Topic
Filler metal
About: Filler metal is a research topic. Over the lifetime, 11152 publications have been published within this topic receiving 86590 citations.
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TL;DR: In this paper, laser welding technologies for difficult weldable high strength aluminum alloys, containing Cu and / or Li, were evaluated on T-joints of the alloy 2139.
90 citations
Patent•
15 Jan 1980
TL;DR: In this paper, a homogeneous, ductile filler metal foil for brazing stainless steels and base alloys has been described, which has a composition consisting essentially of 0 to about 4 atom percent iron, chromium, 0 to 16 atom percent boron and 0 to 19 atom percent silicon, and the balance nickel and incidental impurities.
Abstract: Brazing of metal parts employing a homogeneous, ductile, filler metal foil is disclosed. The brazing foil, useful for brazing stainless steels, has a composition consisting essentially of 0 to about 4 atom percent iron, 0 to about 21 atom percent chromium, 0 to about 16 atom percent boron, 0 to about 19 atom percent silicon, 0 to about 22 atom percent phosphorus and the balance nickel and incidental impurities. In addition to containing the foregoing elements within the above-noted composition ranges, the composition must be such that the total of iron, chromium and nickel ranges from about 76 to 84 atom percent and the total of boron, silicon and phosphorus ranges from about 16 to 24 atom percent. The ductile foil permits fabrication of preforms of complex shapes which do not require binders and/or fluxes necessary for brazing powders presently used to braze stainless steels and nickel base alloys.
90 citations
TL;DR: In this paper, a method of producing uniform particle strengthened bonds between pieces of aluminum metal matrix composite (Al-MMCs), of strength equal to that of the substrate material, was presented.
90 citations
Patent•
11 Oct 1998
TL;DR: In this paper, the hardness of a reaction product layer, which is formed by reacting the silver-copper brazing filler metal layer with the ceramic nitride board, should be 1100 or higher.
Abstract: A ceramic circuit board characterized in being formed by bonding a metallic circuit board to a ceramic board via a silver-copper brazing filler metal layer containing at least one kind of an active metal selected from among elements of Ti, Zr, Hf, V, Nb and Ta, in which the Vickers hardness of a reaction product layer, which is formed by reacting the silver-copper brazing filler metal layer with the ceramic nitride board, should be 1100 or higher.
90 citations
TL;DR: In this paper, the microstructures and its formation mechanism of a stainless steel/copper dissimilar joint by laser welding were investigated, and it was found that the two modes of joining depend on different processing parameters.
Abstract: The microstructures and its formation mechanism of a stainless steel/copper dissimilar joint by laser welding were investigated. It was found that the two modes of joining, i.e., welding-brazing and fusion welding, depend on different processing parameters. In the welding-brazing mode, the interface between copper and the fusion zone has scraggy morphology because the molten pool is frozen by solid copper with high thermal conductivity. The interdiffusion of elements occurs in the neighborhood of the interface, which leads to the metallurgy bond of the mode. In the fusion welding mode, the liquid phase in the fusion zone undergoes not only primary but also secondary liquid separation due to the high cooling rate and high supercooling level of laser welding. Some microcracks generated in the fusion zone by thermal stress mismatch are healed by liquid copper filling.
89 citations