Showing papers on "Flexible electronics published in 2010"

Roll-to-roll production of 30-inch graphene films for transparent electrodes

Abstract: The outstanding electrical, mechanical and chemical properties of graphene make it attractive for applications in flexible electronics. However, efforts to make transparent conducting films from graphene have been hampered by the lack of efficient methods for the synthesis, transfer and doping of graphene at the scale and quality required for applications. Here, we report the roll-to-roll production and wet-chemical doping of predominantly monolayer 30-inch graphene films grown by chemical vapour deposition onto flexible copper substrates. The films have sheet resistances as low as approximately 125 ohms square(-1) with 97.4% optical transmittance, and exhibit the half-integer quantum Hall effect, indicating their high quality. We further use layer-by-layer stacking to fabricate a doped four-layer film and measure its sheet resistance at values as low as approximately 30 ohms square(-1) at approximately 90% transparency, which is superior to commercial transparent electrodes such as indium tin oxides. Graphene electrodes were incorporated into a fully functional touch-screen panel device capable of withstanding high strain.

Soft lithography for micro- and nanoscale patterning

Abstract: This protocol provides an introduction to soft lithography--a collection of techniques based on printing, molding and embossing with an elastomeric stamp. Soft lithography provides access to three-dimensional and curved structures, tolerates a wide variety of materials, generates well-defined and controllable surface chemistries, and is generally compatible with biological applications. It is also low in cost, experimentally convenient and has emerged as a technology useful for a number of applications that include cell biology, microfluidics, lab-on-a-chip, microelectromechanical systems and flexible electronics/photonics. As examples, here we focus on three of the commonly used soft lithographic techniques: (i) microcontact printing of alkanethiols and proteins on gold-coated and glass substrates; (ii) replica molding for fabrication of microfluidic devices in poly(dimethyl siloxane), and of nanostructures in polyurethane or epoxy; and (iii) solvent-assisted micromolding of nanostructures in poly(methyl methacrylate).

Scalable Coating and Properties of Transparent, Flexible, Silver Nanowire Electrodes

Abstract: We report a comprehensive study of transparent and conductive silver nanowire (Ag NW) electrodes, including a scalable fabrication process, morphologies, and optical, mechanical adhesion, and flexibility properties, and various routes to improve the performance. We utilized a synthesis specifically designed for long and thin wires for improved performance in terms of sheet resistance and optical transmittance. Twenty Ω/sq and ∼80% specular transmittance, and 8 ohms/sq and 80% diffusive transmittance in the visible range are achieved, which fall in the same range as the best indium tin oxide (ITO) samples on plastic substrates for flexible electronics and solar cells. The Ag NW electrodes show optical transparencies superior to ITO for near-infrared wavelengths (2-fold higher transmission). Owing to light scattering effects, the Ag NW network has the largest difference between diffusive transmittance and specular transmittance when compared with ITO and carbon nanotube electrodes, a property which could gr...

Foldable Printed Circuit Boards on Paper Substrates

Abstract: This paper describes several low-cost methods for fabricating flexible electronic circuits on paper. The circuits comprise i) metallic wires (e.g., tin or zinc) that are deposited on the substrate by evaporation, sputtering, or airbrushing, and ii) discrete surface-mountable electronic components that are fastened with conductive adhesive directly to the wires. These electronic circuits—like conventional printed circuit boards—can be produced with electronic components that connect on both sides of the substrate. Unlike printed circuit boards made from fiberglass, ceramics, or polyimides, however, paper can be folded and creased (repeatedly), shaped to form three-dimensional structures, trimmed using scissors, used to wick fluids (e.g., for microfluidic applications) and disposed of by incineration. Paper-based electronic circuits are thin and lightweight; they should be useful for applications in consumer electronics and packaging, for disposable systems for uses in the military and homeland security, for applications in medical sensing or low-cost portable diagnostics, for paper-based microelectromechanical systems, and for applications involving textiles.

Piezoelectric BaTiO₃ thin film nanogenerator on plastic substrates.

Abstract: The piezoelectric generation of perovskite BaTiO3 thin films on a flexible substrate has been applied to convert mechanical energy to electrical energy for the first time. Ferroelectric BaTiO3 thin films were deposited by radio frequency magnetron sputtering on a Pt/Ti/SiO2/(100) Si substrate and poled under an electric field of 100 kV/cm. The metal-insulator (BaTiO3)-metal-structured ribbons were successfully transferred onto a flexible substrate and connected by interdigitated electrodes. When periodically deformed by a bending stage, a flexible BaTiO3 nanogenerator can generate an output voltage of up to 1.0 V. The fabricated nanogenerator produced an output current density of 0.19 μA/cm(2) and a power density of ∼7 mW/cm(3). The results show that a nanogenerator can be used to power flexible displays by means of mechanical agitations for future touchable display technologies.

Stretchable, large-area organic electronics.

Abstract: Stretchability will significantly expand the application scope of electronics, particularly large-area electronics-displays, sensors, and actuators If arbitrary surfaces and movable parts could be covered with stretchable electronics, which is impossible with conventional electronics, new classes of applications are expected to emerge A large hurdle is manufacturing electrical wiring with high conductivity, high stretchability, and large-area compatibility This Review describes stretchable, large-area electronics based on organic field-effect transistors for applications to sensors and displays First, novel net-shaped organic transistors are employed to realize stretchable, large-area sensor networks that detect distributions of pressure and temperature simultaneously The whole system is functional even when it is stretched by 25% In order to further improve stretchability, printable elastic conductors are developed by dispersing single-walled carbon nanotubes (SWNTs) as dopants uniformly in rubbers Further, we describe integration of printable elastic conductors with organic transistors to construct a rubber-like stretchable active matrix for large-area sensor and display applications Finally, we will discuss the future prospects of stretchable, large-area electronics with delineating a picture of the next-generation human/machine interfaces from the aspect of materials science and electronic engineering

Product integration of compact roll-to-roll processed polymer solar cell modules: methods and manufacture using flexographic printing, slot-die coating and rotary screen printing

Abstract: The improvement of the performance of roll-to-roll processed polymer solar cell modules through miniaturization of the device outline is described. The devices were prepared using full roll-to-roll processing comprising flexographic printing, slot-die coating and rotary screen printing to create 5 mm wide lines of ZnO, P3HT:[60/70]PCBM, PEDOT:PSS and silver on an ITO-PET substrate. The lines were spaced by 1 mm and the devices were completed by encapsulation using roll-to-roll lamination on both sides using a pressure sensitive adhesive and a multilayered barrier material having a UV-filter with a cut-off at 390 nm, oxygen and water vapor transmission rates of respectively 0.01 cm3 m−2 bar−1 day−1 and 0.04 g m−2 day−1. The final modules comprised 16 serially connected cells. The technical yield was 89% based on the criterion that the Voc had to be larger than 7.2 V. This set of modules gave respectively a voltage, current, fill factor and power conversion efficiency of 8.47 ± 0.41 V, −23.20 ± 4.10 mA, 35.4 ± 2.8% and 1.96 ± 0.34% in the case of modules based on P3HT:[60]PCBM. A total of 1960 modules were prepared for each run and the best power conversion reached was 2.75% for devices based on P3HT:[70]PCBM. The solar cell modules were used to demonstrate the complete manufacture of a small lamp entirely using techniques of flexible electronics. The solar cell module was used to charge a polymer lithium ion battery through a blocking diode. The entire process was fully automated and demonstrates the capacity of polymer solar cells in the context of flexible and printed electronics. Finally a comparison was made between the learning curve for OPV and crystalline silicon solar cells in terms of the cost per watt peak and the cumulative watt peak. OPV as a technology was found to have a significantly steeper learning curve.

Graphene oxide thin films for flexible nonvolatile memory applications.

Abstract: There has been strong demand for novel nonvolatile memory technology for low-cost, large-area, and low-power flexible electronics applications. Resistive memories based on metal oxide thin films have been extensively studied for application as next-generation nonvolatile memory devices. However, although the metal oxide based resistive memories have several advantages, such as good scalability, low-power consumption, and fast switching speed, their application to large-area flexible substrates has been limited due to their material characteristics and necessity of a high-temperature fabrication process. As a promising nonvolatile memory technology for large-area flexible applications, we present a graphene oxide based memory that can be easily fabricated using a room temperature spin-casting method on flexible substrates and has reliable memory performance in terms of retention and endurance. The microscopic origin of the bipolar resistive switching behavior was elucidated and is attributed to rupture and...

Uniform, highly conductive, and patterned transparent films of a percolating silver nanowire network on rigid and flexible substrates using a dry transfer technique

Abstract: Silver nanowire films are promising alternatives to tin-doped indium oxide (ITO) films as transparent conductive electrodes. In this paper, we report the use of vacuum filtration and a polydimethylsiloxane (PDMS)-assisted transfer printing technique to fabricate silver nanowire films on both rigid and flexible substrates, bringing advantages such as the capability of patterned transfer, the best performance among various ITO alternatives (10 Ω/sq at 85% transparency), and good adhesion to the underlying substrate, thus eliminating the previously reported adhesion problem. In addition, our method also allows the preparation of high quality patterned films of silver nanowires with different line widths and shapes in a matter of few minutes, making it a scalable process. Furthermore, use of an anodized aluminum oxide (AAO) membrane in the transfer process allows annealing of nanowire films at moderately high temperature to obtain films with extremely high conductivity and good transparency. Using this transfer technique, we obtained silver nanowire films on a flexible polyethylene terephthalate (PET) substrate with a transparency of 85%, a sheet resistance of 10 Ω/sq, with good mechanical flexibility. Detailed analysis revealed that the Ag nanowire network exhibits two-dimensional percolation behavior with good agreement between experimentally observed and theoretically predicted values of critical volume. Open image in new window

Piezoelectric Ribbons Printed onto Rubber for Flexible Energy Conversion

Abstract: The development of a method for integrating highly efficient energy conversion materials onto stretchable, biocompatible rubbers could yield breakthroughs in implantable or wearable energy harvesting systems. Being electromechanically coupled, piezoelectric crystals represent a particularly interesting subset of smart materials that function as sensors/actuators, bioMEMS devices, and energy converters. Yet, the crystallization of these materials generally requires high temperatures for maximally efficient performance, rendering them incompatible with temperature-sensitive plastics and rubbers. Here, we overcome these limitations by presenting a scalable and parallel process for transferring crystalline piezoelectric nanothick ribbons of lead zirconate titanate from host substrates onto flexible rubbers over macroscopic areas. Fundamental characterization of the ribbons by piezo-force microscopy indicates that their electromechanical energy conversion metrics are among the highest reported on a flexible medium. The excellent performance of the piezo-ribbon assemblies coupled with stretchable, biocompatible rubber may enable a host of exciting avenues in fundamental research and novel applications.

Microstructured elastomeric surfaces with reversible adhesion and examples of their use in deterministic assembly by transfer printing

Abstract: Reversible control of adhesion is an important feature of many desired, existing, and potential systems, including climbing robots, medical tapes, and stamps for transfer printing. We present experimental and theoretical studies of pressure modulated adhesion between flat, stiff objects and elastomeric surfaces with sharp features of surface relief in optimized geometries. Here, the strength of nonspecific adhesion can be switched by more than three orders of magnitude, from strong to weak, in a reversible fashion. Implementing these concepts in advanced stamps for transfer printing enables versatile modes for deterministic assembly of solid materials in micro/nanostructured forms. Demonstrations in printed two- and three-dimensional collections of silicon platelets and membranes illustrate some capabilities. An unusual type of transistor that incorporates a printed gate electrode, an air gap dielectric, and an aligned array of single walled carbon nanotubes provides a device example.

Organic Thin‐Film Transistors Fabricated on Resorbable Biomaterial Substrates

Abstract: Microelectronic systems utilizing organic materials afford many advantages over traditional silicon-based systems. Organic electronic devices have potential manufacturing advantages including solution processing and large scale fabrication with reduced cost. Organic devices can also be easily fabricated on polymeric substrates, which are suitable for a broad range of flexible electronics applications including conformal devices and displays, and would also be potentially suitable for roll-to-roll fabrication strategies. For example, many types of organic devices including transistors, sensors, and photovoltaic cells have been fabricated on both natural and synthetic flexible polymers including poly(ethylene terepthalate),[1-3] poly(imide),[4] poly(ether sulfone),[5] cellulose,[6, 7] and silk fibroin.[8] Various organic polymeric systems composed of biodegradable polymers[9] have demonstrated utility in many applications including temporary medical implants[10, 11] and compostable products.[12] For example, thermoplastic polyesters such as poly(L-lactide-co-glycolide) (PLGA) are commonly used biodegradable polymer for drug delivery systems and medical implants while poly(4-hydroxybutyrate) (P4HB) is commonly used as a biodegradable plastic for disposable products.[13] Water soluble polymers such as dextran and poly(vinyl alcohol) have been used for a variety of biomedical applications including tissue engineering scaffolds[14] and environmental applications.[15] Recent progress in the design and synthesis of organic semiconductors have led to the realization of molecules that can operate stably in hydrated or oxidative environments[16] including p-channel materials based on thiophenes[17] or fluorenes,[18] and n-channel materials based on perylene diimides.[19] These concomitant advancements in organic electronics and biodegradable polymers processing suggest that there is the potential for the use of biodegradable polymeric systems for the development of biodegradable electronic devices for potential use in biomedical or environmental applications. Toward this end, we investigated materials and fabrication strategies for the realization of organic thin film transistor using a small molecule semiconductor in combination with a biodegradable polymeric substrate and dielectric. We demonstrate that these devices perform stably after exposure to water and since they consist of nearly entirely biodegradable materials, these devices are resorbable in an in vitro degradation environment.

Flexible, Stretchable, Transparent Conducting Films Made from Superaligned Carbon Nanotubes

Abstract: A straightforward roll-to-roll process for fabricating flexible and stretchable superaligned carbon nanotube films as transparent conducting films is demonstrated. Practical touch panels assembled by using these carbon nanotube conducting films are superior in flexibility and wearability—and comparable in linearity—to touch panels based on indium tin oxide (ITO) films. After suitable laser trimming and deposition of Ni and Au metal, the carbon nanotube film possesses excellent performance with two typical values of sheet resistances and transmittances (208 Ω □ ―1 , 90% and 24 Ω □ ―1 , 83.4%), which are comparable to ITO films and better than the present carbon nanotube conducting films in literature. The results provide a route to produce transparent conducting films more easily, effectively, and cheaply, an important step for realizing industrial-scale applications of carbon nanotubes for transparent conducting films.

Printed, sub-3V digital circuits on plastic from aqueous carbon nanotube inks.

Abstract: Printing electronic components on plastic foils with functional liquid inks is an attractive approach for achieving flexible and low-cost circuitry for applications such as bendable displays and large-area sensors. The challenges for printed electronics, however, include characteristically slow switching frequencies and associated high supply voltages, which together impede widespread application. Combining printable high-capacitance dielectrics with printable high-mobility semiconductors could potentially solve these problems. Here we demonstrate fast, flexible digital circuits based on semiconducting carbon nanotube (CNT) networks and high-capacitance ion gel gate dielectrics, which were patterned by jet printing of liquid inks. Ion gel-gated CNT thin-film transistors (TFTs) with 50 μm channel lengths display ambipolar transport with electron and hole mobilities >20 cm2/V·s; these devices form the basis of printed inverters, NAND gates, and ring oscillators on both polyimide and SiO2 substrates. Five-st...

Direct Growth of Aligned Zinc Oxide Nanorods on Paper Substrates for Low‐Cost Flexible Electronics

Abstract: www.MaterialsViews.com C O M M U Direct Growth of Aligned Zinc Oxide Nanorods on Paper Substrates for Low-Cost Flexible Electronics N IC A By Afsal Manekkathodi , Ming-Yen Lu , Chun Wen Wang , and Lih-Juann Chen * IO N Contemporary science and technology are hoping to revolutionize modern society with soft portable electronic devices, such as rollup displays, wearable devices, electronic paper, chip smart cards, and basic components in various devices. Research is actively focused on using paper or paper-like substrates for basic electronics components, which make excellent alternative substrates with exceptional technological attributes and commercial perspectives for the many substrates available. [ 1–10 ] The innovative techniques and strategies that are required for these fl exible paper-like platforms are just beginning to emerge from research laboratories in the form of realistic prototypes and have yet to be commercialized. Various electronic devices have already been realized, such as electronic paper displays (EPDs), [ 2 ] printed circuit boards, [ 3 ] thin fi lm transistors (TFTs), [ 4 – 6 ] active-matrix organic light-emitting diodes (AMOLEDs), [ 7 ] paper batteries, [ 8 ]

Micro- and nanocrystals of organic semiconductors.

Abstract: Organic semiconductors have attracted wide attention in recent decades, resulting in the rapid development of organic electronics. For example, the solution processibility of organic semiconductors allows researchers to use unconventional deposition methods (such as inkjet printing and stamping) to fabricate large area devices at low cost. The mechanical properties of organic semiconductors also allow for flexible electronics. However, the most distinguishing feature of organic semiconductors is their chemical versatility, which permits the incorporation of functionalities through molecular design. However, key scientific challenges remain before organic electronics technology can advance further, including both the materials’ low charge carrier mobility and researchers’ limited knowledge of structure−property relationships in organic semiconductors. We expect that high-quality organic single crystals could overcome these challenges: their purity and long-range ordered molecular packing ensure high device...

Direct Low-Temperature Nanographene CVD Synthesis over a Dielectric Insulator

Abstract: Graphene ranks highly as a possible material for future high-speed and flexible electronics. Current fabrication routes, which rely on metal substrates, require post-synthesis transfer of the graphene onto a Si wafer, or in the case of epitaxial growth on SiC, temperatures above 1000 °C are required. Both the handling difficulty and high temperatures are not best suited to present day silicon technology. We report a facile chemical vapor deposition approach in which nanographene and few-layer nanographene are directly formed over magnesium oxide and can be achieved at temperatures as low as 325 °C.

Inkjet printing for flexible electronics: Materials, processes and equipments

Abstract: Inkjet printing, known as digital writing technique, can directly deposit functional materials to form pattern onto substrate. This paper provides an overview of inkjet printing technologies for flexible electronics. Firstly, we highlight materials challenges in implementing flexible devices into practical application, especially for inkjet printing process. Then the micro/nano-patterning technologies of inkjet printing are discussed, including conventional inkjet printing techniques and electrohydrodynamic printing techniques. Thirdly, the related equipments on inkjet printing are shown. Finally, challenges for its future development are also discussed. The main purpose of the work is to condense the basic knowledge and highlight the challenges associated with the burgeoning and exciting field of inkjet printing for flexible electronics.

Instabilities in Amorphous Oxide Semiconductor Thin-Film Transistors

Abstract: Thin-film transistors (TFTs) fabricated using amorphous oxide semiconductors (AOS) exhibit good electron mobility (5 to >; 50 cm2/V · s), they are transparent, and they can be processed at low temperatures. These new materials show a great promise for high-performance large-area electronics applications such as flexible electronics, transparent electronics, and analog current drivers for organic light-emitting diode displays. Before any of these applications can be commercialized, however, a strong understanding of the stability and reliability of AOS TFTs is needed. The purpose of this paper is to provide a comprehensive review and summary of the recently emerging work on the stability and reliability of AOS TFTs with respect to illumination, bias stress, ambient effects, surface passivation, mechanical stress, and defects, as well as to point out areas for future work. An overview of the TFT operation and expected reliability concerns as well as a brief summary of the instabilities in the well-known Si3N4/a-Si:H system is also included.

Electrical Characterization of Screen-Printed Circuits on the Fabric

Abstract: Fabrication methods of planar printed circuits on fabrics are introduced and their electrical characteristics are measured and analyzed. Wet patterning method like screen printing as well as dry process of sputtering are used to fabricate the patterned film electrodes on various types of fabrics. The minimum width of the patterns is 0.2 mm for screen printing and 0.1 mm for gold sputtering, and the typical sheet resistance is 134 m ?/?. Fabrication methods of capacitors of 1 pF-1 nF and inductors of 500 nH-1 ?H at 10 MHz on the fabrics are also introduced. Bonding and packaging of silicon chip directly on the fabric circuit board are proposed and their mechanical properties are investigated. The ac impedance of the transmission line is measured as 201-215 ? with variation, and the time-domain reflectometry profile shows that the -3 dB frequency of the printed transmission line of 15 cm on the fabric is 80 MHz. A complete system composed of a fabric capacitor sensor input, a controller system-on-a-chip, and an LED array display is implemented on the fabric and its operation is demonstrated successfully.

Flexible electronics: Within touch of artificial skin.

Abstract: Flexible arrays of transducers can now be fabricated with pressure sensitivity and response times approaching those of natural human skin.

Scalability of Roll-to-Roll Gravure-Printed Electrodes on Plastic Foils

Abstract: Roll-to-roll (R2R) gravure printing is considered to be a leading technology for the production of flexible and low-cost printed electronics in the near future. To enable the use of R2R gravure in printed electronics, the limits of overlay printing registration accuracy (OPRA) and the scalability of printed features with respect to the physical parameters of the gravure system, including given plastic substrates and inks, should be characterized. Important parameters of printed lines include surface roughness, thickness, line widening, and line-edge roughness. To date, there are no comprehensive reports regarding the limits of OPRA and the scalability of printed electrodes, including the control of surface roughness, thickness, line widening, and line-edge roughness using R2R gravure printing. In this paper, we examine ways of evaluating the OPRA limit of our gravure system. We find that OPRA is limited in the web moving direction to 40 μm and in the perpendicular direction to 16 μm, showing the importance of web handling on registration. Furthermore, we demonstrate the scalability of printed electrodes formed using a R2R gravure system to linewidths of 317 μm, with 440 nm thickness, 30 nm of surface roughness and edge waviness of 4 μm on PET foils, and describe optimization strategies to realize improved surface roughness, thickness, line widening, and line-edge roughness for future printed electronics applications.

Flexible Temperature Sensors on Fibers

Abstract: The aim of this paper is to present research dedicated to the elaboration of novel, miniaturized flexible temperature sensors for textronic applications. Examined sensors were manufactured on a single yarn, which ensures their high flexibility and good compatibility with textiles. Stable and linear characteristics were obtained by special technological process and applied temperature profiles. As a thermo-sensitive materials the innovative polymer compositions filled with multiwalled carbon nanotubes were used. Elaborated material was adapted to printing and dip-coating techniques to produce NTC composites. Nanotube sensors were free from tensometric effect typical for other carbon-polymer sensor, and demonstrated TCR of 0.13%/K. Obtained temperature sensors, compatible with textile structure, can be applied in rapidly developing smart textiles and be used for health and protections purposes.

Flexible Resistive Switching Memory Device Based on Graphene Oxide

Abstract: A resistive switching memory device based on graphene oxide (GO) is presented. It is found that the resistive switching characteristic has a strong dependence on electrode material and GO thickness. In our experiment, an Al/GO/ITO structure with 30-nm-thick GO shows good switching performance with an on/off resistance ratio of 103, low set/reset voltage, and excellent data retention. The GO memory is also fabricated on a flexible substrate with no degradation in switching property, even when the substrate is bent down to 4-mm radius, indicating that the GO memory is an excellent candidate to be a memory device for future flexible electronics.

A Polymer-Based Capacitive Sensing Array for Normal and Shear Force Measurement

Abstract: In this work, we present the development of a polymer-based capacitive sensing array. The proposed device is capable of measuring normal and shear forces, and can be easily realized by using micromachining techniques and flexible printed circuit board (FPCB) technologies. The sensing array consists of a polydimethlysiloxane (PDMS) structure and a FPCB. Each shear sensing element comprises four capacitive sensing cells arranged in a 2 × 2 array, and each capacitive sensing cell has two sensing electrodes and a common floating electrode. The sensing electrodes as well as the metal interconnect for signal scanning are implemented on the FPCB, while the floating electrodes are patterned on the PDMS structure. This design can effectively reduce the complexity of the capacitive structures, and thus makes the device highly manufacturable. The characteristics of the devices with different dimensions were measured and discussed. A scanning circuit was also designed and implemented. The measured maximum sensitivity is 1.67%/mN. The minimum resolvable force is 26 mN measured by the scanning circuit. The capacitance distributions induced by normal and shear forces were also successfully captured by the sensing array.

12‐GHz Thin‐Film Transistors on Transferrable Silicon Nanomembranes for High‐Performance Flexible Electronics

Abstract: Multigigahertz flexible electronics are attractive and have broad applications. A gate-after-source/drain fabrication process using preselectively doped single-crystal silicon nanomembranes (SiNM) is an effective approach to realizing high device speed. However, further downscaling this approach has become difficult in lithography alignment. In this full paper, a local alignment scheme in combination with more accurate SiNM transfer measures for minimizing alignment errors is reported. By realizing 1 μm channel alignment for the SiNMs on a soft plastic substrate, thin-film transistors with a record speed of 12 GHz maximum oscillation frequency are demonstrated. These results indicate the great potential of properly processed SiNMs for high-performance flexible electronics.

Transparent Conductors from Layer-by-Layer Assembled SWNT Films: Importance of Mechanical Properties and a New Figure of Merit

Abstract: New transparent conductors (TCs) capable of replacing traditional indium tin oxide (ITO) are much needed for displays, sensors, solar cells, smart energy-saving windows, and flexible electronics. Technical requirements of TCs include not only high electrical conductivity and transparency but also environmental stability and mechanical property which are often overlooked in the research environment. Single-walled carbon nanotube (SWNT) coatings have been suggested as alternative TC materials but typically lack sufficient wear resistance compared to ITO. Balancing conductance, transparency, durability, and flexibility is a formidable challenge, which leads us to the introduction of a new TC figure of merit, ΠTC, incorporating all these qualities. Maximization of ΠTC to that of ITO or better can be suggested as an initial research goal. Fine tuning of SWNT layer-by-layer (LBL) polymeric nanocomposite structures makes possible integration of all the necessary properties. The produced TC demonstrated resistivi...

Fabricating nanowire devices on diverse substrates by simple transfer-printing methods

Abstract: The fabrication of nanowire (NW) devices on diverse substrates is necessary for applications such as flexible electronics, conformable sensors, and transparent solar cells. Although NWs have been fabricated on plastic and glass by lithographic methods, the choice of device substrates is severely limited by the lithographic process temperature and substrate properties. Here we report three new transfer-printing methods for fabricating NW devices on diverse substrates including polydimethylsiloxane, Petri dishes, Kapton tapes, thermal release tapes, and many types of adhesive tapes. These transfer-printing methods rely on the differences in adhesion to transfer NWs, metal films, and devices from weakly adhesive donor substrates to more strongly adhesive receiver substrates. Electrical characterization of fabricated NW devices shows that reliable ohmic contacts are formed between NWs and electrodes. Moreover, we demonstrated that Si NW devices fabricated by the transfer-printing methods are robust piezoresistive stress sensors and temperature sensors with reliable performance.

Parallel Array InAs Nanowire Transistors for Mechanically Bendable, Ultrahigh Frequency Electronics

Abstract: The radio frequency response of InAs nanowire array transistors on mechanically flexible substrates is characterized. For the first time, GHz device operation of nanowire arrays is demonstrated, despite the relatively long channel lengths of ∼1.5 μm used in this work. Specifically, the transistors exhibit an impressive maximum frequency of oscillation, f(max) ∼ 1.8 GHz, and a cutoff frequency, f(t) ∼ 1 GHz. The high-frequency response of the devices is due to the high saturation velocity of electrons in high-mobility InAs nanowires. The work presents a new platform for flexible, ultrahigh frequency devices with potential applications in high-performance digital and analog circuitry.