Showing papers on "Flexible electronics published in 1971"

Method of producing a flexible laminate copper circuit

Abstract: A METHOD OF PRODUCING A LAMINATE HAVING HIGH BOND STRENGTH AND EXCELLENT RESISTANCE TO ACID UNDERCUTTING COMPRISING OXIDIZING COPPER OR ITS ALLOYS TO FOR AN OXIDE FILM, APPLYING A PHOSPHORIC ACID SOLUTION TO THE OXIDE FILM, RINSING, DRYING, AND ADHESIVELY LAMINATING TO A PLASTIC FILM. M. THE INSTANT CASE ALSO TEACHES A METHOD OF PRODUCING HIGH TARNISH RESISTANCE ON COPPER AND ITS ALLOYS BY SO OXIDIZING AND PHOSPHATING AND FURTHER TEACHES A FLEXIBLE PRINTED CIRCUIT WHEREIN THE UNWANTED COPPER PORTION OF THE FORMED LAMINATE IS ETCHED AWAY, CHARACTERIZED BY HIGH PEEL STRENGTH AND SUBSTANTIALLY NO ACID UNDERCUTTING OF THE FORMED CIRCUITRY.

Method of producing flexible copper laminate for printed circuits

Abstract: A METHOD OF PRODUCING A LAMINATE HAVING HIGH BOND STRENGTH AND EXCELLENT RESISTANCE TO ACID UNDERCUTTING COMPRISING OXIDIZING COPPER OR ITS ALLOYS TO FORM AN OXIDE FILM, APPLYING A PHOSPHORIC ACID SOLUTION TO THE OXIDDE FILM, RINSING,, DRYING, AND ADHESIVELY LAMINATING TO A PLASTIC FILM. THE INSTANT CASE ALSO TEACHES A METHOD OF PRODUCING HIGH TARNISH RESISTANCE ON COPPER AND ITS ALLOYD BY SO OXIDIZIING AND PHOSPHATIINGG AND FURTHER TEACHES A FLEXIBLE PRINTED CIRCUIT WHEREIN THE UNWANTED COPPER PORTION OF THE FORMED LAMINATE IS ETCHED AWAY, CHARACTERIZED BY HIGH PEEL STRENGTH AND SUBSTANTIALLY NO ACID UNDERCUTTING OF THE FORMED CIRCUITRY.

Improvements relating to printed circuits

Abstract: 1,241,169. Printed circuits. ELLIOTT BROS. (LONDON) Ltd. 13 Sept., 1968 [21 Sept., 1967], No. 43016/67. Heading H1R. In order to satisfactorily bend a flexible printed circuit comprising at least three superimposed layers the layers of material in the region of the bend are formed such that when the printed circuit is bent no layers overlap at any point along the apex of the bend. A multilayer printed circuit comprising four superimposed alternate layers of insulating material 3, 5 and nickel 2, 4 is bent in the region 6. In accordance with the invention nickel conductors of layer 2 are etched so that only areas 7 exist in region 6, layer 3 is etched so that only areas 8 exist in region 6, nickel conductors of layer 4 are etched so that only areas 9 exist in region 6 and layer 5 is etched so that only areas 10 exist in region 6. The printed circuit is then bent along region 6 whereby no layers overlap along the apex of the bend the layers of insulating material being of such area at region 6 to have sufficient strength to control any resilience of the insulating material in the region.