Showing papers on "Flexible electronics published in 2000"

Temperature sensor with flexible circuit substrate

Abstract: A temperature sensor incorporating flexible circuit technology. A flexible circuit sensor subassembly is composed of a flexible printed circuit substrate on which is printed a sensor circuit. In a preferred example the flexible circuit sensor subassembly, the sensor circuit has a sensor at a distal end, as for example a surface mount device (SMD) thermistor, a plurality of trace pads at a proximate end, and an interconnecting conductive trace between each trace pad and the sensor. A crimp terminal is respectively crimped onto each trace pad to provide a flexible circuit sensor assembly, wherein the crimp terminals are configured as needed for interfacing with an external circuit. The location of the sensor may be selectively located anywhere on the conductive traces to thereby easily size the probe length of the flexible circuit sensor subassembly to suit a any particular application and fit into any housing. A housing id molded over the flexible circuit sensor assembly. The housing either alone or located in an external shell provides a temperature sensor for a particular purpose. In a variation of the flexible circuit sensor assembly, electronic components can be integrated with the sensor circuit to provide a smart sensor circuit, which may include multiple sensing devices.

Compact, flexible, led array

Abstract: A flexible high density low profile lighting system (20) includes a flexible printed circuit board substrate (37) which is adapted to support and electrically interconnect surface mount electronic components. Plurality of surface mount light emitting diodes (32) are mounted on the substrate (37) so as to define a conformably bendable lighting array configured for mounting upon the surfaces with compound curvature. Each of the surface mount light emitting diodes (32) has a footprint of 5 squared mm or less and when mounted adjacent and in contact with one another defines a light intensity output of from about 2 to about 20 candles per cm.

Flexible multiple led module, in particular for a luminaire housing of a motor vehicle

Abstract: The invention describes a flexible multiple LED module having a plurality of rigid printed circuit boards, which are each connected at one of their main surfaces to a flexible printed circuit board with a spacing between one another, and a plurality of LEDs, which are mounted in the region of the rigid printed circuit boards on the flexible printed circuit board. The multiple LED module is suitable particularly for installation in luminaire housings, in particular for motor vehicles.

Sensor device for sensing biometric characteristics, in particular finger minutiae

Abstract: The sensor device is provided for sensing biometric characteristics, in particular finger minutiae, with a biometric sensor chip. The sensor chip is fastened on a flexible printed circuit board that has a highly flexible substrate layer and conductor tracks applied to the substrate layer. The conductor tracks are in electrical contact with the sensor chip and are led to a terminal region of the flexible printed circuit board. The sensing area of the sensor chip is accessible through an opening in the flexible circuit board and the opening is at least partially surrounded by a grounding frame.

Electronic wristwatch including a printed circuit incorporated in a flexible wristband

Abstract: The electronic watch movement components (11, 12) of the watch are mounted on a flexible printed circuit film (10), which is then incorporated in the wristband (1) by overmoulding of an insulating elastomeric material. External elements in the form of cases (2-4) are mounted in a sealed manner on the wristband to protect said components and to cover at least a display unit (20) and an electric power source (15). Decorative elements (5) similar to the cases are distributed along the wristband to imitate links. Such a wristwatch may be manufactured at a low cost.

Flexible microsystem and building techniques

Abstract: The present invention makes use of a flexible printed circuit board (10), not only as a mounting support for electronics components (24) and wiring (12), but also for mechanically supporting components (22) of an electromechanical transducer as well as acting as a main structural member for the entire microsystem. All components (22, 24, 26) necessary for a microsystem may be mechanically mounted onto a flexible printed circuit board (10), which finally is elastically deformed to a required final shape. In the final shape, the resilience of the flexible printed circuit board (10) is used to apply elastic forces on selected components (22) of the electromechanical transducer microsystem.

Substrate coated with a conductive layer and manufacturing method thereof

Abstract: A substrate is coated with a conductive layer, which comprises a conductive layer of bonded ultrafine metal particles formed on the top surface thereof. The ultrafine metal particles have a diameter of 1-20 nm, and the substrate is of a flexible high polymer material. Since the conductive layer is formed by bonded layer of the ultrafine metal particles, an extremely thin layer having high conductivity can be formed. This structure enables the formation of a flexible printed circuit board with high-density interconnects or a transparent conductive film provided with both transparency and conductivity. Conventional vacuum equipments and complicated processes are not necessary for forming the conductive layer on the substrate.

Electrical connector feedthrough to low pressure chamber

Abstract: An electrical feedthrough connector to a low pressure (vacuum) chamber such as in a mass spectrometer comprises an epoxy body having at least two generally cylindrical portions with a step between the two generally cylindrical portions and with the portions mating with circular openings in the housing for the low pressure chamber. A step between the two cylindrical portions of the electrically insulating body mates with a step in the opening in the chamber housing with a gasket such as an o-ring placed between the steps to provide a pressure seal. A rigid printed circuit board with electrical components for an interconnect circuit is affixed to one end of the electrically insulating body with a flexible printed circuit connector extending from the rigid printed circuit board through the epoxy body to the low pressure chamber for interconnecting components within the chamber. The flexible printed circuit board is preferably spaced from the rigid printed circuit board and aligned perpendicular to the rigid printed circuit board thereby eliminating any possible leaks.

Method of manufacture of printed wiring boards and flexible circuitry

Abstract: The present invention relates to the fabrication process for the printed wiring boards and flex circuits. An electrostatic printing plate includes a substrate with an image receiving layer applied thereto. The image receiving layer is a toner with a metallic toner and subsequently fixed in place or is transferred to a layer. The metal toner is then fixed on this receiving surface.

Circuit singulation system and method

Abstract: Electronic circuits such as IC packages, circuit boards, of flex circuits are singulated by laser cutting of adjoining laminated material. The laser beam has a wavelength of less than 400 nm, and either a minimum energy density of 100 J/cm2 or a minimum power density of 1GW/cm2. The method avoids the need for cleaning and intermediate handling, and there is a greatly improved throughput.

Apparatus and method of using flexible printed circuit board in optical transceiver device

Abstract: This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment. A driver or amplifier chip may be adapted to the head region of the flexible printed circuit board. In another embodiment, a heat spreader passes along a surface of the head region of the flexible printed circuit board, and a window is formed in the head region of the flexible printed circuit board. Optoelectronic devices are adapted to the head spreader in such a manner that they are accessible through the window in the flexible printed circuit board.

Circuit to printed circuit board stored energy connector

Abstract: A circuit to printed circuit board stored energy connector. The connector precisely aligns and interconnects conductors of “flexible circuits” (including conductive ink circuits (CIC), flexible printed circuits (FPC), and/or flat flexible cables (FFC)) directly to mating contacts on printed circuit boards. The connector is a zero insertion force (ZIF) type, and is a high density surface mount. The connector comprises mainly an actuator with an activation ridge, a deflectable flat spring contact in a spring support module, and circuit alignment features that use the flexible circuit's existing features—the outline and conductors—to accurately align the conductors of the flexible circuit to their corresponding mating spring contacts. The connector also includes circuit locators, a circuit compression flap and conductor alignment notches which work cooperatively to align and interconnect a flexible circuit to its spring contact. The connector provides a micro-wiping action that will not damage the flexible circuit, and also provides secure connection with a two point, redundant contact.

Integrated solar power module

Abstract: Multiple layers of a clear insulating material, such as clear polyimide, with horizontal metalization layers therebetween and with vertical feed through metal traces therethrough form a flexible three dimension circuit printed circuit board upon which semiconductor devices, such as thin film solar cell can be directly deposited for forming a flexible electronic module, and upon which electronic discrete component can be bonded and electrically connected. In one exemplar configuration, a flexible thin film solar cell power module has thin film solar cells deposited on one side and power converters bonded on the other for a solar array power system. The flexible printed circuit board is well suited for forming electronic systems about a curved surface such as a power sphere nanosatellite.

Electronic control unit having drive element and control processing element

Abstract: In an electronic control unit, a drive element liable to generate heat and a control processing element liable to be affected by heat are respectively mounted on a drive circuit board and a control circuit board different from each other, and the two boards are connected to each other by a flexible printed circuit board. The bonding portion of the flexible printed circuit board to the control circuit board is a back side portion of a connector mounted on the control circuit board at the same side as the control processing element. Therefore, heat generated by the drive element is suppressed from being transferred to the control processing element without causing layout hindrances.

Method for manufacturing lighting system

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a lighting system capable of improving workability in assembling and reducing stress acting to a printed circuit board. SOLUTION: A flexible printed circuit board 4 having plural through holes in a major part is held in a developed state, leads 8a, 8b of plural light emitting devices 7 are inserted into desirable through holes 5a, 5b of the printed circuit board, one lead 8a in the plural light emitting devices and a conductive land of the printed circuit board corresponding to this lead are soldered (9), one end part 4A of the printed circuit board and the other end part 4B are joined in almost a ring shape, and then the other lead 8b in the light emitting device and a conductive land of the printed circuit board corresponding to this lead are soldered. COPYRIGHT: (C)2002,JPO

Flexible printed wiring board and its production method

Abstract: A flexible printed wiring board (10) in which a metallic bump (1a) of a first flexible printed wiring part (1) is connected to a connection pad (2a) of a second flexible wiring part (2), wherein the first flexible printed wiring part (1) is composed of a conductive layer (4) and an insulating layer (5) adjacent to the conductive layer (4), a hole (A) reaching the conductive layer is made in the insulating layer (5), a metallic plug (6) is formed in the hole (A) by electroplating, and the end of the metallic plug (6) projecting from the insulating layer (5) serves as a metallic bump (1a) As many flexible printed wiring boards as possible are produced from a laminated sheet for a flexible printed wiring having a predetermined size

Manufacturing method of rigid flexible printed circuit board

Abstract: The present invention relates to a manufacturing method of rigid flexible printed circuit board. Inner layer circuit are etched on two side of a flexible basefilm and a flat cable for connecting the inner layer circuit on lateral sides is disposed on the middle part thereof. Then layer of outer copper foil without bondfilm made of reinforced fiber on the bottom side thereof is laminated on both sides of the flexible basefilm respectively and drilled a number of through holes on connecting points of preset circuitry thereof. Subsequently, each through hole is metalized and plated for electrically connecting outer copper foil and inner layer circuit on flexible basefilm by means of such plated layer. The copper foil on the top of the flat cable that is on the middle of the flexible basefilm is removed and out layer circuit is made on outer copper foil. At last, the outer layer circuit is covered by solder resist mask. In accordance with the fabricating process mentioned above, the cutting of redundant parts and the trouble of covering protective barrier on flat cable on the middle of the flexible basefilm could be avoided.

Flexible metal laminate and production method therefor

Abstract: PROBLEM TO BE SOLVED: To inexpensively produce a metal laminate for a flexible printed circuit board excellent in heat resistance, dimensional stability, adhesiveness, chemical resistance and alkali resistance and generating nol curl buy directly applying a heat-resistant resin solution to a metal foil to dry the coated foil. SOLUTION: A metal laminate for a flexible printed circuit board is provided by applying a solution of a polyamide resin excellent in heat resistance, dimensional stability, adhesiveness, chemical resistance and alkali resistance to the single surface of a metal foil while leaving a constant amount or more of a solvent and heat-treating the coated metal foil while removing the solvent and controlling the crosslinking reaction of the resin and relaxing the stress of the formed resin film layer in a roll form.

Measurement of printed circuit-to-conductive substrate contact resistance

Abstract: To determine electrical resistance of an ohmic contact between a flexible printed circuit and a metallized layer upon a substrate of piezoelectric material, the printed circuit is provided with two exposed metal pads, in close proximity to each other, and two electrical leads from each pad to locations on the printed circuit that are accessible for probing with a four-lead resistance meter. For measurement of contact resistance in process development and process capability studies, many sets of such pads, of a variety of sizes, may be combined into a single printed circuit. For in-process monitoring of transducer manufacturing, a small number of contact resistance measurement pads may be designed into production printed circuits.

Chip-on-glass (COG) structure liquid crystal display (LCD)

Abstract: A liquid crystal display structure, includes a glass substrate and at least one or more chips mounted on the glass substrate including flexible printed circuit connect pins A common wiring for connecting the at least one or more chips to a flexible printed circuit is formed on the glass substrate The common wiring is connected to the flexible printed circuit connect pins of the at least one or more chips and to the flexible printed circuit at at least one position on the common wiring

Display and its manufacturing method

Abstract: PROBLEM TO BE SOLVED: To provide an organic EL display which is favorable for downsizing and a manufacturing method in which a long term reliability has been secured by preventing a peeling based on the folding of flexible printed circuit board at a connecting part between the flexible printed circuit board for organic EL element driving lead electrode and the organic EL display for an external driving circuit connection. SOLUTION: The connecting part between a lead electrode for driving an organic EL element on a glass substrate by an anisotropic conductive film and a flexible printed circuit board is made to have a structure to sandwich by the glass substrate and a sealing plate.

Ion reflectron comprising a flexible printed circuit board

Abstract: A novel technique utilizing the precision of printed circuit board design and the physical versatility of thin, flexible substrates is disclosed to produce a new type of ion reflector. A precisely defined series of thin conductive strips (traces) are etched onto a flat, flexible circuit board substrate. Preferably, the thin conductive strips are further apart at one end of the substrate and get increasingly closer towards the other end of the substrate. The flexible substrate is then rolled into a tube to form the reflector body, with the conductive strips forming the rings of the ion reflector. The spacing between the traces, and hence the ring spacing, can be readily varied by adjusting the conductor pattern on the substrate sheet during the etching process. By adjusting the spacing between the rings, the characteristics of the field created by the reflectron can be easily customized to the needs of the user.

Surface release film and manufacturing method therefor

Abstract: PROBLEM TO BE SOLVED: To provide a surface release film for use in hot press molding of a flexible printed circuit substrate that leaves no adhered material on the copper electrode parts on releasing, and to provide a manufacturing method therefor. SOLUTION: The surface release film is composed of an alicyclic olefin resin film having a deflection temperature under load of ≥160°C and <200°C, or is composed of a laminate of the film and a resin film. COPYRIGHT: (C)2001,JPO

Wiring harness assembly for an intake manifold

Abstract: A wiring assembly for a plastic intake manifold mounted to an internal combustion engine of a motor vehicle includes a flexible circuit assembly disposed within foam covering the intake manifold. The flexible circuit assembly provides for electrical communication between a controller and a plurality of electrical devices. In one embodiment the electrical devices are integral to the flexible circuit assembly to create a flexible circuit/electrical device assembly forming a single replaceable unit. In another embodiment, multiple flexible circuits are sandwiched between layers of foam, with each flexible circuit separated from the others by layers of foam. Each of the multiple flexible circuits attaches to different types electrical devices or sensors. The invention also provides for a decorative skin disposed over the layers of foam that may include a printed design to eliminate the need for an additional decorative engine cover.

Method for fabricating a flexible printed circuit board with access on both sides

Abstract: A method for fabricating a flexible printed circuit board with access on both sides includes the steps of applying a metallic conductor track sheet to a base sheet and patterning the metallic conductor track sheet in order to produce conductor tracks. A conductor track covering with first contact-making cutouts is applied over the conductor tracks. Second contact-making cutouts are produced in the base sheet material by locally removing the base sheet through the use of laser irradiation. As an alternative, the first contact-making cutouts as well as the second contact-making cutouts can be produced by removing material with a laser.

Flexible printed circuit board arrangement

Abstract: The present invention uses the resilient behaviour of a flexible printed circuit board (10), both to mechanically clamp the components (20) in a permanent manner and to achieve good electrical contacts (24) between conducting parts (12) of the flexible circuit board (10) and the components (20). By cutting the flexible printed circuit board in such a manner that small tab-like, resilient members (12, 16) are formed, the forces caused by elastically deformed resilient members (12, 16) are usable both for mechanically fixing the components (20) and for causing an electrical contact (24). By choosing appropriate sizes of the resilient members (12, 16), the relative strenght of the spring force is increased, which even will be large enough to cause a plastic deformation of the material in the contact points (24) between the conducting resilient members (12) and the component contact members (22). In such a manner, soldering or gluing may be totally omitted.

Partially cut multi-planar flexible printed circuit

Abstract: A partially cut multi-planar flexible printed circuit comprises a substrate, a set of signal conducting elements for differential mode and common mode, a power supply and/or ground. The multi-planar flexible printed circuit is formed by partially grouped cutting a flexible printed circuit at a proper position so that the cross-sectional area of the multi-planar flexible printed circuit at the cut portion can fit in with a small round or square splice hole in addition to a flat rectangular slit for connecting, for example, a liquid crystal display with a notebook computer. Moreover, intervals between edges of a substrate and a plurality of transmission lines are preferably greater than three times of thickness of the substrate.

Optical/electric composite harness

Abstract: PROBLEM TO BE SOLVED: To provide an optical/electric composite harness which is contributory to weight reduction and in which a flexible printed circuit harness is integrated with an optical fiber cable by a simple method. SOLUTION: A circuit wiring 32 is not formed in the POF(Plastic Optical Fiber) fixing part 30 of an FPC 9(Flexible Printed Circuits), and a cover lay 33 is directly placed on an insulating film 31. The POF fixing part 30 is composed of a POF placing part 36 for placing the POF, an extending part 34 which is extended from part of the POF placing part 36 to the width direction of the FPC 9, and a rectangular slit 35 which is bored in the thickness direction of the film of the FPC 9 along the direction orthogonal to the width direction so that the tip end of the extending part is inserted when the extending part 34 is folded back. The POF 12 which is placed on the POF placing part 36 of the FPC 9 is integrated with the FPC 9 by inserting the tip end part 34a of the extending part 34 which is folded back in the direction of the slit 35 into the slit 35.

Signal sampling using flex circuits on direct inter-connects

Abstract: A method and system for sampling data signals between electronic components are provided. The invention comprises using a straight feed-through connector to connect electronic components and attaching one end of a flexible circuit to the pins of the feed-through connector. The other end of the flexible circuit is attached to a display, such as a LED. The display constitutes a field replaceable unit (FRU), which allows a malfunctioning display (i.e. LED) to be replaced without having to remove other electronic components. The present invention can be used for the detection of fault signals, status, idle signals, error checking, and introduction of a signal analyzer.

Flexible circuit using discrete wiring

Abstract: A system and method is described which provides for electrical signal transmission and a secure mechanical attachment in a flexible circuit assembly. The inventive mechanism combines the electrical features of discrete wiring with the mechanical features of etched pads connected to plated vias on flex circuits in order to achieve robustness in both the mechanical and electrical properties. A discrete wire is preferably securely bonded to a conductive pad which pad is then securely attached to a plated via. In this manner, the sequence of connections is made mechanically secure by either ultrasonically bonding or welding the discrete wire to the pad and employing the traditionally robust connection between the pad and the via. The arrangement achieves high quality electrical signal transmission by employing discrete wiring for signal transmission along any path of significant length.