Showing papers on "Flexible electronics published in 2002"

Magnetic micro encoder and micro motor

Abstract: A magnetic micro encoder (1), comprising a magnetic disk (4) magnetized in axial direction, a first back yoke (5) installed on the magnetic disk (4), two magnetic sensors (6) installed on the sensor mounting part of a flexible printed circuit board (7) so as to be disposed opposedly to the magnetic disk (4) through a gap in the axial direction of the magnetic disk (4) and so that the longitudinal direction thereof is generally parallel with the band-like wiring part of the flexible printed circuit board (7), a second back yoke (8) installed on the rear surfaces of the magnetic sensors (6) through the flexible printed circuit board (7) and forming a magnetic circuit in combination with the first back yoke (5) and the magnetic disk (4), and a housing (3) for storing the first back yoke (5), the magnetic disk (4), the magnetic sensor (6), and the second back yoke (8).

Printhead assembly having flexible printed circuit board and busbars

Abstract: A printhead assembly (10) for a pagewidth drop on demand ink jet printer includes an array of printhead modules (11) extending across the pagewidth. A flexible printed circuit board (26) carries data and power to the modules (11) and also extends across the pa gewidth. A pair of busbars (19) is electrically connected to the flexible printed circuit board (26) to carry power to it. The busbars also extend across the pagewidth.

IC chip mounting structure and display device

Abstract: IC CHIP MOUNTING STRUCTURE has IC chips having protruding electrodes, a flexible printed circuit board having conductors connected to the protruding electrodes of the IC chips, and a protective plate attached to the flexible printed circuit board. The protective plate has openings to accommodate the driver IC chips. A resin member having a high heat conductivity is arranged in the opening in contact with the surface of the IC chip. The IC chip mounting structure can be attached to a chassis of a plasma display device so that heat generated by the driver IC chip is transferred to the chassis via the heat conductive resin member.

Lattice array-structured piezoelectric actuator and method for producing the same

Abstract: A common electrode and a signal electrode are separately formed on two major faces of each of tabular piezoelectric actuator elements arrayed on a substrate. On a flexible printed circuit board, formed are electric bonding pads, which are to be electrically connected with the substrate of the actuator elements. A semi-spherical bump including a conductive core and a conductive sealant is formed on each of pads. The actuator elements having substrate is made to face the flexible printed circuit board, and heated under pressure to thereby electrically bond the signal electrodes (at their electric bonding area) to the corresponding bumps. Thus bonded, there exists a gap around the core, and it allows the actuator area of the signal electrode to act completely free, not interfered with any other.

Composite flexible array substrate having flexible support

Abstract: Flexible array substrates having a flexible support, a flexible base, a reflective layer, and a transparent layer, in that order, are taught. Methods of forming the flexible array substrates, devices incorporating flexible array substrates, and arrays having probes arranged on a surface of the flexible array substrate are also taught.

Glucose extraction patch and its manufacturing process

Abstract: Glucose extraction patch and its manufacturing process are provided. The patch comprises two gel discs containing enzymes that react with glucose to produce hydrogen peroxide, a frame for having two holes for accommodating the discs, a supporter for holding the discs, and a flexible printed circuit. The printed circuit includes electrodes for contacts with the gel discs, terminals for electrical connection with a measuring device, and circuits for electrical connection between the electrodes and the terminals. The electrodes are formed on the printed circuit by silk screening. Preprocessing may be applied to the electrodes after they are formed on the printed circuit.

Flexible printed circuit board

Abstract: A flexible printed circuit board of the present invention directly relays connecting portions of a magnetic head placed on a suspension to connecting portions of a base end of a carriage arm in a head suspension assembly of a magnetic disk apparatus. The flexible printed circuit board includes a laminate composed of at least a base layer, a plurality of conductive circuits formed on the base layer, a cover layer covering the conductive circuits, and a conductive polymer layer formed in the insulating material portion in the surface of the laminate. The flexible printed circuit board includes a stainless layer below the base layer or on a lower side of the conductive polymer layer on the base layer side. More preferably, in the magnetic head connecting portion, the cover layer is not formed, and on the base layer in the magnetic head connecting portion, a conductive polymer layer is formed, whereas on the plurality of conductive circuits in the magnetic head connecting portion, the conductive polymer layer is not present or is substantially absent, if any, to such a degree as to allow the magnetic head to be electrically connected to the conductive circuits.

Flexible printed antenna and apparatus utilizing the same

Abstract: An antenna unit and a computing system utilizing the antenna unit are disclosed. The antenna is compact and can be fabricated at low cost and with high accuracy. The antenna unit comprises an antenna and a connection cable. The antenna unit is constructed by forming the antenna and the connection cable integrally on a preferably flexible insulating film using preferably the FPC (Flexible Printed Circuit) technique. The computing system comprises a body having its main operational circuits and a hinged cover having a display. The flexible printed antenna is formed integrally with its module of electric components using the FPC technique and is made to span the body and the cover. The antenna itself and the connection cable can be freely bent or folded, resulting in higher freedom in their positioning within the computer system body and cover.

Electronic pressure sensitive transducer apparatus and method for manufacturing same

Abstract: The cost and complexity of an electronic pressure sensitive transducer (20) are decreased by constructing such a transducer directly on a printed circuit board (22) containing support electronics. Conductive traces (24) are formed on the printed circuit board (22) to define a contact area (26). A flexible substrate (28) having an inner surface is positioned over the contact area (26). An adhesive spacer (34), substantially surrounding the contact area (26), attaches the flexible substrate to the printed circuit board (22). At least one resistive layer (32) is deposited on the flexible substrate (28) inner surface. In use, the resistive layer (32) contacts at least two conductive traces (24) in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure.

Flexible hybrid memory element

Abstract: The invention includes a memory cell apparatus, and a method of forming the memory cell. The memory cell apparatus includes a flexible hybrid memory element. The flexible hybrid memory element includes a flexible first conductive layer formed adjacent to a flexible substrate. A flexible diode structure is formed adjacent to the flexible first conductor. A flexible switch is formed adjacent to the flexible diode structure. A flexible second conductive layer is formed adjacent to the flexible switch. The flexible switch is generally formed from an organic material. The flexible diode structure is generally formed from a disordered, inorganic material. The flexible switch can be formed to create a high resistance path when a threshold amount of current is passed through the flexible switch, or the flexible switch can be formed to create a low resistance path when a threshold amount of current is passed through the flexible switch. The method includes depositing a flexible first conductive layer on a flexible substrate. A flexible disordered inorganic material is deposited on the flexible first conductor forming a plurality of flexible diode structures. A flexible organic material is deposited on the flexible disordered inorganic material, forming a plurality of flexible switches adjacent to the plurality of flexible diode structures. A flexible second conductor is deposited on the flexible organic material.

Improvements in sensor assemblies for automotive collision warning systems

Abstract: A sensor assembly for a collision warning system 3 for a motor vehicle 5 comprising four sensor assemblies 13,15,17,19, each consisting of a flexible printed circuit board 7 (Fig.2, not shown) having printed upon it sensor electronics, the arrangement whereby the flexible printed circuit board 7 may be mounted on the inside of the vehicle bumper 11.

Optical sub-assembly for optoelectronic modules

Abstract: Concepts for conveniently arranging devices for the transduction of signals to and from voltage and current domains to infrared radiation domains is described. Specifically, optoelectronic components and methods of making the same are described. In one aspect, the optoelectronic component includes a base substrate having a pair of angled (or substantially perpendicular) faces with electrical traces extending therebetween. A semiconductor chip assembly is mounted on the first face of the base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. In some embodiments the base substrate is formed from a ceramic material having the electrical traces formed thereon. In other implementations the substrate includes a backing block having a flexible printed circuit substrate adhered thereto.

System and method for flexible circuits

Abstract: A flexible printed circuit improves data transfer rates by disposing ground wires in a ground plane proximate to signal wires disposed in a signal channel plane. One or more ground wires is associated with each signal wire pair or each signal wire for imaging of the return currents of the signal pairs. An overlapping alignment minimizes loop area between a ground wire and its associated signal wire. An offset alignment provides a reduced loop area and reduced breakage risk since movement of the flexible circuit does result in compression of the signal wire and its associated ground wire. A combination of overlapping and offset alignment balances signal transfer effectiveness with breakage risk by offsetting ground and signal wires is stress sensitive regions and overlapping ground and signal wires in stress tolerant regions. In one embodiment, the flexible circuit interfaces a portable computer with a display lid to support high-speed display signals with reduced breakage risk from cycling the display lid between an open and closed position.

Hard disk drive comprising flexible printed circuit with damping material

Abstract: Provided is a hard disk drive The provided hard disk drive includes a flexible printed circuit (FPC) in which a base layer and a cover layer are arranged with a circuit layer therebetween In addition, a damping material is coupled at a predetermined portion of the signal patterns in the circuit layer so as to cross the signal patterns The provided hard disk drive reduces vibration energy over an entire frequency band for minimizing the effect of vibration on servo control As a result, the performance of the hard disk drive is improved

Ultrasound probe wiring method and apparatus

Abstract: Wiring an 1C, using flexible circuits, by relating a circuit board to an 1C and using traces on the circuit board as a second set of input to the 1C. More specifically, a set of first lands on the circuit board are connected to a first set of lands on the 1C. The circuit board and 1C are positioned so as to present a second set of lands on the circuit board in close proximity to a second set of lands on the 1C. A first flex circuit is connected to the second lands on the circuit board while a second flex circuit is connected to the second lands on the 1C. The flex circuits may be connected to signal wires or may serve themselves as the main signal wires.

Process for embedding at least one conductive flexible printed circuit in plastic, conductive printed circuit device and embedding device

Abstract: Process for embedding flexible wiring foil(s) (4) in plastics comprises placing the foil(s) on or in a ready-made stiffening element (6, 7) to prevent bending and encapsulation in plastics. Independent claims are also included for the following: (1) wiring trace units with the wiring trace foil on or in a stiffening element embedded in plastics; and (2) an embedding unit for use in the process which has a ready made housing (8) with a space (14) taking the wiring trace foil (4) between 2 parts (6, 7) that fit together.

Electronic equipment provided with flexible printed circuit board and the substrate

Abstract: PROBLEM TO BE SOLVED: To provide a flexible printed circuit board superior in flexibility and durability, as well as capable of reducing the radiation of EMI waves from each signal line. SOLUTION: The flexible printed circuit board comprises a plurality of signal lines 11 and a ground line 12, arranged at the predetermined interval on the surface layer of the flexible printed circuit board; solid ground faces 20 and 21, arranged on flat face parts 18 and 19 on the rear layer; and at the bending part 17, a plurality of ground lines 22 and a plurality of signal lines 11 are arranged, sandwiching the base of the substrate at a position, without confronting each other to electrically connect both the ground faces. COPYRIGHT: (C)2004,JPO

Semiconductor device, electrooptical device, and method for fabricating semiconductor device

Abstract: PROBLEM TO BE SOLVED: To obtain a semiconductor device comprising a functional element, e.g. a thin film transistor or an organic electroluminescence element, in which voltage drop of wiring is controlled and the time constant is decreased while reducing the fabrication cost. SOLUTION: The semiconductor device comprises an element chip stripped from a first substrate and transferred to a second substrate, and a circuit on the second substrate being connected with a circuit on the element chip wherein the element chip comprises one or more functional elements fabricated on the first substrate. A printed board or a flexible printed circuit board is employed as the second substrate. COPYRIGHT: (C)2004,JPO

Flexible printed circuit board with reinforcing plate

Abstract: A flexible printed circuit board with a reinforcing plate, which comprises: a flexible printed circuit board including i) a conductive circuit pattern layer, and ii) an insulating layer made of a plastic film; a reinforcing plate; and an adhesive layer so that the reinforcing plate is attached to the flexible printed circuit board via the adhesive layer, wherein the adhesive layer is formed from an adhesive composition containing a composite metal hydroxide represented by formula (1): M1-xQx(OH)2 (1) wherein M is at least one metal atom selected from the group consisting of Mg, Ca, Sn and Ti; Q is at least one metal atom selected from the group consisting of Mn, Fe, Co, Ni, Cu and Zn; and x is a positive number from 0.01 to 0.5.

System and method for repairing flex circuits

Abstract: A new system and method for repairing flexible circuits is disclosed The flexible circuits conduct electrical signals to and from electronic devices The system generally includes a flexible circuit substrate, at least one electrical conductor, and a repair patch The flexible circuit substrate has a cut zone and a repair zone The at least one electrical conductor is supported by the flexible circuit substrate The electrical conductors are configured to carry electrical signals The repair patch is used to electrically interconnect at least two repair zones

Mechanical assembly of a microelectrode array for use in a wireless intracortical recording device

Abstract: Fabrication of a microelectrode array assembly for neural activity recording is described. The assembly forms the mechanical front-end of the telemetric electrode array system, a wireless intracortical recording device designed for motor cortex studies in nonhuman primates. The electrodes are manufactured by wire electrical discharge machining solid titanium. They are then secured in a polyimide substrate. A flexible printed circuit board connector cable connects the array structure to the electrical frontend. Parylene and platinum are used as the encapsulation materials. Results from the implantation of a prototype microelectrode array assembly are discussed.

Flexible printed circuit board antenna

Abstract: An electromagnetic antenna for a non-planar surface includes a flexible printed circuit board having three or four conductive levels. The flexible printed circuit board is adapted to conform to the non-planar surface and includes a plurality of electrical connections between the conductive levels and a plurality of electrical traces on the conductive levels. The electrical connections and the electrical traces form a first helix having a first helical pitch sense from a first node to a second node, and also form a second helix having a second helical pitch sense, which is opposite from the first helical pitch sense, from a third node to a fourth node. The first and second helices are contrawound relative to each other. First and second signal terminals are provided and are electrically connected with at least one of the nodes.

Flexible printed circuit board and connecting method thereof

Abstract: A flexible printed circuit board (“FPCB”) that has a through hole in the pattern layer between the cover layer and base layer, the diameter of the through hole in the pattern layer of FPCB is smaller than that of the holes in the cover layer and the base layer of another printed circuit board (“PCB”). The holes in the cover layer and base layer are oriented toward the solder land part of the FPCB. The difference in diameter increases the connecting area for soldering a FPCB to another PCB leading to an accurate and strong solder.

Process for massively producing tape type flexible printed circuits

Abstract: A process for massively producing tape type flexible printed circuits is provided. The steps of pressing, etching and insulating are executed on a flexible insulation tape in reel-to-reel fashion. Thereafter, the flexible insulation tape is punched to form sprocket holes and cut along the parallel lines where the sprocket holes arrange on to become several winds of narrower flexible circuit tapes. Each flexible circuit tape has tape type flexible printed circuits and sprocket holes at two sides.

Surface light source equipment and method of manufacturing it

Abstract: PROBLEM TO BE SOLVED: To provide a surface light source equipment whereof the luminous light source can be mounted to a light guide plate with high positioning accuracy and the thickness can be thinned in comparison with the case of thermally caulking a wiring board, and to provide a method of manufacturing it. SOLUTION: An adhesive sheet piece 19 comprising a hot melt type adhesive taking the shape of a sheet is kept crimped on the upper surface of a flexible printed circuit board 12 on which the luminous light source 13 is mounted. A light source engagement hole 15 passes through the end of a light guide plate 14. The luminous light source 13 is inserted in the light source engagement hole 15, and the adhesive sheet piece 19 is held between the light guide plate 14 and the flexible printed circuit board 12. The flexible printed circuit board 12 is made to adhere to the light guide plate 14 by heating the adhesive sheet piece 19 by heat-pressing. COPYRIGHT: (C)2004,JPO

Polyimide film, method for producing the same and metallic wiring board using the same as base

Abstract: PROBLEM TO BE SOLVED: To provide a polyimide film having high elastic modulus, excellent in alkali-etching property, flexibility, low moisture expansion coefficient, thermal dimensional stability and film forming property when the polyimide film is applied to a base for a flexible printed circuit for high precision comprising a metallic wiring on the surface, a CSP, a COF, a BGA or a TAB tape (Tape automated bonding), and to provide a method for producing the same and to provide a metallic wiring board using the same as a base. SOLUTION: The polyimide is produced from a random, block or mixed polyamic acid which comprises at least a pyromellitic acid anhydride, 3,4'- oxydianiline and 4,4'-oxydianiline and contains 5-50 mol.% of 3,4'-oxydianiline based on diamine, and the polyimide film manifests 4.0-6.5 [GPa] of Young's modulus. COPYRIGHT: (C)2003,JPO

Carrier for transfer of flexible printed circuit board, and electronic component mounting method to flexible printed circuit board

Abstract: PROBLEM TO BE SOLVED: To provide a carrier for transfer of a flexible printed circuit board which can correspond to different mounting methods by the same carrier for transfer, and an electronic component mounting method to the flexible printed circuit board. SOLUTION: A carrier 10 is constituted by providing a base board 11, wherein a resin layer 12 having a surface in close contact with a substrate 1 is formed, with an opening part 10e for back-up allowing a back-up part for bonding a semiconductor device to pass through, and an opening part 10c for a reference pin which allows a reference pin 15 for positioning the substrate 1 to pass through. The reference pin 15 is positioned at the opening part 10c for a reference pin by positioning the carrier 10 to a packaging jig 13 by means of a positioning pin 14, and the substrate 1 is brought into close contact with a resin layer 12 aligning a reference hole 1a with the reference pin 15. Thereby, it is possible to tightly hold the substrate 1 in its positioned state and to correspond to different packaging methods by the same carrier. COPYRIGHT: (C)2004,JPO

Flexible printed circuit board and its manufacturing method

Abstract: PROBLEM TO BE SOLVED: To provide a flexible printed circuit board on which a high-definition pattern having considerably strong adhesiveness can be formed by etching, and to provide its manufacturing method. SOLUTION: This flexible printed circuit board comprises a copper thin film 3 which is made of copper or an alloy mainly composed of copper and directly formed on one or both sides of a plastic film substrate 1, and a copper layer 4 formed on the copper thin film by electrolytic plating. The copper thin film 3 is constituted of a two-layer structure having a layer including at least a crystal structure formed at the surface side, and the crystal structure has the ratio of relative intensity to X ray of 0.1 or less at crystal lattice plane index (200)/(111). COPYRIGHT: (C)2004,JPO

Polyimide film for flexible printed board and flexible printed board using the same

Abstract: The present invention provides a flexible printed circuit which is free from curl, torsion and warpage due to temperature change and excellent flexural endurance. By using polyimide film having an average coefficient of thermal expansion of 1.0×10 −5 to 2.5×10 −5 cm/cm/° C. in a temperature range of 100° C. to 200° C. and a stiffness value of 0.4 to 1.2 g/cm as the base film for the flexible printed circuit, a flexible printed circuit having excellent thermal dimensional stability and flexural endurance can be prepared.