Showing papers on "Flexible electronics published in 1995"

Flex circuit connector

Abstract: A connector (10) is provided for electrical connection to a flex circuit (12) in a hermetically sealed manner. The flex circuit comprises thin film conductors (26) encased between layers of insulative material, and including a proximal end (20), with conductive contact pads (30) exposed through one of the insulative layers. In a preferred form, the proximal ends of two flex circuits are assembled in face-to-face relation and compressed by a clamp fixture (16) against opposite side faces of a compressible terminal block (18). The terminal block is formed from a resilient insulative elastomer such as silicone rubber with embedded conductive strips (40) having opposite edges exposed at the opposite side faces of the terminal block for electrically connecting aligned pairs of the contact pads on the two flex circuits.

Optical module circuit board having flexible structure

Abstract: It is an object of the present invention to provide a highly reliable optical module circuit board having a sufficient mechanical strength with respect to an external stress. An optical module circuit board (8) according to the present invention includes a flexible printed circuit (46) having at leat a multilayered structure in which a layer containing a conductive metal interconnection is sandwiched between insulating layers, wherein the flexible printed circuit includes a main body portion (46a) having the multilayered structure, a first surface mounted with an electronic component, and a second surface opposite to the first surface, a neck portion (46c) having the multilayered structure and extending from one end of the main body portion, and a head portion (46b) positioned at a distal end of the neck portion extending from the one end of the main body portion, having the multilayered structure, and mounted with an optical operation element and a bypass capacitor. Particularly, the neck portion (46c) defines the positional relationship between the main body portion (46a) and the head portion (46b) so as to give the circuit board (8) a sufficient mechanical strength.

Microstrip flexible printed wiring board interconnect line

Abstract: An RF flexible printed wiring board transmission line for connecting strip transmission line microwave assemblies without the use of coaxial connectors and coaxial cables. The flexible transmission line includes a thin flexible dielectric ribbon, having on one side a ground plane layer and on the other side a microstrip conductor strip. Plated through holes at the ends of the flexible line provide access to both the ground plane and conductor strip on the same side of the flexible line, to facilitate interconnection of the microwave assemblies to the flexible line. The flexible line operates at microwave frequencies with little or no radiation leakage.

Flexible printed circuit harness device and flexible circuit used thereof

Abstract: A first electrical connector 30 and a second electrical connector 40 are installed on opposed ends of a two-sided flexible printed circuit 50, and the connectors are connected by two layers of conductive patterns. In the intermediate parts 22a and 22b, the conductors 20a of the upper-side circuit pattern and the conductors 20b of the lower-side circuit pattern are arranged so that they extend substantially parallel to each other and are shifted in a pitch direction. Accordingly, electrical connections can be realized in which crosstalk is prevented while a relatively high impedance is maintained; furthermore, the resistance of the FPC 50 to bending is also strengthened.

Silicon on insulator achieved using electrochemical etching

Abstract: Bulk crystalline silicon wafers are transferred after the completion of circuit fabrication to form thin films of crystalline circuitry on almost any support, such as metal, semiconductor, plastic, polymer, glass, wood, and paper. In particular, this technique is suitable to form silicon-on-insulator (SOI) wafers, whereby the devices and circuits formed exhibit superior performance after transfer due to the removal of the silicon substrate. The added cost of the transfer process to conventional silicon fabrication is insignificant. No epitaxial, lift-off, release or buried oxide layers are needed to perform the transfer of single or multiple wfers onto support members. The transfer process may be performed at temperatures of 50 °C or less, permits transparency around the circuits and does not require post-transfer patterning. Consequently, the technique opens up new avenues for the use of integrated circuit devices in high-brightness, high-resolution video-speed color displays, reduced-thickness increased-flexibility intelligent cards, flexible electronics on ultrathin support members, adhesive electronics, touch screen electronics, items requiring low weight materials, smart cards, intelligent keys for encryption systems, toys, large area circuits, flexible supports, radiation-hard circuits and other applications. The added process flexibility also permits a cheap technique for increasing circuit speed of market driven technologies such as microprocessors at little added expense. Using these techniques, radiation hardened circuits can be produced.

Unpackaged semiconductor testing using an improved probe and precision X-Y table

Abstract: A portable integrated circuit die testing system that offers a cost-effective solution for electrically testing bare, unpackaged, integrated circuit chips or die. The system provides for direct electrical interconnection of die of various sizes and thicknesses to an automatic tester without wire bonding or packaging of the semiconductor chip or die. The system includes an X-Y table that is adjustable in horizontal X and Y directions. A contact platform is disposed above the X-Y table that has an opening therein, and is movable in a vertical direction relative to the X-Y table. An adjustment member is coupled to the contact platform for finely adjusting the movement thereof in the vertical direction. A die holder is secured to the X-Y table for holding the die that is to be tested, and in response to movement of the X-Y table. A vacuum connection is provided for drawing a vacuum on the tested die to secure it in the die holder. A probe flexible printed circuit is secured to the contact platform that extends into the opening in the contact platform and includes a plurality of bumps that mate with contact pads on the die. An interface flexible printed circuit is coupled between the probe flexible printed circuit and the automated test equipment. A microscope is used to align the bumps of the printed circuit to the contact pads on the die, which completes an electrical path between the die and the automated test equipment.

Flexible printed circuit board

Abstract: PURPOSE:To provide a flexible printed circuit board which can be bent precisely and easily along the bending line. CONSTITUTION:With a flexible printed circuit board that comprises a base film 1, a conductive pattern 12 formed on it and a cover film 13 placed on the pattern 12, a flexible printed circuit board 10 that is provided with a folding guide 16 formed along a folding line A is constituted.

Flexible printed circuit device

Abstract: A multi-layer, flexible printed circuit device having a relatively rigid electronic component mounting portion and a relatively pliable connection wiring portion. The electronic component mounting portion comprises multiple layers of bases including at least one rigid base, and circuit pattern layers. The pliable connection wiring portion is formed by extending pliable bases and circuit pattern layers at one end. The rigidity of the electronic component mounting portion may be maintained by means of the rigid base or bases comprising a thick panel made of the same material as the pliable bases. Alternatively, the copper films of the circuit pattern layers may be made relatively thick or a base material with high rigidity may be used.

Head signal supply/retrieval structure for magnetic disc drive

Abstract: A disk drive having a connection structure between a head and a main flexible printed circuit sheet, allowing a signal to be supplied to and taken out of a head in response to size reduction and thickness reduction of the disk drive. The disk drive includes an actuator arm rotatably mounted in a housing, and a suspension having a base end portion fixed to a front end portion of the actuator arm and a front end portion for supporting the head. The main flexible printed circuit sheet is fixed at its one end portion to the actuator arm. An interconnection flexible printed circuit sheet is mounted along one side surface of the actuator arm so as to extend substantially parallel to the upper surface of the actuator arm, and connects terminals of the suspension and terminals of the main flexible printed circuit sheet.

Electronic circuit structure with aperture suspended component

Abstract: An electronic circuit structure having a reduced size includes a circuit substrate, an aperture extending through the circuit substrate, and an electronic component suspended within the aperture. The suspension of the electronic component within the aperture significantly reduces the profile of the overall electronic circuit structure. The aperture further enables electronic components to be mounted in a partially overlapping fashion to reduce the surface area of the electronic circuit structure. The electronic circuit structure can make use of standard FR-4, G-10, or ceramic circuit substrates or multilayer flex circuits, as well as electronic components in the form of standard leaded integrated circuit packages. The mounting of the electronic component within the aperture of the circuit substrate provides an advantage of assisting in heat dissipation. The incorporation of mesh-like voltage and ground planes can further aid in heat dissipation and provide electrical isolation and capacitive filtering. In addition, the electronic circuit structure facilitates high density packaging of several electronic structures, for example, in a stacked or radial configuration.

Hybrid junction box and jumper clip

Abstract: The present invention hybrid junction box 11 joins two or more external electric current carrying members within a vehicle electrical system 14 and is comprised of a protective cover 31 and a protective housing 39 which define a casing having a cavity therewithin where a plurality of internal electric current carrying circuits are juxtaposed. The internal electric current carrying circuits may include at least one conducive deposited metal trace directly on the casing. Furthermore, a junction box 11 of the present invention has a plurality of internal electric current carrying circuits which may additionally include a flexible printed circuit board 37. Moreover, a junction box of the present invention provides for use of a rigid printed circuit board 33 and/or a busbar and insulator assembly 35 in combination with either or both the conductive deposited metal traces 67 and the flexible printed circuit board 37. The present invention is also comprised of various methods for electrically connecting together the various combinations of the preceding internal electric current carrying circuits. The present invention further uses a jumper box interconnect 193 to provide a programmed function within the busbar and insulator assembly 35.

Head locating actuator having reduced susceptibility to dynamic reaction force effects, and a disk apparatus incorporating the same

Abstract: A disk locating actuator of a disk apparatus has a carrier member carrying a head and a curved flexible printed circuit fixed at its one end to the carrier member and at its other end to a base. Angles at which the flexible printed circuit is fixed are suitably determined so as to diminish any dynamic reacting force produced by vibration of the flexible printed circuit, thus ensuring high degree of head locating precision.

Zero insertion force connector for flexible circuit boards

Abstract: In a zero insertion force connector for flexible circuit boards, there are a housing, plural flexible circuit boards in multiple rows, an insulator holding the flexible circuit boards and displaceable in perpendicular to the flexible circuit boards in the housing, a counterpart insulator having plural pairs of broader counterpart contacts than thickness of the flexible circuit boards, and a driving member for displacing the insulator so as to incline the flexible circuit boards. When the driving member is operated, the insulator presses the flexible circuit boards. Then the flexible circuit boards incline, and connect the counterpart contacts respectively.

Coil-shaped flexible printed circuit board

Abstract: A coil-shaped flexible printed circuit board retains its original outer diameter unchanged without any guide or retainer For this purpose, either the conductive pattern of copper or synthetic base material is processed to have a permanent stretch before or when the board is wound into a coil shape A squeezing step may be employed to generate the permanent stretch on the conductive pattern Alternatively, a heat treatment of the base material may be used to form an additional bridged ingredient after the board has been wound The additional bridged ingredient may retain the coil shape unchanged for a long time without guiding pieces

Flexible printed circuit board in double-layer structure

Abstract: PURPOSE:To provide a flexible printed circuit board in double-layer structure which is narrow and is suited for a high-speed signal transmission. CONSTITUTION:In the printed circuit board, ground wire patterns 32 and 32' on the upper and lower surfaces of an insulation strip are zigzaged in the width direction of an insulation material strip, are crossed in an X-shape at a plurality of locations according to the top view, and then these crossed parts are connected by a through hole 5. A plurality of small loops are formed by the ground wire patterns 32 and 32' on the upper and lower surfaces of the insulation material strip and the through hole 5 for connecting them. Therefore, a resonance frequency can be made higher than a signal frequency band, thus achieving a high-speed and high-quality signal transmission.

Flexible circuit connector

Abstract: A flexible circuit connector is formed from a flexible printed circuit comprising a plurality of embedded electrically conductive lines partially exposed at a first end of the flexible printed circuit by bending or folding the flexible printed circuit to enable said first end to mate with a board mounted connector, thereby eliminating the need for a mating connector. When the flexible circuit connector is properly inserted into the board mounted connector, the mating of said plurality of exposed electrically conductive lines of said flexible circuit connector with a plurality of metal contacts on the board mounted connector provides an electrical interface between the flexible printed circuit and the board mounted circuit, as well as the boards on which the flexible printed circuit and board mounted connector are attached.

Liquid crystal display device and its production

Abstract: PROBLEM TO BE SOLVED: To provide a liquid crystal display device with which miniaturization is possible by solving the high resistance problem on a glass substrate and a process for producing the same. SOLUTION: The connecting terminal 4a for output of a structure for packaging a semiconductor element 3 by COG (chip-on-glass) onto the glass substrate 1 of a liquid crystal panel 1 is connected onto a conductive pattern 2a for output formed on the glass substrate and the connecting terminal 4b for input is connected onto the metallic wiring 5a of an FPC (flexible printed circuit) 5. As a result, the supply of input signals without using the conductive patterns on the glass substrate having a problem in the supply of the input signals to the semiconductor element 3 is made possible. COPYRIGHT: (C)1997,JPO

Flexible printed circuit sleep switch for electronic device

Abstract: A notebook computer or other electronic device has a flexible cable interconnecting electronic circuitry in a base with electronic circuitry in a cover. A flexible potentiometer is coupled to said flexible cable in a location which bends when said cover is opened and closed with respect to the base. The resistance of the flexible potentiometer has a first value when the cover is closed and has a second value when the cover is open. A detection circuit is responsive to the resistance of the flexible potentiometer and generates an output signal which indicates whether the cover is open or closed.

Flexible printed circuit board

Abstract: PROBLEM TO BE SOLVED: To provide a copper film FPC board wherein adhesion between a plastic sheet and a copper film is improved. SOLUTION: A nichrome alloy is rendered to magnetron sputtering deposition onto a polyimide film whereby an approximately 200 A nichrome alloy thin film is deposited to form a contact layer. Then, copper is rendered to sputtering deposition onto the contact layer to form an approximately 1500 A copper film whereby a highly adhesive copper film FPC board is provided.

Method of making an acceleration sensor

Abstract: A semiconductor type acceleration sensor comprises a flexible printed circuit board on which a semiconductor type detector chip section is mounted. The detector chip is formed with openings therethrough overlapping an opening formed in a rear-side base plate of the flexible printed circuit board such that the detector chip section is supported only by a bridge portion. In case of excess input in an acceleration direction, elastic deformation of the bridge portion and a bending portion of the flexible printed circuit board provide absorption of the excess input for protecting the detector chip section.

Radio comprised of flexible elements

Abstract: A radio (100) which includes a plurality of printed circuit boards (101) which are positioned in a planar arrangement so to provide a substantially fiat structure. The printed circuit boards (101) are connected using flexible conductors (105) which mechanically and electrically couple the printed boards (101) and provide a flexible link to allow the printed circuit boards (101) to be manipulated into various configurations. A flexible radio housing (151) is used to encapsulate the printed circuit boards (101) and flexible conductors (105) allowing radio (100) to be impacted and/or easily manipulated without crushing the contents. The radio (100) may be worn and easily concealed on the body without risk of breakage.

Electric connector and manufacture thereof

Abstract: PURPOSE: To provide a connector capable of connecting a surface mounting type LSI or the like to an electronic circuit board and provide a manufacturing method for this connector. CONSTITUTION: A flexible conductive wire 21 is bonded to the edge of each conductive part 11 of a flexible circuit board 10 with a wire bonder so as to incline at about 45 deg. upward, then cut in specified length. Laser beams are applied to the cut end (tip) of the flexible conductive wire 21 to form a globular electrode 22, then a frame member 31 is placed on the surface of the flexible circuit board 10. In this state, a liquid insulating material such as silicone rubber is filled on the inside of the frame member 31 on the flexible circuit board 10, the liquid insulating material is cured, and an insulating elastic layer 32 through which the frame member 31 and the flexible circuit board 10 are bonded together is formed. Solder is filled in a through hole 12 from the back side of the flexible circuit board 10 to form a projecting electrode 12.

Flexible printed circuit board

Abstract: A flexible printed circuit board is constituted with a first insulation film covering a first insulating resist layer, a second insulation film covering a second insulating resist layer and a printed circuit formed between the first insulating resist layer and the second insulating resist layer, and a terminal of an electronic component is disposed on the printed circuit, and the second insulation film is pressed and heated

Reinforcement for flexible printed circuit board and reinforced flexible printed circuit board

Abstract: A reinforcement for a flexible printed circuit board, which can sufficiently prevent the flexible printed circuit board thus reinforced from being warped when heated during the assembly process of electronic components or other procedures. The reinforcement according to the present invention is used to adhere to a flexible printed circuit board 1. The reinforcement according to the present invention comprises an internal material 21 having a bending neutral surface at the center of the thickness thereof, and an external material 22 having the same Young's modulus as that of an insulating substrate 11 of the flexible printed circuit board 1, bonded to one side of the internal material 21. The other side of the internal material 21 acts as an adhesive surface to the flexible printed circuit board 1.

Soldering of conductor paths of flexible printed circuit to respective mounting surfaces

Abstract: The connecting faces of a circuit board are soldered to conductive paths of a flexible printed circuit by a process in which the coupling ends of the conductive tracks are pressed in the coupling region by a soldering tool for connection by soldering The circuit board has heat-inducing faces formed on the obverse side, away from the connecting faces, in a mirror image configuration to the latter The heat-inducing faces are coupled to the connecting faces via galvanically formed, electrically conductive, heat conductive sleeves, with soldering heat provided mostly fro the obverse side, and only fractionally by the flexible printed circuit

Manufacture of board for flexible printed circuit

Abstract: PROBLEM TO BE SOLVED: To provide a board for flexible printed circuit of continuous roll having bending resistance, alkali resistance, solvent resistance, heat resistance, electrical characteristics and mechanical characteristics, by continuously performing a sticking process by using double-belt press, when a polyimide film and a conducting foil are stuck together, interposing an adhesive agent layer. SOLUTION: When a polyimide film and a conducting foil, e.g. a copper foil, are stuck together, interposing an adhesive agent layer, the sticking is continuously performed by using double-belt press. Polyimide based adhesive agent layer is desirable for the adhesive agent layer. As to the above manufacturing method, the following are used; a method wherein adhesive agent is spread on a polyimide film and dried, and polyimide with adhesive agent is obtained and stuck on a copper foil, and a method wherein adhesive agent is spread on a copper foil and dried, and a copper foil with adhesive agent is obtained and stuck on a polyimide film. As to the double-belt press, e.g. a liquid pressure system using thermal medium, and a lamination method which is performed by interposing an induction heating roll capable of uniform heating at a high temperature are used. COPYRIGHT: (C)1997,JPO

Connecting device of a flexible printed circuit in a hard disk drive

Abstract: The present invention relates to a connecting device of a flexible printed circuit (FPC) in a hard disk drive and more particularly to a connecting device of a flexible printed circuit, which is connected between a head installed at an actuator of the hard disk drive and a printed circuit substrate and removes a bias force generated in the flexible printed circuit, thus transmitting a signal between the head and the flexible printed circuit. The connecting device of the flexible printed circuit for transmitting the signal between the printed circuit substrate installed at a body base and a preamplifier which is connected to a signal cable of the magnetic head at the actuator in the hard disk drive, includes a boss having a hole passing through a center portion and a side hole; a pivot bearing fixed at the boss in order to enable the actuator to be rotated; and a pivot screw for forming a wire hole, and being inserted into a female screw formed within the boss, and then for being fixedly installed at the pivot bearing, thereby being coupled to a connecting wire through the side hole, the hole and the wire hole of the pivot screw.

Area bonding conductive (ABC) adhesives for flex circuit connection to LTCC/MCM substrates

Abstract: This paper describes the use, at the Harris Corporation, of a new type of Z-axis conductive epoxy adhesive for connecting four high density Multichip Modules (MCM's) together using fine pitch flex circuits. The MCM's fold together into the size of a cigarette pack. The flex circuits are copper/polyimide and the MCM substrates are made from Low Temperature Co-fired Ceramic (LTCC). The conductive pads on the flex circuit and on the substrate are in the shape of a series of parallel lines on a pitch down to 0.4 mm. The new adhesives, called area bonding conductive (ABC) epoxy adhesives, were developed under an ARPA contract at the Merix Corp., and are made by a new screening and stencilling process, to produce high strength thermosetting (dielectric) epoxies, which also contain a customized line pattern of electrically conductive epoxy adhesive. In contrast to previous random particle Z-axis adhesives, the ABC adhesives are conductive only at the desired bond pad locations and require no pressure to establish or maintain electrical contacts. This paper shows the bonding and assembly process, explains the cost and other advantages over the previous hot-bar reflow soldering method, and presents thermal shock and other reliability test results.

Electronic circuit structure

Abstract: An electronic circuit structure having a reduced size includes a circuit substrate, an aperture extending through the circuit substrate, and an electronic component suspended with the aperture. The suspension of electronic component within the aperture significantly reduces the profile of the overall electronic circuit structure. The aperture further enables eletronic components to be mounted in a partially overlapping fashion to reduce the surface area of the electronic circuit structure. The electronic circuit structure can make use of standard FR-4, GR-10, or ceramic circuit substrates or multilayer flex circuits, as well as electronic components in the form of standard leaded integrated circuit packages. The mounting of the electronic component within the aperture of the circuit substrate provides an advantage of assisting in heat dissipation. The incorporation of mesh-like voltage and ground planes can further aid in heat dissipation and provide electrical isolation and capacitive filtering. In addition, the electronic circuit structure faciliates high density packaging of several electonic structures, for example, in a stacked or radial configuration.

Flexible printed circuit board

Abstract: PURPOSE:To obtain a protective film used for a flexible printed circuit board, which is excellent in adhesion, adhesive properties, heat resistance, electrical properties, and flexing properties and capable of being processed at a low temperature, by a method wherein it is made of polyimide resin composition. CONSTITUTION:R of polyimide resin in a formula I indicates a quadrivalent organic acid residual radical, 50mol% or more of all acid component which forms R is biphenyl tetracarboxylic acid component represented by a formula II, R of polyimide resin in a formula II indicates a bivalent diamine residual radical, 50 to 99mol% out of all diamine component which forms (b-1)R is diamine compound represented by a formula III, and 50 to 1 mol% of all diamine component which forms (b-2)R is diaminosiloxane represented by a formula IV. 100 parts by weight of the polyimide resin above-mentioned and 0.1 to 10 parts by weight of organic titanium compound are compounded into polyimide resin composition, and a protective film is formed of the above polyimide resin composition and provided onto a flexible printed circuit board.