Showing papers on "Flexible electronics published in 1987"

Multilayer combined rigid and flex printed circuits

Abstract: Multilayer rigid flex printed circuits are fabricated by a novel process to provide structures having rigid sections incorporating insulator materials which, when subjected to elevated temperatures, do not expand sufficiently in the Z direction to cause difficulties, including delamination and cracking of plated through barrels. The flex section includes flexible insulator materials which extend to but not a substantial distance into the rigid section.

Connection for flexible apparatus

Abstract: A connection for flexible circuits permits one or more flexible circuits such as flat flexible cables to be connected to a standard and widely used electrical connector such as a printed circuit board edge connector. The connection includes a substantially rigid flexible circuit structure having a carrier of flat planar configuration with opposed surfaces. A flexible circuit is adhesively bonded to at least one surface with conductive traces of the circuit exposed. Electrical connections are made to the traces by inserting the carrier with attached flexible circuit into a connector having a housing supporting a plurality of terminals with contact portions in a linear array engageable with the exposed conductive traces of the flexible circuit.

High density flexible circuit connector

Abstract: A clamping system for use in connecting high density flexible circuit to a rigid printed circuit board. The clamping system utilizes metal-on-elastomer (MOE) strips contained in a MOE holder and held in place by clamping components to provide electrical connections between the high density flexible circuit and the rigid printed circuit board. The clamping system utilizes a flexible mouth surrounding the high density flexible circuit to alleviate stress on the high density flexible circuit, a special plating on the conductors of the high density flexible circuit to prevent oxidation, and a stiffener clamp to provide stability for the MOE strips.

Flexible printed circuit board

Abstract: A printed circuit board is provided wherein a composite metal layer is affixed to at least one surface of a flexible dielectric substrate, the composite metal layer comprising an inner aluminum layer and an outer copper layer. Owing to the relatively high elongation of the aluminum layer, when the printed circuit board is flexed the circuit thereon does not crack.

Flexible printed circuit board terminal structure

Abstract: A flexible printed circuit board terminal structure includes a flexible printed circuit board composed of electrically conductive patterns formed on a flexible insulative film of a thermoplastic synthetic resin by the screen-printing of an electrically conductive coating, and an insulative coating of synthetic resin disposed on the insulative film on a portion thereof except for a terminal section defined at one edge. Metallic terminal members are placed on the electrically conductive patterns at the printed circuit board terminal section directly or through the intermediary of an electrically conductive adhesive, a terminal fixing film made of a thermoplastic synthetic resin having the same properties as the thermoplastic insulative film is placed on the terminal section from above the metallic terminal members, and predetermined portions of the thermoplastic insulative film and terminal fixing film, with the exception of portions at which the metallic terminal members are situated, are thermally fused.

Flexible printed circuit board base material

Abstract: A flexible base material for use in printed circuit boards is provided wherein a sheet of porous, expanded polytetrafluoroethylene is impregnated with a bismaleimide-triazine resin, and the resin is cured therein. The sheet may be laminated to a glass cloth and composites may be produced having a multiplicity of layers of such sheets and glass cloths.

Direct contact flexible circuit interconnect system and method

Abstract: A flexible circuit interconnect system and method for providing direct electrical contact between a flexible circuit and a printed circuit board or an additional flex circuit is disclosed. In one embodiment, elastomeric material is located between the flex circuit and a rigid support to provide an interconnection receptacle for electrical contact with a printed circuit board. In another embodiment, one flex circuit surrounds a formed elastomeric wedge and a second flex circuit is rigidly supported with an opening corresponding to the wedge. Compression of elastomeric material maintains direct contact between the connecting pads of the circuit members.

Miscible blends of poly(aryl ether sulfones)

Abstract: Described herein are miscible blends of select poly(aryl ether sulfones). These blends are suitable for printed wiring board substrates, flexible printed circuit boards, electrical connectors and fabricated articles requiring high heat and chemical resistance, and good dimensional and hydrolytic stability.

Thin film magnetic head having Au ultrasonic connection structure

Abstract: Conductor film terminals of a thin film magnetic head are composed of an Au film while lead terminals of a flexible printed circuit board are covered with an Au layer, so that both of these terminals can be bonded by low temperature ultrasonic bonding directly between Au and Au. The reverse surface of the lead terminals of the flexible printed circuit board is bonded and fixed to a flexible polymer resin cover film so that the dimensional accuracy of the bonded terminal portion can be improved.

Low Thermal Expansion Polyimides and their Applications

Abstract: Thermal expansion coefficients (TECs) for polyimides differ very much depending on their chemical structures. Polyimdes with a rod-like structure as their backbone chains have lower TEC values. This is attributed to restraining of thermal expansion by rod-like molecules within intermolecular spaces, analogous to glass fibers in FRPs. The development of new polyimides which can closely match TECs of inorganic materials, such as metal or Si, can eliminate problems produced by thermal stress including warping, cracking or delamination. A new multilevel interconnection system using multilayered dielectrics consisting of low thermal expansion polyimide and inorganic materials has been proposed as one future technology for submicron VLSIs. Consequently, adhesiveless, high quality flexible printed circuit boards have been developed using a polyimide with the same TEC as copper foil. Their most significant property is a high dimensional stability after heat treatments, such as in a soldering process. Furthermore, they have very high adhesion strength at elevated temperatures.

Bonded press pad

Abstract: A reusable bonded press pad (1) suitable for use in the lamination of multilayer, flexible printed circuit boards is provided. The bonded press pad (1) comprises three separate layers of material bonded together: a sheet of resilient material (33) having a sheet of a release film (31, 35) bonded to each side with a suitable adhesive. The bonded press pad (1) reduces the surface adhesion between the press pad (1) and the packaging materials and minimizes static discharge encountered when breaking up the laminate package (10).

Disposition of a flexible printed circuit board in a camera

Abstract: A camera has a flexible printed circuit board provided with a storage device, such as an EEPROM, which is capable of electrically effecting the writing and erasing of information. The flexible printed circuit board is disposed along a front surface portion and along another surface portion of a camera body, and an information writing pad for the storage device is disposed in such a manner as to overlay a surface of a projecting portion which projects forward from a substantially flat portion of the camera body.

Floating type magnetic head device

Abstract: PURPOSE:To hold a magnet wire without fail by sticking a flexible printed circuit board up to the vicinity of a base through a plane part with the bending part of the tip part of a load arm as a starting point and connecting the terminal of a flexible printed circuit board and the edge part of the magnet wire on a bending step part. CONSTITUTION:At the tip part of a load arm 1, a bending step part 7 is formed, and a flexible printed circuit board 8 is stuck through a plane part from the step part to the vicinity of a base part. Consequently, after sticking, an equivalent oscillation is added, and even then, the sticking is peeled off and not omitted from the load arm 1. By connecting a magnet wire 4 and a terminal 8a of the flexible printed circuit board 8 on the bending step part 7, the connection can be executed easily and without fail, and even when the equivalent oscillation is added, the connection is not dislocated from the part.

Laminate for rigid-flexible printed circuit boards

Abstract: 1. A prelaminate which may be used instead of flexible single layers in the construction of rigid-flexible circuit boards, characterized in that it consists of a plate (1) of a non-flexible (rigid) material into which flexible, adhesive-coated plastic films (2) free from edge gaps and equal in thickness to the plate (1) are inserted in the regions where the subsequent circuit board is to be flexible, the regions of the inserted flexible plastic films having to be 2 to 10 mm larger than the desired subsequent flexible regions of the circuit board.

Multilayer printed circuit board having rigid and flexible parts

Abstract: 1. A multilayer, locally rigid and locally flexible circuit board with through-connection holes consisting of several individual layers press-moulded with one another, characterized in that it is made up alternately of first single or double layers (2) and second single or double layers (3) of the same non-flexible (rigid) material into which flexible adhesive-coated plastic films (4) free from edge gaps, of equal thickness and with a somewhat larger area than corresponds to the flexible region are inserted in the regions in which the circuit board is intended to be flexible and in that the through-connection holes (7) are only introduced in those regions of the circuit board (1) which, over the cross-section, predominantly consist solely of the material of the rigid single layers (2, 3) and copper.

Method for producing rigid-flexible multilayer circuits

Abstract: In the case of a method for producing rigid-flexible multilayer circuits, using rigid printed circuit boards and flexible metal-plastic laminates, both the rigid and the flexible regions of the multilayer circuit initially containing rigid printed circuit board parts, and the latter being removed in the flexible regions once processing has been carried out, the mutually adjacent printed circuit board parts are connected, such that they are completely separated from one another by continuous joints, in a flat manner to the flexible laminate, under the influence of pressure and heat. An isolating film, a thermoplastic pressure compensation film and a reinforcing film are applied onto the outer surfaces of the printed circuit board parts, so that the material of the pressure compensating film penetrates into the joints between the printed circuit board parts and connects and seals them. After removal of the three attached films and further processing of the rigid regions, those printed circuit board parts which lie over the flexible regions can be removed.

Flexible printed circuit board and process for its production

Abstract: The flexible print board contains as an insulating material a less heat-swelling resin having structural units represented by general formula (I), wherein Ar1 represents a tetravalent aromatic group, and Ar2 represents a compound of formula (II), (III) or (IV), wherein R1 to R8 may be the same or different and each represents a lower alkyl group, a lower alkoxy group or a halogen atom, and n1 to n8 each represents an integer of 0 to 4. This flexible board is produced by directly applying a solution of polyamidoimide precursor on a conductive substance and conducting imidation to form the insulating material of the less heat-swelling resin of the above-described general formula (I). The flexible printed circuit board undergoes less curling and has excellent adhesiveness, bending resistance, and dimensional stability.