Topic
Fractography
About: Fractography is a research topic. Over the lifetime, 5043 publications have been published within this topic receiving 86068 citations.
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TL;DR: Fracture toughness and tension tests were performed on two aluminum alloy matrices, 2014-O and 2024-O reinforced with alumina particulates of different volume fractions and particulate sizes.
237 citations
15 Oct 2003-Materials Science and Engineering A-structural Materials Properties Microstructure and Processing
TL;DR: In this paper, the adhesive strength and shear strength of the solder joints of an as-soldered lead-free solder system with pure copper wires were investigated. And the authors determined how these characteristics, and the relationships between them, are influenced by the storage duration and the storage temperature.
Abstract: This paper studies the solder joints of an Sn–Ag lead-free solder system with pure copper wires. The study focuses upon the interrelationships, which exist between the adhesive strength of the joint, its shear strength, the formation of interfacial intermetallic compounds (IMC) and the fractographic morphology. Additionally, the paper determines how these characteristics, and the relationships between them, are influenced by the storage duration and the storage temperature. Experimental results show that both the adhesive strength and the shear strength of the solder joints decrease significantly following short-term thermal storage. As the storage time is increased, it is noted that both the thickness and the roughness of the interfacial IMC layers increase. Regarding the fracture of the solder joints, fractographic observation reveals that fracture morphology under adhesive loading are similar to those observed under shear loading conditions. In the as-soldered condition, the fracture surface appears to be flat, and some broken Cu6Sn5 and residual solder pieces are evident. When the total thickness of the IMC layer lies within the range 1–10 μm, it is observed that the fracture morphology gradually becomes a dimple-like structure. This phenomenon may be attributed to the residual stresses caused by phase transformation, and by the increasing roughness of the IMC layers which causes an increase in the stress concentration within the Cu6Sn5 layer, and which ultimately results in fracturing of this layer. When the total thickness of the interfacial IMC layers exceeds 10 μm, the roughness of the IMC layers and the residual stress between them and the solder both continue to increase. Eventually this results in a fracture being initiated and propagated within the Cu6Sn5 layer. Fractographic observation shows the fracture to have a cleavage-like morphology.
230 citations
TL;DR: In this paper, the authors studied how temperature, from the ambient temperature to 900°C, affects the mechanical properties of Al 0.5 CoCrCuFeNi alloys in different wrought states.
229 citations
TL;DR: In this article, the effects of changes in the notch root radius from 250 m to a fatigue precrack on the fracture toughness of a bulk amorphous glass were determined, and it was shown that the average toughness obtained from 6 fatigue precracked specimens was 18.4 {+-} 1.4 MPa {radical}m, while the notch toughness obtained on specimens with notch root radii ranging from 65 microm-250 microm were in the range of 101--131 MPa{ radical}m.
226 citations
TL;DR: In this article, the authors reviewed the characteristics of tempered martensite embrittlement (TME), hydrogen embrittlements (HE), and stress corrosion cracking (SCC) in high-strength steels and found that the most useful tool for determining which of these mechanisms is responsible for a failure, under similar conditions, of structures made of AISI 4340 alloy steel.
224 citations