Flexural strength

About: Flexural strength is a research topic. Over the lifetime, 52123 publications have been published within this topic receiving 846504 citations. The topic is also known as: bending strength & modulus of rupture.

High-cycle fatigue and durability of polycrystalline silicon thin films in ambient air

Abstract: To evaluate the long-term durability properties of materials for microelectromechanical systems (MEMS), the stress-life ( S / N ) cyclic fatigue behavior of a 2-μm thick polycrystalline silicon film was evaluated in laboratory air using an electrostatically actuated notched cantilever beam resonator. A total of 28 specimens were tested for failure under high frequency (∼40 kHz) cyclic loads with lives ranging from about 10 s to 34 days (3×10 5 to 1.2×10 11 cycles) over fully reversed, sinusoidal stress amplitudes varying from ∼2.0 to 4.0 GPa. The thin-film polycrystalline silicon cantilever beams exhibited a time-delayed failure that was accompanied by a continuous increase in the compliance of the specimen. This apparent cyclic fatigue effect resulted in an endurance strength, at greater than 10 9 cycles, of ∼2 GPa, i.e. roughly one-half of the (single cycle) fracture strength. Based on experimental and numerical results, the fatigue process is attributed to a novel mechanism involving the environmentally-assisted cracking of the surface oxide film (termed reaction-layer fatigue). These results provide the most comprehensive, high-cycle, endurance data for designers of polysilicon micromechanical components available to date.

Mechanical properties of ZrB2- and HfB2-based ultra-high temperature ceramics fabricated by spark plasma sintering

Abstract: Flexural strengths at room temperature, at 1400 °C in air and at room temperature after 1 h oxidation at 1400 °C were determined for ZrB 2 - and HfB 2 -based ultra-high temperature ceramics (UHTCs). Defects caused by electrical discharge machining (EDM) lowered measured strengths significantly and were used to calculate fracture toughness via a fracture mechanics approach. ZrB 2 with 20 vol.% SiC had room temperature strength of 700 ± 90 MPa, fracture toughness of 6.4 ± 0.6 MPa, Vickers hardness at 9.8 N load of 21.1 ± 0.6 GPa, 1400 °C strength of 400 ± 30 MPa and room temperature strength after 1 h oxidation at 1400 °C of 678 ± 15 MPa with an oxide layer thickness of 45 ± 5 μm. HfB 2 with 20 vol.% SiC showed room temperature strength of 620 ± 50 MPa, fracture toughness of 5.0 ± 0.4 MPa, Vickers hardness at 9.8 N load of 27.0 ± 0.6 GPa, 1400 °C strength of 590 ± 150 MPa and room temperature strength after 1 h oxidation at 1400 °C of 660 ± 25 MPa with an oxide layer thickness of 12 ± 1 μm. 2 wt.% La 2 O 3 addition to UHTCs slightly reduced mechanical performance while increasing tolerance to property degradation after oxidation and effectively aided internal stress relaxation during spark plasma sintering (SPS) cooling, as quantified by X-ray diffraction (XRD). Slow crack growth was suggested as the failure mechanism at high temperatures as a consequence of sharp cracks formation during oxidation.