Fabrication

About: Fabrication is a research topic. Over the lifetime, 20475 publications have been published within this topic receiving 235676 citations.

Fabrication of 80 Å metal wires

Abstract: Some years ago Possin reported the fabrication of wires as small as 400 A in diameter with a method involving electroplating into etched particle tracks in mica. We have refined this technique, and can now use it to routinely produce wires as small as 80 A. These refinements are described, and the possibility of making even smaller wires with this method is discussed.

High-Performance Flexible Bottom-Gate Organic Field-Effect Transistors with Gravure Printed Thin Organic Dielectric

Abstract: One of the key advantages of organic field-effect transistors (OFETs) is their ability to form flexible, conformable and lightweight electronic devices, e.g. radio frequency identification (RFID) tags,[1] microprocessors[2] and flexible displays.[3] These require fabrication over large-areas on flexible plastic substrates, the poor dimensional stability of such substrates creating the additional demand of low-temperature processing (<200 °C).[4] While high performance source, drain and gate electrodes and interconnects require metal evaporation under vacuum, ideally the dielectric and organic semiconductor (OSC) should be processed from solution under ambient conditions to reduce fabrication costs. Regarding device architecture, OFETs with a bottom-gate (BG) bottom-contact (BC) geometry (Figure ​1c)1c) have an advantage in that the organic semiconducting layer is deposited last.[5] This affords easy fabrication and patterning of micron-scale OFET channels, electrodes and interconnects by conventional photolithographic methods, whilst avoiding exposure of the active OSC material to UV radiation and aggressive or solubilising chemicals. Furthermore, this architecture is compatible with vacuum sublimation or vapour phase techniques for OSC deposition, allowing access to a wide range of high-performance materials. Such OFETs can form the building blocks of high performance, low-cost electronic circuitry.

Fabrication of a high frequency piezoelectric microvalve

Abstract: The fabrication of an active MEMS microvalve driven by integrated bulk single crystal piezoelectric actuators is reported. The valve has a nine-layer structure composed of glass, silicon, and silicon on insulator (SOI) layers assembled by wafer-level fusion bonding and anodic bonding, as well as die-level anodic bonding and eutectic bonding. Valve head strokes as large as 20 μm were realized through hydraulic amplification of the small stroke of the piezoelectric actuator. A flow rate of 0.21 ml/s was obtained at 1 kHz. The fabrication, bonding and assembly process, as well as some test results are described.

Direct Patterning of Copper on Polyimide Using Ion Exchangeable Surface Templates Generated by Site-Selective Surface Modification

Abstract: We demonstrate site-selective chemical surface modification by dispensing potassium hydroxide solution onto polyimide, which confines source metallic ions that can subsequently be used in resist- and mask-free fabrication of copper circuit patterns. Metallization can be achieved by a wet chemical method, providing control over metal/polymer interfacial structures. Because the approach is compatible with other existing printing technologies and much simpler than conventional lithography-based methods, we propose that the present surface template method may be of general application in fabrication of metallized polymers as well as in development of integrated circuits with a variety of electronic circuit elements.