of organic single crystals. These bottom-up methods of device fabrication, wherein the intrinsic functionalities of molecules are utilized for spontaneous assembly, may become a core technology for future plastic electronics.

Evolution of microstructure during fabrication of Zr-2.5 Wt pct Nb alloy pressure tubes

Abstract: Microstructural changes occurring during the fabrication of Zr-2.5 pct Nb alloy pressure tubes by a modified route, involving hot extrusion followed by two pilgering operations with an intermediate annealing step, have been examined in detail. In the conventional fabrication route, the hot extrusion step is followed by a single cold drawing operation in which the cold work to the extent of 25 pct is imparted to the material for achieving the required mechanical properties. Tensile properties obtained at each stage of fabrication have been evaluated and compared between the two processes. The main aim of this work has been to produce a microstructure and texture which are known to yield a lower irradiation growth. Additionally, suitable annealing conditions have been optimized for the intermediate annealing which annihilates the cold work introduced by the first cold pilgering operation without disturbing the two-phase elongated microstructure. This elongated α+ β I microstructure is required for obtaining the desired level of strength at 310 °C. The final microstructure and the crystallographic texture of the finished pressure tube have been compared with those reported for the conventionally processed material.

ZnO nanowire network transistor fabrication on a polymer substrate by low-temperature, all-inorganic nanoparticle solution process

Abstract: All-solution processed, low-temperature zinc oxide nanowire network transistor fabrication on a polymer substrate was demonstrated. This simple process can produce high resolution metal electrode transistors with inorganic semiconductor nanowire active material in a fully maskless sequence, eliminating the need for lithographic and vacuum processes. The temperature throughout the processing was under 140°C, which will enable further applications to electronics on low-cost, large-area flexible polymer substrates.

Fabrication of miniature Clark oxygen sensor integrated with microstructure

Abstract: A miniature Clark-type oxygen sensor has been integrated with a microstructure using a novel fabrication technique. The oxygen chip consists of a glass substrate with a three-electrode configuration, which is separated and connected by a groove, and a poly(dimethylsiloxane) (PDMS) container with an immobilized PDMS oxygen-permeable membrane. The assembly of the different substrates only uses the O2 plasma bonding technique, and the fabrication temperatures do not exceed 95 °C. Characteristics of the miniature sensor include the fastest response time of 6.8 s, good linearity with a correlation coefficient of 0.995, and a long lifetime of at least 60 h. The present miniature Clark oxygen sensor can be readily integrated with a microfluidic system to form a μ-TAS.