Topic

# Floorplan

About: Floorplan is a research topic. Over the lifetime, 1828 publications have been published within this topic receiving 28981 citations.

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07 Sep 1990TL;DR: This paper will concern you to try reading combinatorial algorithms for integrated circuit layout as one of the reading material to finish quickly.

Abstract: Feel lonely? What about reading books? Book is one of the greatest friends to accompany while in your lonely time. When you have no friends and activities somewhere and sometimes, reading book can be a great choice. This is not only for spending the time, it will increase the knowledge. Of course the b=benefits to take will relate to what kind of book that you are reading. And now, we will concern you to try reading combinatorial algorithms for integrated circuit layout as one of the reading material to finish quickly.

1,069 citations

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TL;DR: This paper attacks the biggest MCNC benchmark ami49 with a conventional wiring area estimation method, and obtain a highly promising placement, and proposes a solution space where each packing is represented by a pair of module name sequences, called a sequence-pair.

Abstract: The earliest and the most critical stage in VLSI layout design is the placement. The background is the rectangle packing problem: given a set of rectangular modules of arbitrary sizes, place them without overlap on a plane within a rectangle of minimum area. Since the variety of the packing is uncountably infinite, the key issue for successful optimization is the introduction of a finite solution space which includes an optimal solution. This paper proposes such a solution space where each packing is represented by a pair of module name sequences, called a sequence-pair. Searching this space by simulated annealing, hundreds of modules have been packed efficiently as demonstrated. For applications to VLSI layout, we attack the biggest MCNC benchmark ami49 with a conventional wiring area estimation method, and obtain a highly promising placement.

687 citations

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02 Jul 1986TL;DR: A new algorithm for floorplan design using the method of simulated annealing to carry out the neighborhood search effectively and achieves a simultaneous minimization of area and total interconnection length in the final solution.

Abstract: We present in this paper a new algorithm for floorplan design using the method of simulated annealing. The major contributions of the paper are: 1. A new representation of floorplans (normalized Polish expressions) which enables us to carry out the neighborhood search effectively. 2. A simultaneous minimization of area and total interconnection length in the final solution. Experimental results indicate that the algorithm performs well in many test problems.

533 citations

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01 Jun 2000TL;DR: An efficient, flexible, and effective data structure, B-trees for non-slicing floorplans, based on ordered binary trees and the admissible placement presented in [1], and a B-tree based simulated annealing scheme for floorplan design.

Abstract: We present in this paper an efficient, flexible, and effective data structure, B*-trees for non-slicing floorplans. B*-trees are based on ordered binary trees and the admissible placement presented in [1]. Inheriting from the nice properties of ordered binary trees, B*-trees are very easy for implementation and can perform the respective primitive tree, operations search, insertion, and deletion in only O(1), O(1), and O(n) times while existing representations for non-slicing floorplans need at least O(n) time for each of these operations, where n is the number of modules. The correspondence between an admissible placement and its induced B*-tree is 1-to-1 (i.e., no redundancy); further, the transformation between them takes only linear time. Unlike other representations for non-slicing floorplans that need to construct constraint graphs for cost evaluation, in particular, the evaluation can be performed on B*-trees and their corresponding placements directly and incrementally. We further show the flexibility of B*-trees by exploring how to handle rotated, pre-placed, soft, and rectilinear modules. Experimental results on MCNC benchmarks show that the B*-tree representation runs about 4.5 times faster, consumes about 60% less memory, and results in smaller silicon area than the O-tree one [1]. We also develop a B*-tree based simulated annealing scheme for floorplan design; the scheme achieves near optimum area utilization even for rectilinear modules.

506 citations

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07 Nov 2004TL;DR: A thermal-driven 3D floorplanning algorithm with CBA representation that can reduce the wirelength by 29% and reduce the maximum on-chip temperature by 56% is proposed.

Abstract: As the technology progresses, interconnect delays have become bottlenecks of chip performance. 3D integrated circuits are proposed as one way to address this problem. However, thermal problem is a critical challenge for 3D IC circuit design. We propose a thermal-driven 3D floorplanning algorithm. Our contributions include: (1) a new 3D floorplan representation, CBA and new interlayer local operations to more efficiently exploit the solution space; (2) an efficient thermal-driven 3D floorplanning algorithm with an integrated compact resistive network thermal model (CBA-T); (3) two fast thermal-driven 3D floorplanning algorithms using two different thermal models with different runtime and quality (CBA-T-Fast and CBA-T-Hybrid). Our experiments show that the proposed 3D floorplan algorithm with CBA representation can reduce the wirelength by 29% compared with a recent published result from (Hsiu et al., 2004). In addition, compared to a nonthermal-driven 3D floorplanning algorithm, the thermal-driven 3D floorplanning algorithm can reduce the maximum on-chip temperature by 56%.

416 citations