Showing papers on "Flexible electronics published in 2001"

Memory module having series-connected printed circuit boards

Abstract: A memory module having series-connected printed circuit boards is provided. The memory module comprises a plurality of printed circuit boards, each comprising a plurality of memory chips mounted thereon, and signal lines and connection means for electrically connecting the printed circuit boards to one another. The connection means electrically series-connects the signal lines of each of the printed circuit boards. Preferably, an end termination circuit is formed on a terminal of the signal line of the farthest printed circuit board from a connector of a mother board, and the memory chip performs at a speed of approximately 150˜300 MHz. The connection means is a flexible jumper assembly having a flexible film and a jumper line formed on the flexible film. Each of the printed circuit boards further comprises a jumper pad connected with the signal lines. The flexible jumper assembly interconnects the jumper pads of each of the printed circuit boards to one another. Among a plurality of the printed circuit boards, conductive leads are formed on an edge of one of the printed circuit boards. The conductive leads serve to connect the circuit boards with the connection means. The printed circuit board comprising the conductive leads is disposed on the first or the final of a plurality of the printed circuit boards. The jumper pads of each of the printed circuit boards are disposed opposite to the corresponding jumper pads of the other printed circuit boards.

Flat panel display module and method of manufacturing the same

Abstract: A flat panel display module includes a transparent substrate, a light emitting section, a sealing cap, a flexible printed circuit board and a semiconductor device. The transparent substrate with a wiring line terminal section is formed on one of surfaces of the transparent substrate in at least one of opposing ends of the transparent substrate. The light emitting section is provided in a display region in a center section on the surface on which the wiring line terminal section of the transparent substrate is formed. The sealing cap is provided for a sealing region to cover the light emitting section such that ends of the sealing cap does not reach the ends of the transparent substrate or the wiring line terminal section of the transparent substrate. The flexible printed circuit board is connected to the wiring line terminal section and extending along the sealing cap of the transparent substrate. The semiconductor device is mounted on the flexible printed circuit board for the light emitting section.

Computer keyboard key device made from a rigid printed circuit board

Abstract: A key device for a computer keyboard has a rigid printed circuit board, a flexible printed circuit board, and a key structure. The rigid printed circuit board has two adjacent but unconnected conductive ends electrically connected to two wires respectively. The flexible printed circuit board, fixed over the rigid printed circuit board, has a conductive segment installed above the two conductive ends, and an isolation layer installed around the conductive segment to form a gap between the conductive segment and the two conductive ends. The key structure is moveably fixed on the flexible printed circuit board in an up and down manner. When the key structure is pushed downward, the bottom of the key structure will touch the conductive segment of the flexible printed circuit board, and the conductive segment will touch the two conductive ends of the rigid printed circuit board to electrically connect the two conductive ends and the two wires.

Fluidic self-assembly of semiconductor devices: a promising new method of mass producing flexible circuitry

Abstract: We review the basics of fluidic self-assembly, some recent processing developments, and some of the applications of this technology. In particular, we discuss the shape of the NanoBlock/sup TM/ IC devices used in FSA/sup TM/ processing, present a brief overview of the versatility of our process, and outline both a current process application and some future potential applications.

Base sheet for flexible printed circuit board

Abstract: The subject matter of the invention is a base sheet for the preparation of a flexible printed circuit board which is a three-layered laminate consisting of (a) an electrically insulating film of a plastic resin such as a polyimide, (b) an epoxy resin-based adhesive layer and (c) a copper foil bonded to the film (a) with intervention of the adhesive layer (b). The base sheet can exhibit excellent performance in respect of peeling resistance, soldering heat resistance, dimensional stability and solvent resistance as well as workability into a printed circuit board only when each of the layers (a), (b) and (c) has a specified thickness in a narrow range of 10-30 μm, 5-15 μm and 5-15 μm, respectively.

LED illumination system and manufacturing method thereof

Abstract: A miniaturized LED illumination system comprising a flexible printed circuit board held in a prescribed three-dimensional shape, and a large number of light emitting diode elements mounted in accordance with a prescribed pattern directly on said flexible printed circuit board. Preferably, the system further includes a housing for holding said flexible printed circuit board in said prescribed three-dimensional shape, and a protection layer for generally protecting said light emitting diode elements.

Epoxy resin composition and cured object obtained therefrom

Abstract: An epoxy resin composition which is suitable for use in applications such as laminates, metal foil-clad laminates, insulating materials for build-up substrates, flexible printed circuit boards, and materials for flexible printed circuit boards, and gives a cured article excellent in heat resistance, flexibility, adhesion, dielectric properties, and toughness. The epoxy resin composition is characterized by comprising as essential ingredients (a) an epoxy resin, (b) an amine compound hardener, and (c) a block copolymer comprising a polyamide block containing phenolic hydroxyl groups and a poly(butadiene-acrylonitrile) block.

Connecting method and connecting structure of printed circuit boards

Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

Conformal fluid data sensor

Abstract: A gaseous fluid data sensor assembly for acquiring data regarding the ambient environment adjacent a surface of an airframe with adjacent air speeds below 40 knots (or another aerodynamic structure with low speed gaseous fluid flow adjacent thereto) having a flexible substrate adhesively conforming to the airframe surface, a conformable cover layer and a relatively thin air data sensor for sensing air pressure between the substrate and the cover layer. The assembly also includes a fiber optic communication link, a battery, a data acquisition subsystem, and a flexible printed circuit, all between the substrate and the cover layer. The cover layer is formed of a polymer film.

Air Stable, Amorphous Organic Films and their Applications to Solution Processable Flexible Electronics

Abstract: The rapidly expanding field of organic semiconductors for display and low-cost electronics applications requires materials, which not only have high mobility but also benefit from solution processability and environmental stability. In this paper we present a new class of solution coatable organic materials with excellent stability to air and light. Spin-coated FET devices operate at ambient conditions without encapsulation and show p-type field-effect mobilities of 2 x 10-3 cm2V-1s-1 and on/off ratios greater than 104. Thin films can be deposited from common organic solvents onto a variety of substrates. These films are mechanically robust and can withstand temperatures in excess of 100 °C without significant changes in electrical performance. FET switching and transient characteristics at higher frequencies are also discussed. These types of materials should find applications in many areas of flexible electronics.

Flexible printed circuit board, integrated circuit chip mounting flexible printed circuit board, display apparatus incorporating, integrated circuit chip mounted structure, and bonding method of integrated circuit chip mounting flexible printed circuit board

Abstract: An IC chip mounting FPC board of the present invention is provided with (1) a mounting region in a substantially quadrangular shape for mounting an IC chip, and (2) a plurality of inner-leads provided along each side of the mounting region, for being connected with the bumps of the IC chip so that the IC chip is mounted and bonded in the mounting region, in which the inner-leads is provided so as to have substantial equality between (a) a sum of areas of superimposing regions of the inner-leads provided on one of facing two sides, and (b) a sum of areas of superimposing regions of the inner-leads provided on the other of the facing two sides. Because this substantially equalizes the pressures applied on the respective inner-leads during the mounting of the IC chip, preventing the bonding pressure of the mounting from being unbalance, it is possible to provide an IC chip mounting FPC board having a high bonding reliability.

Flex to flex soldering by diode laser

Abstract: A method to solder flex circuits by diode laser. First and second flex circuits composed of polymer flex substrate are provided. Each flex circuit has a top and a bottom side and at least one contact trace embedded in its surface. An area of solder is provided on the contact trace of at least one of the flex circuits and the flex circuits are positioned so that the contact traces of each flex circuit are substantially aligned. A laser beam is positioned to heat the contact trace to melt the solder and fuse the contacts.

Flexible printed circuit board

Abstract: A flexible printed circuit board (FPC) comprises a base film; a base film side adhesive layer provided on the base film; a metal foil layer on which a pattern circuit is formed, provided on the base film side adhesive layer; and a cover layer side adhesive layer provided on the metal foil layer, wherein at least one of the base film side adhesive and the cover layer side adhesive layer has a higher glass transition temperature than an operating temperature of the flexible printed circuit board, so that the FPC has a stable flexibility at high temperature.

Plasma display device with flexible circuit boards and connectors

Abstract: A plasma display device has a pair of substrates having electrodes and terminals provided at ends of the electrodes. Driving circuits supply a driving voltage to the electrodes via flexible printed circuit boards to emit light. Connectors are detachably attached to the substrate. The connector includes a housing and terminal members disposed in the housing, with the terminal member having a U-shaped cross-sectional shape, so that a first portion as one leg of the “U” contacts the terminal of the electrode and a second portion as another leg of the “U” contacts the conductor of the flexible connecting member. The terminals of the electrodes are arranged in a staggered manner at the end of the substrate.

Flexible printed circuit film

Abstract: A flexible printed circuit film that is capable of preventing a bonded pad from being separated or opened because of a force applied to a bonded part when the flexible printed circuit film is engaged to a printed circuit board. In the film, a first pad is provided at one end of a body to be adhesively connected to a second pad of a first printed circuit board. A third pad is provided at other end of the body to be engaged to a connecter of a second printed circuit board. At least one recess is defined in the body of the flexible printed circuit film. Accordingly, it becomes possible to prevent a contact portion between other pad of the FPC film and the pad of the data circuit board from being separated or opened due to a force applied upon engagement of one pad of the FPC film to the connecter of the timing control board.

Flexible printed circuit magnetic flux probe

Abstract: A flexible probe is provided for detecting time-varying magnetic fields produced in an electric generator. The flexible probe is adapted to be disposed within an air gap formed between an iron stator and a rotatable rotor. An electrostatic shield layer is formed on a front face of the probe and a printed circuit forming at least one coil is printed on the back face. When the flexible probe is used for detecting time-varying magnetic fields, a voltage is induced in the coil when the coil is exposed to a time-varying magnetic field.

Laminate and method for manufacturing the same

Abstract: PROBLEM TO BE SOLVED: To provide a laminate useful for a flexible printed circuit board having a polyimide insulating resin layer, which can be subjected to etching processing by an alkali aqueous solution, and a metal foil. SOLUTION: In the laminate wherein an insulating resin layer comprising more than one polyimide resin layers are provided on the metal foil, the insulating resin layer has at least one low thermal expansion polyimide resin layer (A) with the coefficient of linear thermal expansion of 30×10-6/ deg.C or less and at least one polyimide resin layer (B) with a glass transition temperature of 300 deg.C or lower. The layer coming into contact with the metal foil is a polyimide resin layer (B) with a glass transition temperature of 300 deg.C or lower. The adhesion strength of the polyimide layer (B) coming into contact with the metal foil and the metal foil is 0.5 kN/m or more and the average value of the etching speed by a 50 wt.% potassium hydroxide aqueous solution at 80 deg.C of the insulating resin layer is 0.5 μm/min or less.

Flame retardant adhesive composition for flexible printed wiring board, and flexible printed wiring board using the same

Abstract: PROBLEM TO BE SOLVED: To provide a flame-retardant adhesive composition for flexible printed circuit boards, which is free from halogen, has high flame retardancy, and is excellent in sliding flexibility, adhesiveness and solder heat-resistant characteristic, and to provide a flexible printed circuit board using the same. SOLUTION: The flame-retardant adhesive composition for the flexible printed circuit boards is characterized by containing the following (A) to (E) as essential components: (A) a thermoplastic resin; (B) a phosphorus-containing phenoxy resin; (C) a halogen-free epoxy resin; (D) a novolak resin having a structure represented by general formula (1) (wherein X is a melamine structure or a guanamine structure; Y is H or methyl; and (n) is an integer of 1 to 10); and (E) a flame retardant. COPYRIGHT: (C)2010,JPO&INPIT

Mounting structure for imaging device module

Abstract: PROBLEM TO BE SOLVED: To provide a mounting structure for an imaging device module the thickness and the component mounting area of which are reduced in order to realize a low profile and miniaturizing more than those of a conventional imaging device module. SOLUTION: The mounting structure is configured such that the imaging device module 2 is mounted on an uppermost end of a main board 10 in one case of a mobile telephone 1. A lens 5 of the imaging device module 2 is fitted to a lens attachment section 7a of a holder 7, an imaging device 6 and an IC 3 are mounted on a flexible printed circuit board 3, which is folded in three and fitted to a flexible printed circuit board container section 7b of a holder 7b. The tip of the flexible printed circuit board 3 is inserted to an FPC(Flexible Printed Circuit) connector mounted on the main board 10 to make electric connection between the main board and the flexible printed circuit board 3. Thus, the thickness of the mobile unit such as a mobile telephone can be made thin.

Laser-assisted via hole metallization in PCB materials

Abstract: A novel via hole metallization method is presented, where the vias are drilled in polyimide/copper (PI/Cu) flexible printed circuit boards (PCBs) using KrF excimer pulses, and then pre-metallized using a scanned Ar+ laser. In the premetallization step, a thin (20–50 nm) and narrow (2–10 μm) palladium layer is deposited on the polyimide-covered side of the PCB and on the wall of the vias using the laser-induced chemical liquid-phase deposition method. After the pretreatment, the Pd covered holes are immersed into a Cu electroless plating bath. Plated copper vertical and horizontal interconnects are analyzed by optical microscopy, focused ion beam, profilometry and resistivity measurements. The results show that the copper deposits formed on the pre-metallized surface of PCBs have high chemical purity, excellent adhesion and almost bulk conductivity, but, so far, due to unclear reasons, high through hole resistance.

Sealed chamber for electronic control unit integrated into vehicle engine or gearbox, is based on dished panel with sealed, flexible printed circuit lead-in and adhered covering

Abstract: The support panel includes a depression for control electronics. A flexible printed circuit panel is adhered and sealed to the support panel. It surrounds the depression, and is led over its edge into it, to make electrical contact with the control electronics arranged inside it. A covering is adhered to the flexible circuit panel on the support panel. This tightly seals off the depression. The support panel (1) includes a dished depression (2). This is an accommodation space for control electronics. A flexible printed circuit panel (4) is adhered and sealed to the support panel. It surrounds the depression, and is led over its edge into it, to make electrical contact with the control electronics (7) arranged inside it. A covering (11) is adhered to the flexible circuit panel (4) on the support panel. This tightly seals off the depression.

Flexible printed board provided with cable

Abstract: (57) [Problem] To provide a flexible printed circuit board having a cable portion that is unlikely to cause a problem even when used for a hinge portion of a device. SOLUTION: In a flexible printed circuit board having a cable section 20 connected to a component mounting section 10, the component mounting section has at least two inner layers 13, 1 between outer layers. Wherein the cable portion is composed of at least two single-sided copper-clad laminates each connected to the inner layer and having a gap formed therebetween, and one of the single-sided copper-clad laminates A flexible printed circuit board having a cable portion, wherein the plate is longer than the other, and a method for manufacturing the same.

Imaging device moving apparatus and electronic camera

Abstract: PROBLEM TO BE SOLVED: To provide an imaging device moving apparatus that is suitable for making an electronic camera small in size and thin in thickness and can largely shift and imaging device. SOLUTION: The imaging element moving device is provided with the imaging device 11 that images an optical image obtained via a lens system, flexible printed circuit boards 12a, 12b that energize the image pickup device 11 to a fixed position, and piezoelectric actuators 13a, 13b that deliver a generated displacement to the imaging device 11 via the flexible printed circuit boards 12a, 12b to shift the imaging device 11 in an optical axis direction.

Combination instrument for displaying measured values and/or other information, in particular for use in a motor vehicle

Abstract: A combination instrument (1) for displaying measured values and/or other information, having a flexible printed circuit (2) on which electrical and/or electronic components (9, 10, 13) are arranged, and with parts of the flexible printed circuit (2) being clamped in between a rear face cover (4) and a front face cover (3), with the rear face cover (4) to be made of metallic material.

Led lighting system and its manufacturing method

Abstract: PROBLEM TO BE SOLVED: To provide a small LED lighting system easy to control optical characteristics of illumination and having large design flexibility on a shape of an illumination part. SOLUTION: This LED lighting system is equipped with a flexible printed circuit board 1 held in a predetermined three dimensional shape; many light emitting diodes 2 directly mounted on the flexible printed circuit board according to a prescribed pattern; a housing 4 for holding the flexible printed circuit board in the predetermined three dimensional shape; and a protecting layer 3 for totally protecting the many light emitting diodes. COPYRIGHT: (C)2002,JPO

Solid-state image pickup apparatus

Abstract: The solid-state image pickup apparatus comprises a solid-state image pickup device having a layer of microlenses above a layer of color filter on one portion, and a flexible printed circuit board on one surface of which the solid-state image pickup device is flip-chip bonded by injecting an adhesive in a gap between the solid-state image pickup device and the flexible printed circuit board. A distance between the edge of the microlens layer and the edge of the flexible printed circuit board nearer to the microlens layer is 2.5 to 10 times wider as compared to the gap between the solid-state image pickup device and the flexible printed circuit board.

Flexible printed circuit board and method for sealing the same

Abstract: PROBLEM TO BE SOLVED: To provide a flexible printed circuit board having a thin, light-weight and moreover low-cost ground surface or signal shield. SOLUTION: The flexible printed circuit board (170) comprises a plurality of flexible electrical conductors (178) printed on a flexible insulating board (176). A flexible conductive surface (172) is sputtered on the board (176), to thereby cover the plurality of the conductors (178). The board (172) is electrically connected to at least one of the conductors (178).

Flexible printed circuit connector

Abstract: Flexible printed circuit connector including: an insulating base seat each end of which is formed with an insertion hole; multiple conductive members inlaid in the insulating base seat for electrically contacting with the flexible printed circuit; two metal pivot members respectively inlaid in two ends of the insulating base seat; and a metal press board two ends of which are pivotally connected with the metal pivot members. Two ends of the metal press board are respectively latched with the metal pivot

Adhesive composition for lamination used in flexible printed circuit board and adhesive film

Abstract: PROBLEM TO BE SOLVED: To provide an adhesive composition for lamination used in a flexible printed circuit board that has excellent thermal impact resistance and press workability, and an adhesive film SOLUTION: This adhesive film is composed of an adhesive composition for lamination used in a flexible printed circuit board comprising (a) an acrylic rubber having a carboxylic acid functional group, (b) an epoxy resin, (c) a polyamide amine, (d) a phenol resin, and (e) a curing agent or curing catalyst, wherein the added amount of component (c) is 01-10 ptswt per 100 ptswt of component (b)