Floorplan

About: Floorplan is a research topic. Over the lifetime, 1828 publications have been published within this topic receiving 28981 citations.

Combinatorial Algorithms for Integrated Circuit Layout

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VLSI module placement based on rectangle-packing by the sequence-pair

Abstract: The earliest and the most critical stage in VLSI layout design is the placement. The background is the rectangle packing problem: given a set of rectangular modules of arbitrary sizes, place them without overlap on a plane within a rectangle of minimum area. Since the variety of the packing is uncountably infinite, the key issue for successful optimization is the introduction of a finite solution space which includes an optimal solution. This paper proposes such a solution space where each packing is represented by a pair of module name sequences, called a sequence-pair. Searching this space by simulated annealing, hundreds of modules have been packed efficiently as demonstrated. For applications to VLSI layout, we attack the biggest MCNC benchmark ami49 with a conventional wiring area estimation method, and obtain a highly promising placement.

A New Algorithm for Floorplan Design

Abstract: We present in this paper a new algorithm for floorplan design using the method of simulated annealing. The major contributions of the paper are: 1. A new representation of floorplans (normalized Polish expressions) which enables us to carry out the neighborhood search effectively. 2. A simultaneous minimization of area and total interconnection length in the final solution. Experimental results indicate that the algorithm performs well in many test problems.

B*-Trees: a new representation for non-slicing floorplans

Abstract: We present in this paper an efficient, flexible, and effective data structure, B*-trees for non-slicing floorplans. B*-trees are based on ordered binary trees and the admissible placement presented in [1]. Inheriting from the nice properties of ordered binary trees, B*-trees are very easy for implementation and can perform the respective primitive tree, operations search, insertion, and deletion in only O(1), O(1), and O(n) times while existing representations for non-slicing floorplans need at least O(n) time for each of these operations, where n is the number of modules. The correspondence between an admissible placement and its induced B*-tree is 1-to-1 (i.e., no redundancy); further, the transformation between them takes only linear time. Unlike other representations for non-slicing floorplans that need to construct constraint graphs for cost evaluation, in particular, the evaluation can be performed on B*-trees and their corresponding placements directly and incrementally. We further show the flexibility of B*-trees by exploring how to handle rotated, pre-placed, soft, and rectilinear modules. Experimental results on MCNC benchmarks show that the B*-tree representation runs about 4.5 times faster, consumes about 60% less memory, and results in smaller silicon area than the O-tree one [1]. We also develop a B*-tree based simulated annealing scheme for floorplan design; the scheme achieves near optimum area utilization even for rectilinear modules.

A thermal-driven floorplanning algorithm for 3D ICs

Abstract: As the technology progresses, interconnect delays have become bottlenecks of chip performance. 3D integrated circuits are proposed as one way to address this problem. However, thermal problem is a critical challenge for 3D IC circuit design. We propose a thermal-driven 3D floorplanning algorithm. Our contributions include: (1) a new 3D floorplan representation, CBA and new interlayer local operations to more efficiently exploit the solution space; (2) an efficient thermal-driven 3D floorplanning algorithm with an integrated compact resistive network thermal model (CBA-T); (3) two fast thermal-driven 3D floorplanning algorithms using two different thermal models with different runtime and quality (CBA-T-Fast and CBA-T-Hybrid). Our experiments show that the proposed 3D floorplan algorithm with CBA representation can reduce the wirelength by 29% compared with a recent published result from (Hsiu et al., 2004). In addition, compared to a nonthermal-driven 3D floorplanning algorithm, the thermal-driven 3D floorplanning algorithm can reduce the maximum on-chip temperature by 56%.