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Showing papers on "Flexible electronics published in 1979"


Patent
10 Jan 1979
TL;DR: In this article, a method for making an electronic package assembly of the type having an insulator pin carrier, a thin, i.e. substantially five microns, flexible printed circuit polyimide member having printed circuit conductors bonded to the heads of the pins of the carrier, and one or more integrated circuit (IC) chips with a high density (i.e., 100 or more) input/output I/O terminal array on the bottom surface of each chip bonded to a corresponding registerable array of PC conductor pads of the polyimides member.
Abstract: A method for making an electronic package assembly of the type having an insulator pin carrier, a thin, i.e. substantially five microns, flexible printed circuit (PC) polyimide member having printed circuit conductors bonded to the heads of the pins of the carrier, and one or more integrated circuit (IC) chips with a high density (i.e. 100 or more) input/output I/O terminal array on the bottom surface of each chip bonded to a corresponding registerable array of PC conductor pads of the polyimide member. The forming, curing and circuitizing of the polyimide member, the bonding of the I/O terminals to the pads of the PC member, and the bonding of the pin heads to the PC member are done on a temporary support or fixture. The method provides a reliable manner for fabrication of the package assembly which minimizes the risk of destroying the flexibility of the PC member and/or its integrity during the making of the assembly and/or the subsequent thermal cycling associated with the assembly.

52 citations


Patent
14 Jun 1979
TL;DR: In this paper, a flexible printed circuit base board is described, where a heat-resistant resin composition composed of a heat resistant resin having a heterocyclic ring and an epoxy resin dissolved in an organic solvent on a metal foil and drying it to form a film directly on said foil, and a method for producing the same.
Abstract: OF THE DISCLOSURE There are disclosed a flexible printed circuit base board produced as an elemental material suitable for a flexible printed circuit board by coating a heat-resistant resin composition composed of a heat-resistant resin having a heterocyclic ring and an epoxy resin dissolved in an organic solvent on a metal foil and drying it to form a film directly on said foil, and a method for producing the same. Said flexible printed circuit base board is more excellent in heat resistance, flame retardancy, adhesiveness, electric insulation, and heat deterioration characteristics than the conven-tional base board obtained by integrating a heat-resistant film and a metal foil through an adhesive. These properties are of great importance in practical applications of the printed circuit base board. As compared with the conven-tional products, the production is easy, and hence, the present base board can be produced at a low cost. The base board of this invention is not only usable for various types of flexible printed circuit boards but also the film per se obtained from the base board can be used in a field in which a film is used.

41 citations


Patent
15 Oct 1979
TL;DR: In this article, a circuit conductive leaf is formed on at least the single face of a flexible base material and a peripheral edge leaf is created on the periphery of the base material.
Abstract: This is directed to an electronic circuit apparatus using a flexible printed wiring board having a conductive leaf formed on the surfaces of a flexible base material such as phenol resin or the like, wherein a circuit conductive leaf is formed on at least the single face of a flexible base material and a peripheral edge leaf is formed on the periphery of the flexible base material. An electronic parts is mounted and connected to the circuit conductive leaf. Since the flexible base material is extremely thin and flexible, the electronic circuit apparatus can be constructed smaller and thinner.

33 citations


Patent
11 Apr 1979
TL;DR: In this paper, an electrically insulative support member overlies electrical contacts on the handpiece and further includes a pair of contact members which press a flexible printed circuit against the electrical contacts to couple the bulbs to the electrical power source.
Abstract: The assembly includes an electrically insulative support member which overlies electrical contacts on the handpiece and further includes a pair of contact members which press a flexible printed circuit against the electrical contacts to couple a pair of bulbs to the electrical power source. The light source assembly additionally includes means for effectively sealing the contact regions from environmental fluids.

31 citations


Patent
21 Sep 1979
TL;DR: In this paper, a low reluctance rotor for a motor comprises a conductive pattern of a plurality of side-by-side coils formed on a flexible printed circuit board, and means are provided to interconnect non-adjacent coils to form a desired winding pattern.
Abstract: A lightweight low reluctance rotor for a motor comprises a conductive pattern of a plurality of side-by-side coils formed on a flexible printed circuit board. The flexible board is rolled into a plural layer cylindrical drum and means are provided to interconnect non-adjacent coils to form a desired winding pattern.

30 citations


Patent
Mouissie Bob1
21 Aug 1979
TL;DR: In this paper, an improved electrical connector including dual contacts comprising an insulating support, an arcuately stressed spring having each end confined within the support, and a flexible printed circuit stretched over the spring is provided.
Abstract: An improved electrical connector including dual contacts comprising an insulating support, an arcuately stressed spring having each end confined within the support, and a flexible printed circuit stretched over the spring is provided. The contact function is accomplished by the flexible circuit. The spring is adapted to deflect and resiliently flex at its midpoint during engagement with a mating contact at which time the spring surfaces on both sides of their midpoints resiliently press the flexible circuit against the mating contact. The resilient flexure of the spring provides redundant pressure points between the flexible printed circuit and the mating contact and eliminates the need for a spring having both the sufficient resilience and the necessary conductive properties.

22 citations


Patent
17 Jul 1979
TL;DR: In this article, a method of making continuous laminates by irradiation of a continuous sandwich of a radiation curable substrate and a metal foil is described, especially useful for use in conjunction with polyethylene in flexible printed circuit applications.
Abstract: A novel method of making continuous laminates by irradiation of a continuous sandwich of a radiation curable substrate and a metal foil is described. The method is especially useful for use in conjunction with substrates such as polyethylene in flexible printed circuit applications.

18 citations


Patent
30 Mar 1979
TL;DR: In this paper, a printed circuit assembly in a device such as a camera is described, in which various mechanical parts are compacted in a hausing and various electrical parts are arranged in the distributed manner within very limited spaces between the mechanical parts and the hausing.
Abstract: A printed circuit assembly in a device such as a camera, for example, which is constructed in an extremely compact size and in which various mechanical parts are compacted in a hausing and various electrical parts are arranged in the distributed manner within very limited spaces between the mechanical parts and the hausing. In this printed circuit assembly, in order to electrically connect each of the above described electrical parts to the electric circuit portion forming the main portion of the device, flexible printed circuit boards which are so located within the spaces that they are variously bent in conformance with the configuration each of the spaces are each formed as a single continuous base board in such a manner that it has a third plate portion for connecting purpose connected to a first and second main plate portions of the base board extending therefrom at an obtuse angle to each other with the third plate portion located between the first and second main plate portions so as to deviate from the directions in which the latters extend in the manner that, for example, the third plate member is made substantially in the form of a general U-shape, a general semi-circular shape, or a general trapezoidal shape, so that the yield of the material in the pressing operation in the manufacture of the printed circuit boards is raised.

16 citations


Patent
21 Dec 1979
TL;DR: In this article, an approach for electrically connecting a plurality of closely positioned contacts of a display device with a number of spaced contacts of an electronic control circuit includes a pluralityof flexible printed circuit boards each having a narrow midsection, outer areas having a width greater than the width of the midsection and conductor lines extending from the mid-section for connection with a portion of the display device contacts to the outer areas with the spacing between the conductor lines increasing for connection of the electronic controller contact.
Abstract: Apparatus for electrically connecting a plurality of closely positioned contacts of a display device with a plurality of spaced contacts of an electronic control circuit includes a plurality of flexible printed circuit boards each having a narrow mid-section, outer areas having a width greater than the width of the mid-section and conductor lines extending from the mid-section for connection with a portion of the display device contacts to the outer areas with the spacing between the conductor lines increasing for connection with a portion of the electronic control circuit contact.

15 citations


Patent
11 Oct 1979
TL;DR: A method of manufacturing printed circuit sheets from a base sheet composed of a base material in a sheet form having applied at least on one surface an electrically conductive foil is described in this paper.
Abstract: A method of manufacturing printed circuit sheets which is capable of efficiently manufacturing printed circuit sheets from a base sheet composed of a base material in a sheet form having applied at least on one surface an electrically conductive foil.

14 citations


Patent
09 Apr 1979
TL;DR: In this article, the method of making printed circuit boards includes the use of thin material (5) of laminated construction and thick non-laminated material with a flexible foil (FF) on top.
Abstract: The method of making printed circuit boards includes the use of thin material (5) of laminated construction and thick non-laminated material (R) with a flexible foil (FF) on top. Rigid areas (S) can alternate with flexible areas (F) by removal of the laminated and non-laminated layers selectively. Before assembling the layers, slots (SCH) can be made through the thicker, non-laminated material (R) by e.g. milling, to locate the flexible areaS. The layers are then assembled with intermediate adhesive foil layers (KF) to form the composite material. The flexible areas can then be removed before pressing.

Patent
Mouissie Bob1
27 Jun 1979
TL;DR: An end connector for flexible printed circuits, with a folding casing of insulating material, is described in this article, where the bottom of the casing contains a resilient means and cams for positioning the flexible circuit in the connector.
Abstract: An end connector for flexible printed circuits, with a folding casing of insulating material. The connector is suitable to receive and contact through contact means the edge part provided with parallel conducting strips of a flexible circuit. The bottom of the casing contains a resilient means and cams for positioning the flexible circuit in the connector.

Patent
16 Mar 1979
TL;DR: In this paper, a subminiature rotary coded switch with a dual-in-line configuration is presented, which can be mounted in one conventional 14-terminal array of holes in a printed circuit board.
Abstract: A subminiature rotary coded switch having a dual-in-line configuration. Flexible contacts making electrical connection with the dual-in-line terminals of the switch are mounted within a stationary body. A drum-shaped detenting cover has printed circuitry on its inner cylindrical surface, typically in the form of a flexible printed circuit board. The cover rotates the flexible board with respect to the body, producing a wiping action with respect to the flexible contacts, thereby producing the desired switching operations. Each such switch can be electrically equivalent to four single-pole double-throw switches and two of the switches of this invention can be mounted in one conventional 14-terminal dual-in-line array of holes in a printed circuit board.

Patent
16 Nov 1979
TL;DR: A treatment inductor for use with a high frequency electromagnetic therapy apparatus having one or more flexible induction elements for connection to the therapy apparatus and embodied in a flexible material (such as silicone rubber) whereby it may be conformed to lie against an area of the body to be treated as discussed by the authors.
Abstract: A treatment inductor for use with a high frequency electromagnetic therapy apparatus having one or more flexible induction elements (2) for connection to the therapy apparatus and embodied in a flexible material (8) (such as silicone rubber) whereby it may be conformed to lie against an area of the body to be treated. The inductor is generally planar. In a first aspect of the invention the inductor elements are formed as conductive areas on a flexible printed circuit board. In a second aspect of the invention a pulse generator (20) (for generating the high frequency electromagnetic signals) is integrated in or on the inductor. Preferably a power source such as a battery is also integrated in or on the inductor.




Patent
01 Nov 1979
TL;DR: In this paper, a high resolution magnetic printing head comprises a pair of interlaced printed circuit board structures, where the two printed circuit boards are adjacently disposed so that their respective elongated gaps are aligned but so that the conductive signal lines are interlaces.
Abstract: A high resolution magnetic printing head comprises a pair of interlaced printed circuit board structures. Each printed circuit board structure comprises a two or three layer assembly in which each layer comprises a flexible printed circuit board having an elongated gap therein with electrically conductive signal lines crossing the gap. On each three layered structure, the signal lines on adjacent circuit boards are substantially parallel where the lines cross the gaps in the printed circuit boards. The two printed circuit board structures are adjacently disposed so that their respective elongated gaps are aligned but so that the conductive signal lines are interlaced. High permeability magnetic material is then deposited between said interleaved signal lines by electrodeposition so as to form magnetic pole pieces between the conductors bridging the elongated gaps.








ReportDOI
24 Jan 1979
TL;DR: In this paper, the feasibility of fabricating flexible thin-film circuits while planar, and then folding or rolling the circuits to conform to packaging constraints was investigated, which would significantly increase microcircuit packing density and offer a new dimension to the thinfilm circuit engineer.
Abstract: : The feasibility of fabricating flexible thin-film circuits while planar, and then folding or rolling the circuits to conform to packaging constraints was investigated. This approach would significantly increase microcircuit packing density and offer a new dimension to the thin-film circuit engineer. The flexible substrate used was the polyimide film, Kapton; identical circuits were also fabricated on borosilicate glass substrates for comparison. The conductor-resistor arrays used a new material system (copper/Kanthal) offering low cost, low temperature coefficient resistors, and a simple fabrication process. The flexible thin-film resistors were found to show very small resistor value changes when flexed (average about 0.2% for 1-cm radius of curvature), and resistor temperature coefficients comparable to those on glass substrates. This work suggests that flexible thin-film substrates may help solve complex thin-film microcircuit packaging problems. (Author)

Patent
13 Jun 1979
TL;DR: In this paper, a substrate for flexible printed circuits was proposed by coating a metal foil with an organic solvent solution of a heat resistant resin composition consisting of an heterocyclic ring and epoxy resin and then drying the metal foil to thereby form a film directly on the foil as a material adapted for a flexible printed circuit board.
Abstract: A substrate for flexible printed circuits obtained by coating a metal foil with an organic solvent solution of a heat resistant resin composition consisting of a heat resistant resin having an heterocyclic ring and epoxy resin and then drying the metal foil to thereby form a film directly on the foil as a material adapted for a flexible printed circuit board, and a method of fabricating the same. The printed circuit board exhibits heat resistance, fire retardance, adhesion, electric insulation and heat deterioration characteristics which are remarkably superior to the conventional circuit board which is obtained by integrating a heat resistant film with a metal foil via an adhesive. These properties are very important in practical use of the printed circuit board. The substrate of this invention is inexpensive since it can be easily fabricated as compared with the conventional one. This substrate can also be used for not only various flexible printed circuit boards but also as substrate for films alone.