Focused ion beam

About: Focused ion beam is a research topic. Over the lifetime, 12154 publications have been published within this topic receiving 179523 citations. The topic is also known as: FIB.

Focused-ion-beam deposition for 3-D nanostructure fabrication

Abstract: Three-dimensional nanostructure fabrication has been demonstrated by 30 keV Ga + focused-ion-beam chemical-vapor-deposition (FIB-CVD) using a phenanthrene (C 14 H 10 ) source as a precursor. Microstructure plastic arts is advocated as a new field using micro-beam technology, presenting one example of micro-wine-glass with 2.75 μm external diameter and 12 μm height. The deposition film is a diamond like amorphous carbon. A large Young’s modulus that exceeds 600 GPa seems to present great possibilities for various applications. Producing of three-dimensional nanostructure is discussed. Micro-coil, nanoelectrostatic actuator and nano-space-wiring with 0.1 μm dimension are demonstrated as parts of nanomechanical system. Furthermore, filtering tool is also fabricated as a novel nano-tool for the manipulation and analysis of subcellular organelles.

Nanofabrication with a helium ion microscope

Abstract: The recently introduced helium ion microscope (HIM) is capable of imaging and fabrication of nanostructures thanks to its sub-nanometer sized ion probe [1,2]. The unique interaction of the helium ions with the sample material provides very localized secondary electron emission, thus providing a valuable signal for high-resolution imaging as well as a mechanism for very precise nanofabrication [3]. The low proximity effects, due to the low yield of backscattered ions and the confinement of the forward scattered ions into a narrow cone, enable patterning of ultra-dense sub-10 nm structures. This paper presents various nanofabrication results obtained with direct-write, with scanning helium ion beam lithography, and with helium ion beam induced deposition.

Batch Fabrication of Metasurface Holograms Enabled by Plasmonic Cavity Lithography

Abstract: Metasurface holograms consisting of nanostructures have shown great promise for various applications due to their unique capability of shaping light. Usually, they are fabricated by point-by-point scanning method, such as focused ion beam and electron beam lithography, which would greatly hamper their applications due to the high cost and low yield. In this work, plasmonic cavity lithography is proposed to fabricate metasurface holograms. The lithography system consists of Cr mask and plasmonic cavity that compose of 20 nm Ag/30 nm photoresist/50 nm Ag, where an air separation layer exists between them to avoid contamination and damage of mask patterns. The simulated results show that the cavity can effectively amplify the evanescent waves and modulate the electric field components on imaging plane, resulting in greatly improved resolution and fidelity compared to near field and superlens lithography. In experiments, the Au metaholograms are fabricated by the proposed lithography method and following etching processes. Furthermore, the designed holographic image of character “E” is successfully observed with the fabricated hologram. This approach is believed to open up a batch fabrication way for reproducing many copies of a metasurface hologram.

Multi-source plasma focused ion beam system

Abstract: The present invention provides a plasma ion beam system that includes multiple gas sources and that can be used for performing multiple operations using different ion species to create or alter submicron features of a work piece. The system preferably uses an inductively coupled, magnetically enhanced ion beam source, suitable in conjunction with probe-forming optics sources to produce ion beams of a wide variety of ions without substantial kinetic energy oscillations induced by the source, thereby permitting formation of a high resolution beam.

Detailed investigation of ultrasonic Al-Cu wire-bonds: I. Intermetallic formation in the as-bonded state

Abstract: Scanning and transmission electron microscopy were used to study intermetallic formation and the interface morphology in copper wire-bonds. The ends of copper wires were melted in air and in a protective environment to form wire-balls. The protective environment enabled formation of symmetrical and relatively defect-free copper balls, together with a smaller heat affected zone (in comparison with wires melted in air). Detailed morphological and compositional characterization of the Al–Cu as-bonded interface was conducted using scanning and transmission electron microscopy, on specimens prepared by focused ion beam milling. Discontinuous and non-uniform intermetallics were found in regions where high localized stress was introduced during the wire-bonding process. The main intermetallic phase was found to be Al2Cu.