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Showing papers on "Flexible electronics published in 1980"


Patent
Shao-Chung Hsieh1
11 Jun 1980
TL;DR: In this article, a connector for mating a flexible printed circuit (48) to a printed circuit board (50) comprises a housing (12) and a spring (14) which is translatably disposed in a cavity (16) of the housing.
Abstract: A connector (10) for mating a flexible printed circuit (48) to a printed circuit board (50) comprises a housing (12) and a spring (14) which is translatably disposed in a cavity (16) of the housing. The cavity (16) has an outer entrance portion (18) in which the spring (14) is temporarily retained while it receives the flexible printed circuit (48) and the printed circuit board (50). The spring (14), the flexible printed circuit (48) and the printed circuit board (50) are then moved into a reduced inner portion (20) of the cavity (16) to increase the spring forces acting on the flexible printed circuit (48) and the printed circuit board (50).

17 citations


Patent
04 Jan 1980
TL;DR: In this paper, an electronic package assembly and a method for making an assembly with an insulator pin carrier (3), a thin flexible printed circuit (PC) member (10) with a polymer, preferably polyimide film (12), having printed circuit conductors (13,14,15) bonded to the heads of the carrier pins (4), and one or more integrated circuit chips (17,18, with a high density input/output terminal (18) array on the bottom surface bonded to a corresponding registerable array of PC conductor pads (15) on PC
Abstract: An electronic package assembly and a method for making an assembly with an insulator pin carrier (3), a thin (e.g. 5 µm), flexible printed circuit (PC) member (10) with a polymer, preferably polyimide film (12) having printed circuit conductors (13,14,15) bonded to the heads (5) of the carrier pins (4), and one or more integrated circuit chips (17) with a high density input/output terminal (18) array on the bottom surface bonded to a corresponding registerable array of PC conductor pads (15) on PC member (10). The forming, curing and circuitizing of the PC member (10), the bonding of the terminals (18) to the pads (15), and the bonding of the pin heads (5) to the PC member (10) are done on a temporary support or fixture.

11 citations


Patent
21 May 1980
TL;DR: In this paper, a flexible printed circuit board is covered imagewise with a polymer film as a cover layer to improve the flexibility of the board, which can be easily conducted by a continuous operation.
Abstract: A flexible printed-circuit board is covered imagewise with a polymer film as a cover layer to improve the flexibility of the board. The cover layer is formed by laminating a photoprintable, photosensitive layer supported on a flexible support to the surface of a flexible printed-circuit board, exposing the photosensitive layer imagewise to light to form a polymer image in the layer and removing the unexposed areas of the layer to leave an imaged polymer film on the surface of the board. The formation of the cover layer can be easily conducted by a continuous operation.

10 citations


Patent
10 Jun 1980
TL;DR: In this article, a flexible printed circuit board is connected to strain gauges fitted on the thin parts of vertically moved arms to adjust a compensation circuit, such as an electric connection.
Abstract: PURPOSE:To facilitate the adjusting of a compensation circuit, electric connection or the like, by connecting a flexible printed circuit board to strain gauges fitted on the thin parts of vertically moved arms. CONSTITUTION:A projection 6 is provided on the stationary strut part 1 of the main body of a load cell. The substrate 8 of a flexible printed circuit board 7 is secured on the projection 6. Strain gauges 5 fitted on the thin parts 3 of vertically moved arms 4 are bridge-connected to the substrate 8 of the flexible printed circuit board 7 through arm parts 9 and soft connecting parts 10. A temperature characteristic compensation resistor, bridge balance compensation resistor, etc. are provided on the substrate 8. A compensation circuit can be easily adjusted by cutting the part of the pattern of such a resistor.

9 citations


Patent
01 Feb 1980
TL;DR: In this article, a flexible printed circuit board is used to make small the module in size and to make easy for the manufacture, by using the flexible print plane board, and the resulting product is sandwiched with the permanent magnets 47, 47 and it is connected to the lead wire 45 in the shiled case 40 by floding the outer lead terminal 34 together with the wing part 25 of the board 31; the small size mudule having narrow lead wire distance can easily be made.
Abstract: PURPOSE:To make small the module in size and to make easy for the manufacture, by using the flexible printed circuit board. CONSTITUTION:After winding the drive coil 36 around the flexible print plane board 31 mounting the chip 12, the resulting product is sandwiched with the permanent magnets 47, 47, and it is connected to the lead wire 45 in the shiled case 40 by floding the outer lead terminal 34 together with the wing part 25 of the board 31; the small size mudule having narrow lead wire distance can easily be made. Further, since the thickness of the flexible board is thin, the machining for the wing part is easier.

7 citations


Patent
08 Dec 1980
TL;DR: In this paper, the flexible component of a membrane switch is formed of paper and it is used in electrical devices, such as membrane switches, which can be used for electrical applications.
Abstract: This invention relates to flexible materials for use in electrical devices, such as membrane switches. The flexible component of the device is formed of paper.

6 citations





Patent
26 Dec 1980

3 citations









Patent
29 Jan 1980
TL;DR: In this article, a substrate for flexible printed circuits was proposed by coating a metal foil with an organic solvent solution of a heat resistant resin composition consisting of an heterocyclic ring and epoxy resin and then drying the metal foil to thereby form a film directly on the foil as a material adapted for a flexible printed circuit board.
Abstract: A substrate for flexible printed circuits obtained by coating a metal foil with an organic solvent solution of a heat resistant resin composition consisting of a heat resistant resin having an heterocyclic ring and epoxy resin and then drying the metal foil to thereby form a film directly on the foil as a material adapted for a flexible printed circuit board, and a method of fabricating the same. The printed circuit board exhibits heat resistance, fire retardance, adhesion, electric insulation and heat deterioration characteristics which are remarkably superior to the conventional circuit board which is obtained by integrating a heat resistant film with a metal foil via an adhesive. These properties are very important in practical use of the printed circuit board. The substrate of this invention is inexpensive since it can be easily fabricated as compared with the conventional one. This substrate can also be used for not only various flexible printed circuit boards but also as substrate for films alone.



Patent
20 Dec 1980

Journal ArticleDOI
TL;DR: In this article, the functional correlation between bending radius, material thickness, type of material, design of the circuit and number of bending cycles was investigated and the results of these investigations are based on a great number of bend experiments performed on a practical basis and demonstrate the numerical relation between all effects.
Abstract: In the course of flexible PCB manufacture where the reliability of those parts subjected to bending stresses is a matter of utmost concern, the design of the PCB should enable the flexible interconnection parts to withstand the greatest possible bending stresses. Therefore, extensive investigations were carried out to demonstrate the relationship between the design and flexural strength. The study shows the functional correlation between bending radius, material thickness, type of material, design of the circuit and number of bending cycles. Only with a detailed knowledge of these five mentioned properties can reliable PCBs be designed and manufactured. The results of these investigations are based on a great number of bending experiments performed on a practical basis and demonstrate the numerical relation between all effects. As bending cycle results are subject to relatively high deviations, the whole problem has been investigated by means of statistical evaluation criteria.